Abstract: A method for fabricating a semiconductor device includes the steps of sequentially forming a pad oxide layer and a pad nitride layer on a substrate, the pad oxide layer including a first oxide layer formed on an upper surface of the substrate and a second oxide layer formed on a lower surface of the substrate, and the pad nitride layer including a first nitride layer formed on the upper surface of the substrate and a second nitride layer formed on the lower surface of the substrate; patterning the first nitride layer by removing a portion of the first nitride layer; forming a trench in the substrate corresponding to the removed portion of the first nitride layer, thereby patterning the first oxide layer; filling the trench with an insulating material to form a device isolation layer; forming a passivation layer on the substrate, the passivation layer including a first passivation layer formed on the upper surface of the substrate including the device isolation layer, and a second passivation layer formed on t

Abstract: A CMOS image sensor and a method for fabricating the same are disclosed, in which a dead zone and a dark current are simultaneously reduced by selective epitaxial growth. The CMOS image sensor includes a first conductive type semiconductor substrate, a second conductive type impurity ion area, a gate electrode, an insulating film formed on an entire surface of the semiconductor substrate including the gate electrode and excluding the second conductive type impurity ion area, and a silicon epitaxial layer formed on the second conductive type impurity ion area and doped with first conductive type impurity ions.