Abstract: A composition contains: (a) a first organopolysiloxane with an average of 2 or more mercaptoalkyl groups per molecule and that is free of alkenyl functionality; (b) a second organopolysiloxane with an average of one or more alkenyl group and one or more alkoxy group per molecule; (c) a tetraalkoxy silane; (d) an ultraviolet light photoinitiator; and (E) a condensation catalyst; where the concentration of the first and second organopolysiloxanes are such that the molar ratio of mercaptoalkyl groups to alkenyl groups is in a range of 0.4 to 3.0.
Type:
Grant
Filed:
August 30, 2021
Date of Patent:
November 21, 2023
Assignees:
DOW GLOBAL TECHNOLOGIES LLC, DOW SILICONES CORPORATION
Abstract: Various embodiments described herein are directed to a polymer composition comprising polyethylene and a reaction product of the copolymerization of the ethylene and (meth)acrylic ester functionalized polysiloxane, and optionally one or more units derived from a termonomer. Articles made from the polymer composition and methods of making the polymer composition are also described.
Type:
Application
Filed:
September 16, 2021
Publication date:
November 16, 2023
Applicants:
Dow Global Technologies LLC, Dow Silicones Corporation
Inventors:
Arkady L. Krasovskiy, John O. Osby, Andrew Heitsch, Eric Joffre, Nanguo Liu, Brian Dorvel, Alexandra Frankel
Abstract: A fabric care composition is provided including water; a cleaning surfactant; a fabric softening silicone; and a modified carbohydrate polymer having a weight average molecular weight of <500,000 Daltons and a Kjeldahl nitrogen content corrected for ash and volatiles, TKN, of ?0.5 wt %; wherein the modified carbohydrate polymer is a carbohydrate polymer functionalized with quaternary ammonium moieties; wherein the quaternary ammonium moieties on the modified carbohydrate polymer include: trimethyl ammonium moieties having formula (I) and dimethyl(alkyl) ammonium moieties having formula (II) wherein each R is independently selected from a C8-22 alkyl group.
Type:
Grant
Filed:
October 15, 2019
Date of Patent:
November 14, 2023
Assignees:
DOW GLOBAL TECHNOLOGIES LLC, Dow Silicones Corporation, ROHM AND HAAS COMPANY
Inventors:
Emmett M. Partain, III, Jan E. Shulman, Leon Marteaux, Michael B. Clark, Jr., Aline Migliore, Yunshen Chen, Randara Pulukkody, Daniel S. Miller, John Hayes, Asghar A. Peera, Peilin Yang, Mariann Clark, Stephen J. Donovan, Jennifer P. Todd, Cynthia Leslie
Abstract: A thermally conductive silicone composition is provided. The composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane having an average of two to four silicon-bonded hydrogen atoms in a molecule, wherein an amount of the silicon-bonded hydrogen atoms in component (B) is 0.2 to 5 moles per mole of the alkenyl groups in component (A), and at least two of the silicon-bonded hydrogen atoms are located on the side chains of the molecule; (C) a hydrosilylation reaction catalyst; (D) a thermally conductive filler; (E) an alkoxysilane having an alkyl group containing 6 or more carbon atoms in a molecule; and (F) glass beads. A thermally conductive member is produced from the thermally conductive silicone composition. An electronic device has the thermally conductive member and a manufacturing method of the electronic device includes using the thermally conductive silicone composition.
Type:
Grant
Filed:
June 27, 2018
Date of Patent:
November 14, 2023
Assignee:
DOW SILICONES CORPORATION
Inventors:
Yan Zheng, Zhongwei Cao, Qiang Huang, Rui Yang, Sandrine Teixeira de Carvalho, Lujing Xie
Abstract: A polyorganosiloxane hot melt adhesive composition includes a polyolefin-polydiorganosiloxane block copolymer, a polydiorganosiloxane, and a polyorganosilicate resin. The hot melt adhesive composition is useful in electronic device assembly processes.
