Abstract: A metal oxide varistor (MOV) includes an MOV body, a first electrode, a second electrode, and a thermal cut-off insulation shell. The MOV body is a crystalline microstructure with zinc oxide mixed with one or more other metal oxides. The first electrode is adjacent one side of the MOV body and is connected to a first radial lead. The second electrode is adjacent a second side of the MOV body and is connected to a second radial lead having a curved portion. The thermal cut-off insulation shell is adjacent the second electrode and has a protrusion, with the curved portion of the second radial lead being adjacent the protrusion.

Abstract: A metal oxide varistor (MOV) includes an MOV body, a first electrode, a second electrode, and a thermal cut-off (TCO). The MOV body is a crystalline microstructure with zinc oxide mixed with one or more metal oxides. The first electrode is adjacent a first side of the MOV body and is connected to a first radial lead. The second electrode is adjacent a second side of the MOV body and is connected to a second radial lead. The TCO is adjacent the second electrode and consists of solder paste with at least one core. The at least one core is a solid at a first temperature and a liquid at a second temperature.

Abstract: A resistance heater may include a polymer positive temperature coefficient (PPTC) material, arranged in a PPTC body defining a heater main surface. The PPTC material may include a polymer matrix, the polymer matrix defining the PPTC body, and a graphene filler component, disposed in the polymer matrix. The resistance heater may include an electrode assembly, comprising a first electrode and a second electrode arranged in contact with the heater body at two or more locations, a first lead, connected to the first electrode, and a second lead, connected to the second electrode. As such, the electrode assembly may define a current path between the first lead and the second lead, the current path comprising a first portion, extending along the heater main surface, and a second portion, extending through the heater body.

Abstract: Thermal Cut-Off (TCO) devices suitable for surface mount reflow processes are disclosed. The TCO devices are modeled after existing lead attached TCO device structures, but are improved with compact and miniaturized structures suitable for surface mount reflow operations. The arm and base terminals include pads for surface mount reflow. The base molds are designed for receiving the PTC device, bimetal device, and arm terminal feature and may operate using either a single base terminal or a multi-part base terminal. Multiple cover designs are disclosed to lower the heat capacity of the upper plate of the TCO device relative to the base terminal. A TCO device featuring an integrated arm and bimetal device terminal is also disclosed, with an updated base portion to support the integrated terminal.

Abstract: The present invention relates to a polymer voltage-dependent resistor (PVDR) in various physical forms and methods for manufacturing the varistor. The body of the PVDR is composed of a polymer matrix having a filler composed of doped zinc oxide particles, other semi conductive particles or metal particles uniformly distributed therein. Conductive electrodes may be affixed to the polymer matrix and electrical leads attached to the electrodes.

Abstract: A surge protection device includes a metal terminal and a spring. The metal terminal is located between two metal oxide varistors, where the metal terminal extends beyond the metal oxide varistors. The spring has a flat surface that is connected to the metal terminal using a soldering paste. The flat surface has a bend on one end which forms a gap between the flat surface and the metal terminal.

Abstract: A thermally protected metal oxide varistor includes a body, a first electrode, a thermal fuse, and a glue. The body is made up of a crystalline microstructure including zinc oxide mixed with one or more other metal oxides. The first electrode is located on one side of the body and is connected to a first lead wire. The thermal fuse is connected between the first electrode and the first lead wire. The glue is to be deposited over the thermal fuse as well as over a top portion of the first lead wire.

Abstract: The present invention relates to a polymer voltage-dependent resistor (PVDR) in various physical forms and methods for manufacturing the varistor. The body of the PVDR is composed of a polymer matrix having a filler composed of doped zinc oxide particles, other semi conductive particles or metal particles uniformly distributed therein. Conductive electrodes may be affixed to the polymer matrix and electrical leads attached to the electrodes.

Abstract: A flat spring (100) is disclosed, for use in a surge protection device (SPD) such as a fast activation thermal fuse, to be integrated with a thermal metal oxide varistor (TMOV). The flat spring (100) has a V-shaped protrusion (110) to enable ultra-high short circuit current protection under overvoltage condition.

Abstract: The present invention relates to a polymer voltage-dependent resistor (PVDR) in various physical forms and methods for manufacturing the varistor. The body of the PVDR is composed of a polymer matrix having a filler composed of doped zinc oxide particles, other semi conductive particles or metal particles uniformly distributed therein. Conductive electrodes may be affixed to the polymer matrix and electrical leads attached to the electrodes.

Abstract: Disclosed are various pallet assemblies for arc spray applications. In some embodiments, an assembly may include a top frame comprising a plurality of recesses each operable to receive an electronic device, and a bottom frame coupled to the top frame, wherein the bottom frame comprises a plurality of support structures, and wherein each support structure of the plurality of support structures is aligned with a corresponding recess of the plurality of recesses. The assembly may further include a mechanical device coupled to the top frame and the bottom frame, wherein the mechanical device is operable to bias the top frame and the bottom frame relative to one another.

