Abstract: A curable organopolysiloxane composition capable of forming cured products of superior optical transmittance exhibiting little heat-induced yellowing over time. A semiconductor device having semiconductor elements encapsulated in a cured product of the composition. The composition includes (A) an organopolysiloxane having at least two silicon-bonded alkenyl groups per molecule and bearing silicon-bonded aryl groups, whose content relative to all silicon-bonded organic groups is not less than 40 mol %, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, and (C) an organosiloxane oligomer complex of platinum, where the oligomer has not more than eight silicon atoms per molecule and bears silicon-bonded alkenyl groups and silicon-bonded aryl groups.

Abstract: A saccharide residue-functional organopolycarbosiloxane containing at least two monosaccharide or polysaccharide groups per molecule in which a specific site on the monosaccharide or polysaccharide is bonded to silicon through a thioether bond. Also, a method of preparing the saccharide residue-functional organopolycarbosiloxane, comprising condensing a saccharide residue-functional metal thiolate compound wherein the metal is an alkali metal atom or alkaline-earth metal atom, and an organopolycarbosiloxane containing groups having the formula —R2Q wherein R2 is C2 to C10 alkylene, and Q is a group selected from halogen atoms, C1 to C10 alkylsulfonate groups, and C6 to C20 arylsulfonate groups.

Abstract: An electrically conductive silicone rubber composition comprises, at least, (A) 100 parts by weight of an organopolysiloxane having at least two alkenyl groups per molecule, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule (an amount sufficient to cure the present composition), (C) a platinum based catalyst (an amount sufficient to promote the cure of the present composition), (D) 50 parts by weight to 5,000 parts by weight of a metal based electrically conductive filler, and (E) 5 parts by weight to 500 parts by weight of spherical silicone rubber particles with a surface active agent content of not more than 0.3 wt %.

Abstract: A silicone-based adhesive sheet has either a layer of clay-like curable silicone composition on one side and a layer of slower curing clay-like curable silicone composition than the first composition layer on the other side, or a cured silicone layer on one side and a layer of clay-like curable silicone composition on the other side. The silicone-based adhesive sheet may be used in a method for bonding semiconductor chip and a chip attachment component. A semiconductor device may be prepared by the method.

Abstract: Method for preparation of an aqueous emulsion from a curable silicone composition consisting of (A) an organopolysiloxane having at least two silicon-bonded hydroxyl groups, (B) an organohydrogensiloxane, and (C) a curing catalyst, said method being characterized by (i) continuously supplying component (A), component (B) and component (C), or a mixture of components (A) and (B) and component (C) through individual inlet ports into a continuous mixer and mixing said components at a temperature not exceeding 10° C., (ii) continuously supplying the obtained mixture and (D) an aqueous solution of a surface-active agent to an emulsifier, and emulsifying the components at a temperature not exceeding 20° C. An apparatus for the preparation of an aqueous emulsion of a curable silicone composition comprising of a continuous mixer for mixing components (A) through (C), a distribution unit connected to the lower part of the mixer, and an emulsifier.

Abstract: A curable organic resin composition comprising (A) 100 parts by weight of a curable organic resin and (B) 0.01 to 100 parts by weight of a thiocyanato-containing organohydrocarbonoxysilane or an isothiocyanato-containing organohydrocarbonoxysilane represented by the general formula: X—R1—Si(OR2)nR33-n, wherein X is NCS— or SCN—, R1 is an alkylene or alkyleneoxyalkylene group, R2 and R3 are monovalent hydrocarbon groups, and the subscript n is 1, 2, or 3. The curable organic resin composition possesses superior moldability and, when cured, exhibits superior adhesive properties on substrates such as metals.

Abstract: A grease-like silicone composition comprising at least a liquid organopolysiloxane comprising siloxane units represented by the formula R2SiO2/2, siloxane units represented by the formula RSiO3/2, and siloxane units represented by the formula R3SiO1/2 and a thickening agent. A grease-like silicone composition is provided that is capable of containing a large amount of thickening agent and possesses superior heat resistance.

