Patents Assigned to Dow Corning Coporation
  • Hot melt adhesive compositions and methods for their preparation and use
    Patent number: 8580073
    Abstract: A hot melt adhesive composition can be used to laminate substrates together in construction industry and industrial maintenance and assembly applications. The hot melt adhesive composition is sprayable to form a thin layer (1 to 200 microns in thickness) on a substrate. The hot melt adhesive can cure by exposure to moisture or harden by cooling, or a combination thereof.
    Type: Grant
    Filed: June 18, 2009
    Date of Patent: November 12, 2013
    Assignee: Dow Corning Coporation
    Inventors: Daniel Behl, Glen Gordon, Loren Lower, Ross Noel
  • Method for forming filaments from a resin
    Patent number: 4810443
    Abstract: A solution of resinous organosilicon polymer dissolved in an inert solvent is moved downstream as a film through a heated, film-forming zone having an inert atmosphere and a temperature above the polymer's melting point. The solvent is vaporized from the film and withdrawn from the film-forming zone. Molten resinous organosilicon polymer in the solvent-depleted film is withdrawn from the zone. The molten polymer is then directly melt spun into filaments which are gathered into a fiber. Various processing parameters are controlled.
    Type: Grant
    Filed: July 2, 1987
    Date of Patent: March 7, 1989
    Assignee: Dow Corning Coporation
    Inventor: Thomas D. Barnard