Patents Assigned to DONGWON SYSTEMS CORPORATION
  • Patent number: 11794971
    Abstract: A laminated film for an eco-friendly packaging material, according to one embodiment, comprises: a paper layer for blocking oxygen and moisture; and a film layer that can be biodegraded or biologically disintegrated by means of at least one from among microorganisms, moisture, oxygen, light and heat, wherein the oxygen transmission rate of the laminated film can be 0.01-1 cc/m2 per day, and the moisture transmission rate thereof can be 0.01-1 cc/m2 per day.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: October 24, 2023
    Assignee: DONGWON SYSTEMS CORPORATION
    Inventors: Ki Ho Park, Jin Seok Choi, Ji Hun Kim
  • Publication number: 20220161980
    Abstract: A laminated film for an eco-friendly packaging material, according to one embodiment, comprises: a paper layer for blocking oxygen and moisture; and a film layer that can be biodegraded or biologically disintegrated by means of at least one from among microorganisms, moisture, oxygen, light and heat, wherein the oxygen transmission rate of the laminated film can be 0.01-1 cc/m2 per day, and the moisture transmission rate thereof can be 0.01-1 cc/m2 per day.
    Type: Application
    Filed: April 7, 2020
    Publication date: May 26, 2022
    Applicant: DONGWON SYSTEMS CORPORATION
    Inventors: Ki Ho Park, Jin Seok Choi, Ji Hun Kim
  • Patent number: 11279538
    Abstract: The example embodiments relate to a lid packing material for food container, and a lid packing material for food container according to an aspect of the example embodiments includes: a substrate layer; and a heat-adhesion layer formed on the substrate layer, wherein the heat-adhesion layer includes at least two types of wax having different melting points.
    Type: Grant
    Filed: December 31, 2020
    Date of Patent: March 22, 2022
    Assignee: DONGWON SYSTEMS CORPORATION
    Inventors: Jin Seok Choi, Sung Ji Choi
  • Publication number: 20210323286
    Abstract: Disclosed is an eco-friendly packaging. The eco-friendly packaging with an accommodation space is formed by bonding multilayer films, and the multilayer films each include a first layer including a base layer including oriented polypropylene, and a coating layer applied to the outer surface of the base layer by coating, and a second layer laminated on the inner surface of the base layer, the second layer including cast polypropylene.
    Type: Application
    Filed: March 4, 2021
    Publication date: October 21, 2021
    Applicant: DONGWON SYSTEMS CORPORATION
    Inventors: Sung Ji Choi, Jin Seok Choi, Do Yeon Kim
  • Publication number: 20210316538
    Abstract: Disclosed are an eco-friendly container label and a method of manufacturing an eco-friendly container. The eco-friendly container label to be attached to a disposable container includes a first layer including a print layer, and a barrier layer stacked on one side of the print layer, a second layer including an adhesive layer formed of the same material as the print layer, the adhesive layer to be stacked on the surface of the disposable container, and an intermediate base layer stacked between the first layer and the second layer and configured to bond the adhesive layer and the print layer.
    Type: Application
    Filed: March 4, 2021
    Publication date: October 14, 2021
    Applicant: DONGWON SYSTEMS CORPORATION
    Inventors: Sung Ji Choi, Jin Seok Choi
  • Patent number: 8866538
    Abstract: The present inventive concept is a hyuntak transistor that can prevent a thermal runaway phenomenon and a low heat high efficiency constant current circuit using an auxiliary transistor capable of a high amplification and a constant current. The circuit may be applied to drive a LED and a motor.
    Type: Grant
    Filed: January 12, 2012
    Date of Patent: October 21, 2014
    Assignees: Electronics and Telecommunications Research Institute, Dongwon Systems Corporation
    Inventors: Hyun-Tak Kim, Bongjun Kim, Sun Shin Kwag, Jun Sik Kim
  • Publication number: 20130278327
    Abstract: The present inventive concept is a hyuntak transistor that can prevent a thermal runaway phenomenon and a low heat high efficiency constant current circuit using an auxiliary transistor capable of a high amplification and a constant current. The circuit may be applied to drive a LED and a motor.
    Type: Application
    Filed: January 12, 2012
    Publication date: October 24, 2013
    Applicant: DONGWON SYSTEMS CORPORATION
    Inventors: Hyun-Tak Kim, Bongjun Kim, Sun Shin Kwag, Jun Sik Kim