Abstract: A thermoconductive curable liquid polymer composition including (A) a curable liquid polymer, (B) a filler made from a thermally-elongatable shape-memory alloy, and (C) a thermoconductive filler other than (B). A semiconductor device having a semiconductor element glued or coated with the thermoconductive curable liquid polymer composition.

Abstract: A film-forming silicone resin composition, comprising a reaction product obtained by a method comprising the step of heating (A) an alkoxysilyl-functional organopolysiloxane obtained by running an equilibration reaction with components comprising (A1) a polydiorganosiloxane and (A2) an alkylpolysilicate in the presence of (A3) an equilibration polymerization catalyst; (B) colloidal silica, aluminum oxide, antimony oxide, titanium oxide, or zirconium oxide; and (C) water, and a curable film-forming silicone resin composition, comprising above film-forming silicone resin composition and (E) a condensation reaction catalyst.

Abstract: A saccharide residue-functional organopolysiloxane containing at least two monosaccharide or polysaccharide groups per molecule in which a specific site on the monosaccharide or polysaccharide is bonded to silicon through a thioether bond. Also, a method of preparing the saccharide residue-functional organopolysiloxane, comprising condensing a saccharide residue-functional metal thiolate compound wherein the metal is an alkali metal atom or alkaline-earth metal atom. and an organopolysiloxane containing groups having the formula —R2 Q wherein R2 is C2 to C10 alkylene, and Q is a group selected from halogen atoms, C1 to C10 alkylsulfonate groups, and C6 to C20 arylsulfonate groups.

Abstract: A heat-conductive silicone composition comprising at least (A) an organopolysiloxane, (B) a heat-conductive filler, and (C) a specific organosiloxane. The silicone composition is excellent in handleability, even when it contains a large amount of a heat-conductive filler for the purpose of attaining higher heat conductivity.

Abstract: The invention relates to a straight-oil finishing composition comprising (A) 100 parts by weight of a polydimethylsiloxane oil or liquid paraffin having a viscosity of 3 to 70 mm2/s at 25 centigrade temperature; and (B) 0.5 to 100 parts by weight of an organopolysiloxane resin, which contains silanol groups and silicon-bonded alkoxy groups and wherein 20 mole % or more of all siloxane units are siloxane units represented by formula C3H7SiO3/2. This composition is useful for treating fiber yarn.

Abstract: A curable organopolysiloxane composition includes: (A) a straight-chain organopolysiloxane having per molecule at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group; (B) a branched-chain organopolysiloxane with siloxane units represented by the following general formula: RSiO3/2, where R is a substituted or unsubstituted monovalent hydrocarbon group, and having per molecule at least one silicon-bonded alkenyl group and at least one silicon-bonded aryl group; (C) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; and a semiconductor device with a semiconductor element coated with a cured body of the aforementioned composition.

Abstract: An aqueous suspension of cross-linked silicone particles comprising (A) cross-linked silicone particles having an average diameter of 0.1 to 500 ?m, (B) polyoxyethylene sorbitan monolaurate, and (C) water. And, in a second embodiment, an aqueous emulsion of cross-linked silicone particles comprising (A) cross-linked silicone particles having an average diameter of 0.1 to 500 ?m, (B) polyoxyethylene sorbitan monolaurate, (C) water, and (D) oil.

Abstract: A room-temperature-curable silicone rubber composition comprising (A) 100 parts by weight of a polydiorganosiloxan mixture comprising: (A-1) 20 to 95 wt. % of a polydiorganosiloxane having both molecular terminals capped with dialkoxysilyl groups or trialkoxysilyl groups, (A-2) 5 to 80 wt. % of a polydiorganosiloxane having a molecular terminal capped with dialkoxysilyl group or trialkoxysilyl group and the other molecular terminal capped with monoalkoxysilyl group, hydrosilyl group, trialkylsilyl group or trialkoxyalkylsilyl group, and (A-3) 0 to 30 wt. % of a polydiorganosiloxane having both molecular terminals capped with monoalkoxysilyl group, hydlosilyl group, trialkylsilyl group or trialkoxyalkylsilyl group, (B) one or more alkoxysilanes of the formula R5bSi(OR6)4-b or partial hydrolysis and condensation products thereof, and (C) an organotitanium compound. The composition is used as a sealant.