Type:
Grant
Filed:
February 22, 2019
Date of Patent:
November 14, 2023
Assignees:
DOW SILICONES CORPORATION, Dow Global Technologies LLC
Inventors:
Steven Swier, Glenn Gordon, Zachary Kean, Michael Behr, John Bernard Horstman
Abstract: A silicone pressure sensitive adhesive composition is curable to form a silicone pressure sensitive adhesive. The silicone pressure sensitive adhesive composition can be coated on a substrate and cured to form a protective film. The protective film can be adhered to an anti-fingerprint coating on display glass, such as cover glass for a smartphone.
Abstract: Described herein is a two-part condensation curable adhesive composition suitable for adhering a front lens having an inner surface coated with an anti-haze coating to a lamp body to create a sealed lamp unit. In general, once cured in place, residual ingredients from the adhesive composition or by-products of cure reactions thereof do not visibly inhibit functionality of the anti-haze coating of the sealed lamp unit.
Abstract: A silicone-organic copolymer has the formula Xg[ZjYo]c, where each X is an independently selected silicone moiety having a particular structure, each Y is an independently selected polyacrylate moiety, each Z is an independently selected siloxane moiety, subscript c is from 1 to 150, subscript g is >1, 0<j<2, and 0<o<2, with the proviso that j+o=2 in each moiety indicated by subscript c. Methods of preparing the silicone-organic copolymer are also disclosed. Further, a sealant is disclosed, the sealant comprising the silicone-organic copolymer and a condensation-reaction catalyst.
Type:
Grant
Filed:
December 16, 2019
Date of Patent:
November 7, 2023
Assignees:
Dow Silicones Corporation, Dow Global Technologies LLC
Inventors:
Emmanuel Duquesne, Michael S. Ferrito, Martin Grasmann, Brian Harkness, William Johnson, Bindu Krishnan, Elizabeth Santos, Justin Scherzer, Jeanette Young, Bizhong Zhu
Abstract: The present invention relates to a composition comprising a binder comprising one or more siloxane polymers, silicone resins, silicone based elastomers, and mixtures thereof, wherein said binder optionally comprises one or more cross-linker components comprising a silane and/or a siloxane containing silicon-bonded hydrolysable groups; and a hydrophilic powder and/or gel selected from one or more amorphous, porous hydrophilic silica(s), one or more hydrophilic silica aerogel(s) and mixtures thereof, said amorphous, porous hydrophilic silica and/or said hydrophilic silica aerogel having a BET surface area from 100 m2/g to 1500 m2/g or greater and a thermal conductivity from 0.004 to 0.05 W/m·K at 20° C. and atmospheric pressure. The invention also relates to the use of said composition as or in thermally or acoustically insulating materials and to coatings, products and articles made therefrom.
Abstract: Provided is a polymer particle comprising (a) a core polymer comprising (i) polymerized units of one or more Si-containing monomers; (ii) polymerized units of one or more monovinyl acrylic monomers (ii); and (iii) polymerized units of one or more graftlinkers that have no silicon atoms; (b) a shell polymer comprising polymerized units of one or more acrylic monomers. Also provided is a composition comprising polyvinyl chloride and a plurality of the polyer particles.
Type:
Grant
Filed:
July 26, 2019
Date of Patent:
October 31, 2023
Assignees:
Rohm and Haas Company, Dow Silicones Corporation
Inventors:
Yang Cheng, Morris Wills, Hailan Guo, Nanguo Liu
Abstract: A polyfunctional organohydrogensiloxane is prepared using a boron containing Lewis acid as catalyst. The polyfunctional organohydrogensiloxane may be formulated into release coating compositions. Alternatively, the polyfunctional organohydrogensiloxane may be further functionalized with a curable group to form a clustered functional organosiloxane. The clustered functional organosiloxane may be formulated into thermal radical cure adhesive compositions.
