Abstract: A package board according to an embodiment of the present disclosure includes a first core layer, a feeding wiring disposed on the first core layer, and a first connector mounted on the first core layer and electrically connected to the feeding wiring through a row directional side thereof. The feeding wiring includes a first portion extending in a column direction of the first core layer and a second portion bent from the first portion to extend in a row direction of the first core layer.

Abstract: An antenna package according to an embodiment includes antenna units, and a circuit board electrically connected to the antenna units. The circuit board includes a core layer, antenna feeding lines distributed on a surface of the core layer and connected to the antenna units, power/data lines distributed on the surface of the core layer, power/data ports connected to end portions of the power/data lines, and antenna feeding ports connected to end portions of the antenna feeding lines and arranged to be closer to the antenna units than the power/data ports.

Abstract: An antenna package according to an embodiment includes an antenna device and a flexible circuit board. The antenna device includes a dielectric layer, a first antenna unit arranged on the dielectric layer and a second antenna unit arranged on the dielectric layer to be physically and electrically separated from the first antenna unit. The printed circuit board is coupled to the antenna device to be electrically connected to the first antenna unit, and electrically separated from the second antenna unit.

Abstract: An antenna package according to an exemplary embodiment includes an antenna unit, a printed circuit board including an antenna connection wiring electrically connected to the antenna unit, an antenna driving integrated circuit (IC) chip mounted on the printed circuit board and connected to the antenna connection wiring, and a touch sensor driving IC chip and a display driving IC chip mounted on the printed circuit board together with the antenna driving IC chip. The driving IC chips are integrated in a single printed circuit board to improve spatial and process efficiency.

Abstract: A touch sensor according to an embodiment includes a transparent substrate layer having an active region and an inactive region, and a conductive pattern formed on the active region and including a stacked structure of a metal layer and a blackened layer. A color difference defined by Equation 1 is 10 or less.

Abstract: An antenna device according to an embodiment of the present invention includes a dielectric layer, a first radiator disposed on the dielectric layer in a first direction, a second radiator formed in a shape different from that of the first radiator and disposed on the dielectric layer in a second direction, a first transmission line which extends in the first direction to be connected to the first radiator, and a second transmission line which extends in the second direction to be connected to the second radiator, and intersects the first transmission line with being physically or electrically spaced apart therefrom.

Abstract: An apparatus for inspecting an antenna includes a stage including a ground on which an antenna device is disposed, an inspection board configured to be in contact with and connected to the antenna device, a connection maintaining unit for maintaining a contact and connection between the antenna device and the inspection board, and an inspection unit mounted or connected to the inspection board to inspect the antenna device.

Abstract: An antenna device according to an embodiment includes a dielectric layer, a rhombus-shaped first radiator disposed on an upper surface of the dielectric layer, a transmission line connected to the first radiator, a signal pad connected to one end of the transmission line, ground pads disposed around the signal pad, and second radiators extending from the ground pad along lower sides of the first radiator.

Abstract: An antenna package includes an antenna device including an antenna dielectric layer and an antenna unit formed on the antenna dielectric layer, and an intermediate circuit board electrically connected to the antenna unit. The intermediate circuit board includes a core layer and a signal line formed on a surface of the core layer and electrically connected to the antenna unit. A width of one end portion of the signal line connected to the antenna unit is smaller than a width of the other end portion opposite to the one end portion of the signal line. Impedance mismatching is prevented by the construction of the signal line to improve antenna properties.

Abstract: A connector structure according to an embodiment of the present disclosure includes a second connector and a first connector coupled to the second connector. The first connector includes a first insulator, a first conductive connection terminal disposed on the first insulator, a second conductive connection terminal spaced apart from the first conductive connection terminal to form a single row structure on the first insulator together with the first conductive connection terminal, and a first barrier structure disposed between the first conductive connection terminal and the second conductive connection terminal on the first insulator.

