Patents Assigned to Dow Corning Asia, Ltd.
  • Patent number: 6592945
    Abstract: The present invention provides a nanoparticle dispersed structure featuring a polymer having a crosslinked structure that is chemically inert with respect to the nanoparticles and that is effective in suppressing diffusion, and provides a method for manufacturing this nanoparticle dispersion.
    Type: Grant
    Filed: March 2, 2001
    Date of Patent: July 15, 2003
    Assignees: Dow Corning Asia, Ltd., Director-General of National Institute of Advanced Industrial Science & Technology
    Inventors: Masaaki Suzuki, Maria Teresa de los Arcos de Pedro, Yoshinori Nakata, Yoshiho Imai, Munehiro Yamaguchi, Nobuo Kushibiki, Kikuko Takeuchi
  • Patent number: 6538051
    Abstract: An aqueous coating agent for forming lubricating films comprising a hydrophilic resin; a solid lubricating agent comprising MoS2 and at least one antimony sulfide selected from the group consisting of Sb2S3 and Sb2S5, where a weight ratio of MoS2 to antimony sulfides is from 1;0.05 to 1:12; and water and wherein the weight ratio of the solid lubricating agent to the hydrophilic resin is from 0.7:1 to 3:1.
    Type: Grant
    Filed: March 27, 1997
    Date of Patent: March 25, 2003
    Assignee: Dow Corning Asia, Ltd.
    Inventors: Atsushi Ikezawa, Tetsuji Yamaguchi
  • Patent number: 6416855
    Abstract: A composite material having a plurality of laminated polysilylenemethylene layers each having an inside region adjacent to a surface thereof in which nanoparticles of a metal of Au, Pt, Pd, Cu or Ag are dispersed. The composite material is produced by heating a layer of disilacyclobutane overlaid with a layer of nanoparticles of the above metal to polymerize the disilacyclobutane. The above procedure is repeated at least once more.
    Type: Grant
    Filed: July 13, 1999
    Date of Patent: July 9, 2002
    Assignees: Dow Corning Asia, Ltd., National Institute of Advanced Industrial Science and Technology
    Inventors: Fabrice Rossignol, Masaaki Suzuki, Hideaki Nagai, Yoshinori Nakata, Takeshi Okutani, Nobuo Kushibiki, Masashi Murakami
  • Patent number: 6395825
    Abstract: A method for hydrolyzing chlorosilanes having at least three chlorine atoms bonded to each silicon atom to form silicone resins. The method comprises adding at least one of hydridotrichlorosilane, tetrachlorosilane, or organotrichlorosilane to a two-phase mixture comprising a non-polar organic solvent, an aqueous phase comprising 0 to about 43 weight percent hydrochloric acid, and a surface active compound selected from the group consisting of organosulfates described by formula R2SO4H and alkali metal salts thereof, where R2 is selected from the group consisting of alkyl groups comprising about 4 to 16 carbon atoms and alkylphenyl groups comprising 7 to about 22 carbon atoms.
    Type: Grant
    Filed: April 28, 2000
    Date of Patent: May 28, 2002
    Assignees: Dow Corning Corporation, Dow Corning Asia, Ltd.
    Inventors: Gregory Scott Becker, Leslie Earl Carpenter, II, Russell Keith King, Tetsuyuki Michino, Eric Scott Moyer, Craig Rollin Yeakle
  • Patent number: 6376695
    Abstract: An organosilicon-modified charge transporting compound having a structure represented by the following Formula (I): wherein A represents a charge transporting group, Q represents a hydrolytic group or a hydroxyl group, R2 represents a monovalent hydrocarbon group or a halogen-substituted monovalent hydrocarbon group having 1 to 15 carbon atoms, n is 1 to 18, m is 1 to 3, and 1 is 1 to 5; and a curable composition containing the organosilicon-modified charge transporting compound and a cure type resin chiefly composed of an organosilicon high polymer.
