Patents Assigned to DOT Packaging Group, Inc.
  • Metallic board
    Patent number: 6818269
    Abstract: A blister board and a blister package wherein the board and package includes a metallized paper so that the blister material is securely bonded to both the metallized paper and to the underlying paper board material.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: November 16, 2004
    Assignee: DOT Packaging Group, Inc.
    Inventors: John W. Quinn, Jack A. Fuechsl