Patents Assigned to Dongbu HiTek Ltd., Co.
  • Apparatus for coating a photoresist layer
    Patent number: 7681519
    Abstract: Embodiments relate to an apparatus for coating a photoresist layer and a photolithography method using the apparatus. In embodiments, the apparatus may include a rotatable wafer support for supporting a wafer to be coated with a photoresist layer, a beam nozzle for performing WEE (Wafer Edge Exposure) with respect to a photoresist layer at an edge of the wafer on the wafer support, and a spray nozzle for spraying an alkali solution onto an edge of the wafer exposed through the beam nozzle.
    Type: Grant
    Filed: December 19, 2006
    Date of Patent: March 23, 2010
    Assignee: Dongbu HiTek Ltd., Co.
    Inventor: Chang Young Hong
  • Method of fabricating semiconductor device
    Patent number: 7682969
    Abstract: A method of forming a semiconductor device that includes heating a wafer on which an Al—Cu sputtering thin film is formed before patterning the Al—Cu sputtering thin film. The heating is performed at a temperature no less than a solid solution temperature of copper or at a temperature between 300° C. and 600° C. The process temperature in heating the process wafer is not higher than the flow temperature of aluminum or is the temperature at which a reflow process can be performed.
    Type: Grant
    Filed: July 9, 2008
    Date of Patent: March 23, 2010
    Assignee: Dongbu HiTek Ltd., Co.
    Inventors: Kyeong-Sik Lee, Joog-Guk Kim