    Type: Grant
    Filed: November 5, 1996
    Date of Patent: April 23, 2002
    Assignees: Dow Corning Asia Ltd., Dow Corning Toray Silicone Co., Ltd., Canon Kabushiki Kaisha
    Inventors: Nobuo Kushibiki, Kikuko Takeuchi, Hideki Kobayashi, Toru Masatomi, Kazuo Yoshinaga, Yuichi Hashimoto, Shunichiro Nishida
  • Patent number: 6326506
    Abstract: A method of preparing an organosilicon compound comprising effecting a hydrosilylation reaction between (a) unsaturated compounds with terminal unsaturated groups and (b) silane compounds described by formula HSiR0mW3−m, where W is selected from the group consisting of C1 to C6 alkoxy groups, C6 to C10 aryloxy groups, and halogen atoms, R0 is an organic group, and m is 0, 1, or 2 in the presence of (c) a platinum catalyst and (d) an auxiliary catalyst selected from the group consisting of (1) silyl esters of acids derived from oxo acids of sulfur; (2) amide compounds having N—Si bonds; (3) urea compounds; (4) silyl esters of carbamic acid; (5) phosphoric acid compounds; and (6) cyclic compounds selected from the group consisting of (i) hydroxypyridine compounds, (ii) 8-hydroxyquinoline compounds, (iii) oxazolidinone compounds, and (iv) N-hydroxysuccinimide compounds.
    Type: Grant
    Filed: June 11, 2001
    Date of Patent: December 4, 2001
    Assignee: Dow Corning Asia, Ltd.
    Inventors: Mamoru Tachikawa, Kasumi Takei
  • Patent number: 6297340
    Abstract: A hydrosilylation reaction method that achieves high catalytic activity and stability, and improves the positional selectivity of the hydrosilylation reaction product. The method comprises reacting an unsaturated compound selected from the group consisting of aromatic vinyl compounds and allyl halides with a silicon compound having hydrosilyl groups described by formula HSiRn(Z)3−n, where n=0, 1, or 2, R is a hydrocarbon group and Z is selected from the group consisting of a silamino group, siloxy group, and siloxanoxy group in the presence of a carboxylic acid compound, a silyl ester of a sulfonic acid, and a platinum catalyst.
    Type: Grant
    Filed: June 27, 2000
    Date of Patent: October 2, 2001
    Assignee: Dow Corning Asia, Ltd.
    Inventor: Mamoru Tachikawa
  • Patent number: 6281285
    Abstract: A method for hydrolyzing chlorosilanes having at least three chlorine atoms bonded to each silicon atom to form silicone resins. The method comprises adding at least one of hydridotrichlorosilane, tetrachlorosilane, or organotrichlorosilane to a two-phase mixture comprising a non-polar organic solvent, an aqueous phase comprising 0 to about 43 weight percent hydrochloric acid, and a surface active compound selected from the group consisting of alkylsulphonic acid hydrate, alkali metal salt of alkylsulphonic acid, arysulphonic acid hydrate, and alkali metal salt of arylsulphonic acid.
    Type: Grant
    Filed: June 9, 1999
    Date of Patent: August 28, 2001
    Assignees: Dow Corning Corporation, Dow Corning Asia, Ltd.
    Inventors: Gregory Scott Becker, Leslie Earl Carpenter, II, Russell Keith King, Tetsuyuki Michino, Eric Scott Moyer
  • Patent number: 6258506
    Abstract: The instant invention pertains to a curable composition comprising (a) substance that generates free radicals under the action of ultraviolet radiation and (b) polymer molecule bearing functionality capable of polymerization under the action of said free radicals wherein (a) is a benzoin ether and makes up from 0.001 to 10 wt % of the total composition and (b) has the following formula (R3SiO1/2)a(R′2SiO2/2)b(R″SiO3/2)c(SiO4/2)d in which R, R′, and R″ are each H or C1 to C10 hydrocarbyl possibly containing a heteroatom and at least 10 % is, for example, a vinyl group, and a+b+c+d=1. The composition of the instant invention is a storage-stable UV-curable composition that does not suffer from cure inhibition by air or oxygen, that is very efficiently cured by low doses of UV radiation, and provides a highly heat-resistant cured pattern by heating after pattern formation.
    Type: Grant
    Filed: June 1, 1999
    Date of Patent: July 10, 2001
    Assignee: Dow Corning Asia, Ltd.
    Inventors: Brian R. Harkness, Mamoru Tachikawa, Kasumi Takei
  • Patent number: 6251327
    Abstract: Hydrosilylation reaction curable organosiloxane compositions containing a scavenger for radicals that participate in the free radical polymerization of styrene monomers, which yield upon cure a silicone elastomers having extended moldlife.