Abstract: A spray coating protection method for electronic devices during metallic particle deposition via spraying is disclosed. The spray coating protection method enables selectivity over the size and location of particle deposition. The spray coating protection method is easy for an automation application, in which multiple electronic devices are processed simultaneously, and is suitable for electronic devices of different shapes and sizes. The spray coating protection method provides resistance to high temperature and high pressure during the spraying operation. The spray coating protection method utilizes masking paper, but additional film materials may be used, both to increase the protective strength of the mask and to enable easy placement and subsequent peel off of the masking paper following the spraying process. The masking paper may be made using a die cutting process and is easily placed onto the electronic device surface to ensure zero contamination from hot and high pressure spray particles.

Abstract: Provided herein are thermally protected varistor (TPV) devices including a varistor body and a terminal assembly directly coupled together. The terminal assembly may include a housing, wherein an opening is provided in a base of the housing. A lead is coupleable with the varistor body via a thermal linking material positioned within the opening of the base, the thermal linking material operable to maintain direct physical contact with the lead when the thermal linking material is below a melting point. The terminal assembly may further include a shield slidable within the housing between a first position and a second position, wherein in the first position the shield is positioned adjacent the thermal linking material, and in the second position the shield is positioned between the lead and the second side of the varistor body. The shield includes a tab for releasably coupling the shield to the housing.

Abstract: A metal oxide varistor (MOV) device including a MOV chip having first and second electrodes disposed on opposing side thereof, a first lead frame portion including a first contact tab electrically connected to the first electrode and a first lead contiguous with the first contact tab and extending away from the MOV chip, a second lead frame portion including a second contact tab electrically connected to the second electrode and a second lead contiguous with the second contact tab and extending away from the MOV chip, and a device body encasing the MOV chip, the first contact tab, the second contact tab, and portions of the first and second leads, wherein the first and second leads extend out of the device body and are bent into flat abutment with a bottom surface of the device body.

Abstract: Provided herein are thermally protected varistor (TPV) devices including a varistor body and a terminal assembly directly coupled together. The terminal assembly may include a housing, wherein an opening is provided in a base of the housing. A lead is coupleable with the varistor body via a thermal linking material positioned within the opening of the base, the thermal linking material operable to maintain direct physical contact with the lead when the thermal linking material is below a melting point. The terminal assembly may further include a shield slidable within the housing between a first position and a second position, wherein in the first position the shield is positioned adjacent the thermal linking material, and in the second position the shield is positioned between the lead and the second side of the varistor body. The shield includes a tab for releasably coupling the shield to the housing.

Abstract: Provided herein are protection devices having a tubular ceramic part and a tubular metal oxide varistor (MOV) electrically coupled in series or parallel. In some embodiments, the tubular ceramic part is connected between a first electrode and a second electrode, and the tubular MOV is connected between the second electrode and a third electrode. In some embodiments, the tubular ceramic part and the tubular MOV have a same or similar shape and/or outer circumference. The protection device further includes an enclosure surrounding the tubular ceramic part and the tubular MOV, wherein the first electrode, the second electrode, and the third electrode each have leads extending outside the enclosure. In some embodiments, the tubular MOV includes a central cavity aligned with a central cavity of the tubular ceramic part, wherein the central cavity of the tubular MOV MOV and the central cavity of the tubular ceramic part contain an inert gas.

Abstract: Structurally supported electrical transient materials are disclosed. Furthermore, methods to provide structurally supported electrical transient materials are disclosed. In one implementation, a structurally supported electrical transient material includes a support structure that is at least partially covered by an electrical transient material. In one example, the support structure is a mesh material integrated at least partially in the electrical transient material.

Abstract: A MOV device including a MOV chip, a first base metal electrode disposed on a first side of the MOV chip, and a second base metal electrode disposed on a second side of the MOV chip opposite the first side, each of the first base metal electrode and the second base metal electrode including a first base metal electrode layer disposed on a surface of the MOV chip and formed of one of silver, copper, and aluminum, the first base metal electrode layer having a thickness in a range of 2-200 micrometers, and a second base metal electrode layer disposed on a surface of the first base metal electrode layer and formed of one of silver, copper, and aluminum, the second base metal electrode layer having a thickness in a range of 2-200 micrometers.

Abstract: A MOV device including a MOV chip, a first base metal electrode disposed on a first side of the MOV chip, and a second base metal electrode disposed on a second side of the MOV chip opposite the first side, each of the first base metal electrode and the second base metal electrode including a first base metal electrode layer disposed on a surface of the MOV chip and formed of one of silver, copper, and aluminum, the first base metal electrode layer having a thickness in a range of 2-200 micrometers, and a second base metal electrode layer disposed on a surface of the first base metal electrode layer and formed of one of silver, copper, and aluminum, the second base metal electrode layer having a thickness in a range of 2-200 micrometers.

Abstract: A MOV device including a MOV chip, a first base metal electrode disposed on a first side of the MOV chip, and a second base metal electrode disposed on a second side of the MOV chip opposite the first side, each of the first base metal electrode and the second base metal electrode including a first base metal electrode layer disposed on a surface of the MOV chip and formed of one of silver, copper, and aluminum, the first base metal electrode layer having a thickness in a range of 2-200 micrometers, and a second base metal electrode layer disposed on a surface of the first base metal electrode layer and formed of one of silver, copper, and aluminum, the second base metal electrode layer having a thickness in a range of 2-200 micrometers.