Abstract: A molding assembly with an adhesive and a releasable tape or film is disclosed. The adhesive is preferably placed upon the inner face of the tail of the molding so as to contact the auto body as opposed to the windshield frame, thus avoiding seepage into the pinch well. The invention further preferably comprises a pressure sensitive adhesive that bonds the molding to vehicle body without the need for curing or other processing. A second preferred embodiment of the present invention comprises a pressure sensitive adhesive and releasable tape disposed on the inner face of the molding body for facilitating the immediate in situ bonding between the molding and the windshield.