    Type: Grant
    Filed: September 6, 2000
    Date of Patent: June 26, 2001
    Assignees: Dow Corning Asia, Ltd., Dow Corning Corporation, Dow Corning GmbH
    Inventors: Peter Otto Bentz, Hideki Nakahara, Daniel Francis McMahon, Edward Burton Scott
  • Patent number: 6252030
    Abstract: A method for manufacturing an organic solvent-soluble hydrogenated octasilsesquioxane-vinyl group-containing compound copolymer comprising reacting 1 mol of (A) a hydrogenated octasilsesquioxane described by formula I with 0.2 to less than 3 mol of (B) a divinyl group-containing compound described by formula (2) CH2═CH—L—CH═CH2   Formula 2 where L is selected from the group consisting of (a) a divalent hydrocarbon group comprising 3 to 10 carbon atoms and (b) —(SiR2O)m—SiR2—, where each R is independently selected from the group consisting of alkyls comprising 1 to 6 carbon atoms and aryls comprising 6 to 9 carbon atoms and 1≦m≦10; in the presence of a hydrosilylation catalyst.
    Type: Grant
    Filed: March 9, 2000
    Date of Patent: June 26, 2001
    Assignee: Dow Corning Asia, Ltd.
    Inventors: Gregg Alan Zank, Michitaka Suto
  • Patent number: 6211323
    Abstract: The present invention relates to triorganosiloxy-endblocked poly(methyl(C6-C40alkyl)siloxane)-poly(methyl(aralkyl)siloxane)-poly(methyl(C2-C4alkyl)siloxane) terpolymers. This invention also relates to two different methods of making these terpolymers. The triorganosiloxy-endblocked poly(methyl(C6-C40alkyl)siloxane)-poly(methyl(aralkyl)siloxane)-poly(methyl(C2-C4alkyl)siloxane) terpolymers of this invention are useful as mold release agents in aluminum die cast release agents, rubber lubricants, and as high reflexive index additives for the personal care industry.
    Type: Grant
    Filed: October 21, 1999
    Date of Patent: April 3, 2001
    Assignees: Dow Corning Corporation, Dow Corning Asia, Ltd.
    Inventors: Keiichi Akinaga, Qian Jane Feng, Lenin James Petroff
  • Patent number: 6191220
    Abstract: A method for making a hydrocarbon oxysilyl functional polymer, which is important as a modified silicone or silicone-modified polymer, by a hydrosilylation reaction between a hydride (hydrocarbonoxy)silane compound having SiH functional groups and a polymer having olefinic or acetylenic unsaturated groups in the presence of a carboxylic acid and a catalytic amount of platinum or a platinum compound.
    Type: Grant
    Filed: December 21, 1998
    Date of Patent: February 20, 2001
    Assignee: Dow Corning Asia, Ltd.
    Inventors: Kasumi Takeuchi Kasumi Takei, Mamoru Tachikawa
  • Patent number: 6175031
    Abstract: A method for synthesizing silicon compounds that contain a substituent bonded to silicon through a Si—C bond comprising a platinum-catalyzed hydrosilylation reaction between SiH-substituted silicon compounds and unsaturated group-functional organic compounds or unsaturated group-functional organosilicon compounds and exhibits a high catalyst activity and stability and affords a high positional selectivity in the hydrosilylation reaction product.
    Type: Grant
    Filed: March 7, 2000
    Date of Patent: January 16, 2001
    Assignee: Dow Corning Asia, Ltd.
    Inventor: Mamoru Tachikawa
  • Patent number: 6153689
    Abstract: The present invention provides a curable polymethylsilsesquioxane composition that uses polymethylsilsesquioxane obtained from inexpensive precursors and that provides a hard, scratch-resistant, highly corrosion-resistant, water-repellent, and transparent cured film. The curable polymethylsilsesquioxane composition of the invention includes a polymethylsilsesquioxane having the general formula(CH.sub.3 SiO.sub.3/2).sub.n (CH.sub.3 Si(OH)O.sub.2/2).sub.mand a predetermined number-average molecular weight, Mn, from 380 to 2,000, wherein m and n are positive numbers that provide the predetermined Mn, with the proviso that the value of m/(m+n) is less than or equal to 0.152/(Mn.times.10.sup.-3)+0.10 and greater than or equal to 0.034/(Mn.times.10.sup.-3) and 10 to 250 weight parts colloidal silica.
