Abstract: A layer of photoresist is spread on a metal substrate and heated, this layer is exposed through a mask to UV irradiation, the parts not photocured are developed, by dissolving them, so as to obtain a mold, a first layer of metal or of an alloy is galvanically deposited in the open parts of the mold, the metal structure and the mold are leveled by machining so as to obtain a plane upper surface, a metal ply layer is deposited on the entire upper surface, and then the above steps are repeated. A second layer of metal or an alloy is galvanically deposited in the open parts of the mold, the multilayer metal structure obtained is detached from the substrate by delamination and the photoresist is cured, the photoresist is separated so as to free the multilayer metal structure, and then that portion of the metal ply layer or layers which is not inserted between two electrodeposited metal layers is removed.

Abstract: The invention relates to a process for fabricating a monolayer or multilayer metal structure in LIGA technology, in which a photoresist layer is deposited on a flat metal substrate, a photoresist mold is created by irradiation or electron or ion bombardment, a metal or alloy is electroplated in this mold, the electroformed metal structure is detached from the substrate and the photoresist is separated from this metal structure, wherein the metal substrate is used as an agent involved in the forming of at least one surface of the metal structure other than that formed by the plane surface of the substrate.

Abstract: A layer of photoresist is spread on a metal substrate and heated, this layer is exposed through a mask to UV irradiation, the parts not photocured are developed, by dissolving them, so as to obtain a mould, a first layer of metal or of an alloy is galvanically deposited in the open parts of the mould, the metal structure and the mould are levelled by machining so as to obtain a plane upper surface, a metal ply layer is deposited on the entire upper surface, and then the above steps are repeated. A second layer of metal or an alloy is galvanically deposited in the open parts of the mould, the multilayer metal structure obtained is detached from the substrate by delamination and the photoresist is cured, the photoresist is separated so as to free the multilayer metal structure, and then that portion of the metal ply layer or layers which is not inserted between two electrodeposited metal layers is removed.