Abstract: A flow nanoparticle measurement device according to an embodiment of the present disclosure includes a flow cell in which a liquid sample flows, a first laser beam being irradiated to the flow cell; a laser generator configured to generate the first laser beam; and a flow controller configured to control a flow of the liquid sample for the flow cell.

Abstract: An antenna structure according to an embodiment includes an antenna device, a circuit board connected to the antenna device and including an inner insulation layer, and an outer insulation layer formed on the antenna device to cover the antenna unit and a portion of the circuit board. A portion of the inner insulation layer covered by the outer insulation layer may have a smaller thickness than a thickness of a portion of the inner insulation layer not covered by the outer insulation layer.

Abstract: The present disclosure relates to a method and an apparatus for purifying an aqueous hydrogen peroxide solution. According to the present disclosure, it is possible to provide a method and an apparatus for purifying an aqueous hydrogen peroxide solution, which may control a generated gas because there is no partial drying of an ion-exchange resin when purifying the aqueous hydrogen peroxide solution using the ion-exchange resin, require no facility expansion, and may provide a high-purity aqueous hydrogen peroxide solution.

Abstract: The present disclosure relates to a method and a system for purifying an aqueous hydrogen peroxide solution. According to the present disclosure, it is possible to provide a method and a system for purifying an aqueous hydrogen peroxide solution, which may achieve the purity required in fine chemical fields such as the semiconductor industry field by preventing layer separation of a mixed ion-exchange resin consisting of a cation-exchange resin and an anion-exchange resin and reducing the leaching of ions from the resin during a purification process.

Abstract: The present disclosure relates to an organic solvent purification process and a dehydration system for obtaining a high-purity organic solvent, and according to the present disclosure, a high-purity organic solvent may be obtained by removing an inflow of impurities during a dehydration process.

Abstract: The present disclosure relates to a purification process of an organic solvent, the process including: (a) performing distillation by supplying an organic solvent to a distillation column; and (b) discharging a portion of the organic solvent including impurities through a side discharge stream connected to a lower part of the distillation column, wherein the discharging of (b) discharges a portion of the organic solvent including impurities at a flow rate of 0.5% to 10% with respect to an input flow rate of the organic solvent supplied to the distillation column in (a).

Abstract: A touch sensor and a window laminate comprising the same, and an image display device comprising the same, the touch sensor comprising: a first electrode layer comprising a first main electrode and a first auxiliary electrode; a second electrode layer comprising a second main electrode and a second auxiliary electrode; and an insulating layer between the first electrode layer and the second electrode layer, wherein the insulating layer comprises a contact hole for electrically connecting the first electrode layer and the second electrode layer.

Abstract: An antenna device according to an embodiments of the present invention includes a substrate layer, a ground layer disposed on a bottom surface of the substrate layer, a radiation control layer disposed on a top surface of the substrate layer, the radiation control layer including a plurality of radiation control patterns formed of a conductive mesh structure, each of the radiation control patterns having a hollow portion, an antenna dielectric layer disposed on the radiation control layer, and an antenna unit disposed on the antenna dielectric layer.

Abstract: A circuit board according to an embodiment includes a core layer including a first region and a second region, and antenna power supply wirings disposed on the core layer over the first region and the second region. The antenna power supply wirings may include a first portion extending in a first direction in the first region, a second portion extending in a second direction in the first region, and a third portion extending in the first direction in the second region, and an interval between the neighboring second portions of the antenna power supply wirings is 3 times or less of an interval between the neighboring third portions of the antenna power supply wirings.

Abstract: An antenna package according to an embodiment includes an antenna unit including a radiator, a transmission line extending from the radiator and an antenna ground pad disposed around the transmission line, and a circuit board electrically connected to the antenna unit. The circuit board includes a core layer, a circuit wiring layer disposed on one surface of the core layer, the circuit wiring layer including a signal transmission wiring electrically connected to the transmission line of the antenna unit and a first ground pattern bonded to the antenna ground pad, and a ground layer disposed on an opposite surface facing the one surface of the core layer. The ground layer does not overlap a portion of the antenna ground pad except for a region bonded to the first ground pattern in a planar view.