Abstract: A curable organopolysiloxane composition capable of forming cured products of superior optical transmittance exhibiting little heat-induced yellowing over time. A semiconductor device having semiconductor elements encapsulated in a cured product of the composition. The composition includes (A) an organopolysiloxane having at least two silicon-bonded alkenyl groups per molecule and bearing silicon-bonded aryl groups, whose content relative to all silicon-bonded organic groups is not less than 40 mol %, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, and (C) an organosiloxane oligomer complex of platinum, where the oligomer has not more than eight silicon atoms per molecule and bears silicon-bonded alkenyl groups and silicon-bonded aryl groups.

Abstract: A saccharide residue-functional organopolysiloxane containing at least two monosaccharide or polysaccharide groups per molecule in which a specific site on the monosaccharide or polysaccharide is bonded to silicon through a thioether bond. Also, a method of preparing the saccharide residue-functional organopolysiloxane, comprising condensing a saccharide residue-functional metal thiolate compound wherein the metal is an alkali metal atom or alkaline-earth metal atom, and an organopolysiloxane containing groups having the formula —R2Q wherein R2 is C2 to C10 alkylene, and Q is a group selected from halogen atoms, C1 to C10 alkylsulfonate groups, and C6 to C20 arylsulfonate groups.

Abstract: Method for preparation of an aqueous emulsion from a curable silicone composition consisting of (A) an organopolysiloxane having at least two silicon-bonded hydroxyl groups, (B) an organohydrogensiloxane, and (C) a curing catalyst, said method being characterized by (i) continuously supplying component (A), component (B) and component (C), or a mixture of components (A) and (B) and component (C) through individual inlet ports into a continuous mixer and mixing said components at a temperature not exceeding 10° C., (ii) continuously supplying the obtained mixture and (D) an aqueous solution of a surface-active agent to an emulsifier, and emulsifying the components at a temperature not exceeding 20° C. An apparatus for the preparation of an aqueous emulsion of a curable silicone composition comprising of a continuous mixer for mixing components (A) through (C), a distribution unit connected to the lower part of the mixer, and an emulsifier.

Abstract: A cross-linked silicone adhesive sheet has stability of peeling surfaces during peeling protective films away from both sides of the sheet. An adhesive sheet of a cross-linked silicone has protective films on both sides of the sheet. The protective films each have a thickness of 100 ?m or less. A force of peeling of the protective films from the sheet is equal to or below 5.0 N/m. The difference between peeling forces of the films is equal to or exceeds 0.2 N/m. A method of manufacturing the adhesive sheet of a cross-linked silicone includes the steps of forming a film-like body by placing a cross-linkable silicone composition in a layer having a thickness of 100 ?m or less between two protective films of different materials and then cross-linking the composition.

Abstract: An organopolysiloxane-modified polysaccharide prepared by esterification reacting (A) an organopolysiloxane having residual carboxylic anhydride groups and (B) a polysaccharide having hydroxyl groups, wherein the organopolysiloxane is bonded to the polysaccharide through half ester groups, and a process for the preparation of organopolysiloxane-modified polysaccharide, in which component (A) and component (B) are subjected to an esterification reaction in the presence of (C) a non-protonic polar solvent. The organopolysiloxane-modified polysaccharide comprising polysaccharide and organopolysiloxane bonded thereto through half ester groups is novel. The process for the preparation of organopolysiloxane-modified polysaccharide permits introduction of organopolysiloxane into polysaccharide at a high introduction ratio.