Patents Assigned to Dongguan Nystein Electronic Materials Co., LTD.
  • Single-component low hardness conductive adhesive and methods of manufacture and use thereof
    Patent number: 10106709
    Abstract: A single-component conductive adhesive with low hardness, and method of manufacture and use are provided. The conductive adhesive may include a resin composition, an organic solvent and nickel-coated graphite powder. The weight ratio of the resin composition to nickel-coated graphite powder may be 20%:80% or 40%:60%. The weight of the organic solvent may be 20-40% the weight of the resin composition. The resin composition may include 20-40% by weight of vinyl-terminated polydimethylsiloxane (PDMS), 5-15% by weight of H—Si polysiloxane oil, 0.05-0.15% by weight of polymerization inhibitor, and 0.1-1% by weight of encapsulated platinum complex.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: October 23, 2018
    Assignee: Dongguan Nystein Electronic Materials Co., LTD.
    Inventor: Hongyang Liu
  • SINGLE-COMPONENT LOW HARDNESS CONDUCTIVE ADHESIVE AND METHODS OF MANUFACTURE AND USE THEREOF
    Publication number: 20180022969
    Abstract: A single-component conductive adhesive with low hardness, and method of manufacture and use are provided. The conductive adhesive may include a resin composition, an organic solvent and nickel-coated graphite powder. The weight ratio of the resin composition to nickel-coated graphite powder may be 20%: 80% or 40%: 60%. The weight of the organic solvent may be 20-40% the weight of the resin composition. The resin composition may include 20-40% by weight of vinyl-terminated polydimethylsiloxane (PDMS), 5-15% by weight of H-Si polysiloxane oil, 0.05-0.15% by weight of polymerization inhibitor, and 0.1-1% by weight of encapsulated platinum complex.
    Type: Application
    Filed: June 9, 2017
    Publication date: January 25, 2018
    Applicant: Dongguan Nystein Electronic Materials Co., LTD.
    Inventor: Hongyang Liu