Patent number: 11601746
Abstract: An audio headset sub-assembly (600, 700, 900, 1000, 1200, 1300, 1500) providing the operative functionality for true wireless headphones/headset (100) includes circuitry operative to effect wireless communication and audio signal processing, and a battery (212). These circuits and battery (212) are contained in a sealed enclosure (610, 710, 1210, 1310). In one embodiment, the sub-assembly (600, 700, 900, 1000, 1200, 1300, 1500) includes all electronic components for wireless communications and audio signal processing, and a battery (212), but does not include a speaker. A microphone (240) may be part of the sub-assembly (600, 700, 900, 1000, 1200, 1300, 1500) or may be external. In another embodiment, a speaker (230) is part of the sub-assembly (600, 700, 900, 1000, 1200, 1300, 1500) as well. The sub-assembly (600, 700, 900, 1000, 1200, 1300, 1500) may include several cavities (1254, 1252) and vents (1264, 1262) before and behind the speaker (230) for optimal acoustic performance.
Type:
Grant
Filed:
August 5, 2019
Date of Patent:
March 7, 2023
Assignee:
DOPPLE IP B.V.
Inventor:
Johannes Lucas Schreuder