Abstract: A resin composition for a sealant has excellent heat-sealing strength with respect to a substrate, and a reduced elution amount thereof into normal heptane. A resin composition for a sealant includes: a resin (A) which is an ethylene-(meth)acrylic acid ester copolymer in which a content of a (meth)acrylic acid ester unit is from 10% by mass to 25% by mass; and a tackifying resin (B), in which a content of the resin (A) is more than 45% by mass with respect to a total amount of resin components in the resin composition for a sealant, and a content of the tackifying resin (B) is from 0.1% by mass to 10% by mass with respect to the total amount of the resin components in the resin composition for a sealant.

Abstract: The present invention is a modified resin for a molded article obtained by modifying an ethylene/unsaturated carboxylic acid copolymer with guanidine carbonate, wherein a melt flow rate of the ethylene/unsaturated carboxylic acid copolymer is 20 (g/10 minutes) or more and 600 (g/10 minutes) or less.

Abstract: Provided is a resin composition used for forming a laminated glass interlayer film or a solar cell encapsulant, the resin composition including an ionomer (A) of an ethylene-unsaturated carboxylic acid-based copolymer, wherein metal ions constituting the ionomer (A) of the ethylene-unsaturated carboxylic acid-based copolymer includes two or more kinds of polyvalent metal ions.

Abstract: The present invention is a modified resin for a molded article obtained by modifying an ionomer of an ethylene/unsaturated carboxylic acid copolymer with at least one guanidine compound selected from guanidine derivatives and salts thereof.