Abstract: A laminated product for flexible packaging is provided, in which at least a paper substrate layer, an adhesive layer, a barrier layer, and a sealant layer are laminated in this order, the adhesive layer contains an ionomer (A) of an ethylene-unsaturated carboxylic acid copolymer, and a content of metal ions represented by X×Y/100 is equal to or more than 4.0 and equal to or less than 20.0 when a content of unsaturated carboxylic acid in an ethylene-unsaturated carboxylic acid copolymer (A1) constituting the ionomer (A) of the ethylene-unsaturated carboxylic acid copolymer is X [mass %], and a degree of neutralization of the ionomer (A) of the ethylene-unsaturated carboxylic acid copolymer is Y [mol %].

Abstract: An adhesive resin composition contains an ethylene-vinyl acetate copolymer (A) in which a content of a structural unit derived from vinyl acetate is 3% by mass or more and 18% by mass or less, and a melt mass flow rate (MFR, JIS K 7210:1999, 190° C., 2160 g load) is 5 g/10 min or more and 40 g/10 min or less, a tackifier resin (B), and an ethylene-vinyl acetate copolymer (C) having a viscosity of 15,000 mPa·s or more and 300,000 mPa·s or less measured at 18° C. using a Brookfield viscometer.

Abstract: A resin composition for a solar cell encapsulant that is used for forming a solar cell encapsulant, the resin composition including at least one kind of ethylene-polar monomer copolymer (A1) selected from an ethylene-vinyl ester copolymer and an ethylene-unsaturated carboxylic acid ester copolymer, an epoxy group-containing ethylene-based copolymer (A2) (excluding the ethylene-polar monomer copolymer (A1)), an ethylene-?-olefin copolymer (B), and a metal inactivating agent (C).

Abstract: A resin composition includes: a polyamide resin (A); an ionomer of an ethylene-unsaturated carboxylic acid-based copolymer (B); and an ethylene-based polymer (C), wherein a content of the polyamide resin (A) is 50% by mass or more with respect to a total amount of the polyamide resin (A), the ionomer of an ethylene-unsaturated carboxylic acid-based copolymer (B) and the ethylene-based polymer (C), and wherein a content of the ethylene-based copolymer (C) is less than 50% by mass with respect to a total amount of the ionomer of an ethylene-unsaturated carboxylic acid-based copolymer (B) and the ethylene-based polymer (C).

Abstract: A resin composition for a sealant has excellent heat-sealing strength with respect to a substrate, and a reduced elution amount thereof into normal heptane. A resin composition for a sealant includes: a resin (A) which is an ethylene-(meth)acrylic acid ester copolymer in which a content of a (meth)acrylic acid ester unit is from 10% by mass to 25% by mass; and a tackifying resin (B), in which a content of the resin (A) is more than 45% by mass with respect to a total amount of resin components in the resin composition for a sealant, and a content of the tackifying resin (B) is from 0.1% by mass to 10% by mass with respect to the total amount of the resin components in the resin composition for a sealant.

Abstract: The present invention is a modified resin for a molded article obtained by modifying an ethylene/unsaturated carboxylic acid copolymer with guanidine carbonate, wherein a melt flow rate of the ethylene/unsaturated carboxylic acid copolymer is 20 (g/10 minutes) or more and 600 (g/10 minutes) or less.

Abstract: Provided is a resin composition used for forming a laminated glass interlayer film or a solar cell encapsulant, the resin composition including an ionomer (A) of an ethylene-unsaturated carboxylic acid-based copolymer, wherein metal ions constituting the ionomer (A) of the ethylene-unsaturated carboxylic acid-based copolymer includes two or more kinds of polyvalent metal ions.

Abstract: The present invention is a modified resin for a molded article obtained by modifying an ionomer of an ethylene/unsaturated carboxylic acid copolymer with at least one guanidine compound selected from guanidine derivatives and salts thereof.