    Type: Grant
    Filed: August 18, 1997
    Date of Patent: November 28, 2000
    Assignee: Dow Corning Asia, Ltd.
    Inventors: Maki Itoh, Tetsuyuki Michino, Akihito Sakakibara, Akihito Saitoh
  • Patent number: 6111126
    Abstract: A method for synthesizing organosilicon compounds that contain a functional group bonded to silicon across the Si--C bond. The method comprises reacting an unsaturated group-functional organic compound or unsaturated group-functional organosilicon compound with a hydro(hydrocarbonoxy)silane compound, where the reaction is carried out in the presence of a platinum catalyst.
    Type: Grant
    Filed: December 1, 1999
    Date of Patent: August 29, 2000
    Assignee: Dow Corning Asia, Ltd.
    Inventors: Mamoru Tachikawa, Kasumi Takei
  • Patent number: 6096483
    Abstract: The present invention provides a curable composition which comprises (A) a base-generating substance which generates a base when exposed to the action of ultraviolet light, (B) a siloxane polymer which has silicon-hydrogen bonds (Si--H) capable of reacting with hydroxy groups under the effect of the base to form silicon-oxygen bonds (Si--O) and hydrogen molecules (H.sub.2), and (C) an acid substance. This composition is cured by irradiation with ultraviolet light. During this ultraviolet irradiation, a mask is placed between a coating film of the composition and the radiation source, and the uncured portions of the composition are dissolved and removed so that a pattern is formed. The residual portions are then heated to produce a pattern-cured product.
    Type: Grant
    Filed: March 31, 1997
    Date of Patent: August 1, 2000
    Assignee: Dow Corning Asia, Ltd.
    Inventors: Brian R. Harkness, Mamoru Tachikawa, Kasumi Takei
  • Patent number: 6069185
    Abstract: This invention relates to radiation curable compositions comprising an alkenyl ether functional polyisobutylene, a cationic photoinitiator, a free radical photoinitiator, and an alkenyl ether compound which is free of isobutylene units. The radiation curable compositions can further comprise an alkylphenol. This invention also relates to hydrocarbon silicone alkenyl ether compounds. The radiation curable compositions exhibit a low cure energy, have a high moisture vapor barrier, high damping characteristics, and a high refractive index, and provide a barrier to corrosive vapors and have maintained or enhanced modulus, tensile strength, and toughness.
    Type: Grant
    Filed: November 25, 1998
    Date of Patent: May 30, 2000
    Assignees: Dow Corning Asia, Ltd., Dow Corning Corporation
    Inventors: Maneesh Bahadur, Toshio Suzuki
  • Patent number: 6060620
    Abstract: A method of manufacturing acyloxysilane compounds having functional groups bonded to a silicon atom via Si--C bonds comprising reacting in a hydrosilation reaction an unsaturated compound (a) selected from the group consisting of (i) styrene or styrene derivative, (ii) vinylsilane compound, (iii) siloxane compound having a vinyl group bonded directly to a silicon atom, (iv) epoxy-functional olefin, (v) diene compound, (vi) allyl compound described by formula CH.sub.2 .dbd.CHCH.sub.2 X, where X is a halogen atom, an alkoxy group, or an acyloxy group, (vii) olefin compound having a terminal vinyl group, and (viii) acetylene-type compound with a silicon compound (b) that contains hydrogen atom bonded to the silicon atom and acyloxy group in the presence of a platinum catalyst.
    Type: Grant
    Filed: September 14, 1999
    Date of Patent: May 9, 2000
    Assignee: Dow Corning Asia, Ltd.
    Inventor: Mamoru Tachikawa
  • Patent number: 6054602
    Abstract: A process comprising the hydrosilation of an aromatic vinyl compound by a hydridochlorosilane compound in the present of platinum or platinum compound and a carboxylic acid. The process favors the formation of the .beta.-adduct of the hydrosilation reaction.
    Type: Grant
    Filed: June 29, 1999
    Date of Patent: April 25, 2000
    Assignee: Dow Corning Asia, Ltd.
    Inventor: Mamoru Tachikawa