Abstract: A curable resin system comprising 1) an epoxy component having a polyglycidyl ether of a polyphenol having an epoxy equivalent weight of up to about 190; and 2) a hardener component comprising polyethylene tetraamine mixture; wherein the epoxy component has a viscosity of less than 9000 mPa·s at 25° C.

Abstract: A reactive hot melt composition, having a softening point of at least 50° C., and being curable on heating to a temperature of 150° C. The composition comprises a blend of (a) a macrocyclic oligomer having a softening point of at least 50° C., containing at least one ring having eight or more atoms, and being able to undergo decyclization at a temperature of 150° C. or more, to produce a polymerizable species, wherein each cyclic oligomer molecule provides two or more structural repeat units of the same or different formula for the resulting polymer, and (b) a thermoplastic resin, its use as an adhesive and methods of its application.