Patents Assigned to Dow Corning Silicone Co., Ltd.
  • Patent number: 6180712
    Abstract: There is disclosed a silicone water-based emulsion composition suitable for treating fibers to provide a non-yellowing and adherent coating thereupon, said composition comprising: (A) an organopolysiloxane having at least 2 silicon-bonded groups selected from hydroxyl or alkoxy groups in each molecule; (B) a microparticulate silica; (C) a curing catalyst; and (D) a silatrane derivative.
    Type: Grant
    Filed: August 27, 1999
    Date of Patent: January 30, 2001
    Assignee: Dow Corning Silicone Co., Ltd.
    Inventors: Hiroki Ishikawa, Tsutomu Naganawa, Isao Ona, Makoto Yoshitake
  • Patent number: 5545682
    Abstract: The introduction of release coating-forming silicone compositions that yield cured release coatings that exhibit excellent release properties against tacky substances and do not impair the residual adhesion of tacky substances.Silicone composition for the formation of cured release coatings, that characteristically comprises(A) 100 weight parts of a cured coating-forming silicone composition into which there is admixed(B) 0.5 to 500 weight parts organosilicon polymer with the following average unit formula ##STR1## wherein R represents C.sub.1 to C.sub.10 monovalent hydrocarbon groups that are free of aliphatic unsaturation; R.sup.1 represents organic groups selected from the group consisting essentially of C.sub.2 to C.sub.20 alkylene groups and organic groups with the formulas --R.sup.3 (OR.sup.3).sub.y -- and --R.sup.3 --(R.sub.2 SiO).sub.z R.sub.2 Si--R.sup.3 -- (R is defined as above, R.sup.3 denotes C.sub.2 to C.sub.
    Type: Grant
    Filed: May 23, 1995
    Date of Patent: August 13, 1996
    Assignee: Dow Corning Silicone Co., Ltd.
    Inventors: Nobuo Kaiya, Hideki Kobayashi