Type:
Grant
Filed:
December 4, 2019
Date of Patent:
October 17, 2023
Assignee:
DOW SILICONES CORPORATION
Inventors:
Eric Joffre, Nanguo Liu, Gang Lu, Zhenbin Niu, David Rich
Abstract: A curable silicone composition is provided. The curable silicone composition is useful for forming a cured product which inhibits the discoloration of silver electrodes or a silver-plated substrate in an optical semiconductor device due to a sulfur-containing gas. The curable silicone composition comprises at least one type of a crown compound. An optical semiconductor device is also provided. The optical semiconductor device has excellent reliability after a sulfur resistance test, in which an optical semiconductor device on silver electrodes or a silver-plated substrate is sealed, covered, or adhered with a cured product of the curable silicone composition.
Abstract: An aqueous dispersion of a silicone pressure sensitive adhesive base can be combined with a curing agent and cured to form a silicone pressure sensitive adhesive. The aqueous dispersion of the silicone pressure sensitive adhesive base includes a bis-hydroxyl-terminated polydiorganosiloxane; a polyorganosilicate resin; cumene; a surfactant; and water. A curing agent such as a peroxide compound or an aminosilane may be combined with the aqueous disperison of the silicone pressure sensitive adhesive base to form a silicone pressure sensitive adhesive composition. A pressure sensitive adhesive article may be formed by a method including coating a surface of a substrate with the silicone pressure sensitive adhesive composition, removing water, and curing the silicon pressure sensitive adhesive composition to form a silicone pressure sensitive adhesive on the surface of the substrate.
Type:
Grant
Filed:
July 21, 2021
Date of Patent:
October 10, 2023
Assignees:
DOW GLOBAL TECHNOLOGIES LLC, Dow Silicones Corporation
Inventors:
Qiangqiang Yan, Yunlong Guo, Wenjie Chen, Li Ding, Hongyu Chen, Cheng Shen, Ruihua Lu, Yan Zhou, Zhihua Liu
Abstract: A silicone pressure sensitive adhesive is prepared by curing a radical reaction curable composition. The silicone pressure sensitive adhesive adheres to various silicone elastomers and is useful in preparation of components of flexible display devices.
Abstract: A process for preparing a cyclic polysiloxazane is disclosed. The cyclic polysiloxazane may optionally be converted to an a-alkoxy-ou-amino-functional polysiloxane. The cyclic polysiloxazane or the a-alkoxy-oo-amino-functional polysiloxane, may be used as a capping agent for a silanol-functional polyorganosiloxane in a process to make an amino-functional polyorganosiloxane.
Type:
Grant
Filed:
October 29, 2020
Date of Patent:
September 19, 2023
Assignee:
Dow Silicones Corporation
Inventors:
Brian Rekken, Patrick Fryfogle, Nisaraporn Suthiwangcharoen, Brett Zimmerman, Hannah Furnier, Kimmai Nguyen, Sean Reisch
Abstract: A silicone-polycarbonate copolymer has the formula Xg[ZjYo]c, where each X is an independently selected silicone moiety having a particular structure, each Y is an independently selected polycarbonate moiety, each Z is an independently selected siloxane moiety, subscript c is from 1 to 150, subscript g is >1, 0?j<2, and 0<o<2, with the proviso that j+o=2 in each moiety indicated by subscript c. Methods of preparing the silicone-polycarbonate copolymer are also disclosed. Further, a sealant is disclosed, the sealant comprising the silicone-polycarbonate copolymer and a condensation-reaction catalyst.
Type:
Grant
Filed:
November 16, 2019
Date of Patent:
September 19, 2023
Assignees:
DOW SILICONES CORPORATION, DOW GLOBAL TECHNOLOGIES LLC
Inventors:
Emmanuel Duquesne, Martin Grasmann, Brian Harkness, William Johnson, Elizabeth Santos, Justin Scherzer, Jeanette Young, Bizhong Zhu
Abstract: A dispersion contains: (a) a polyorganosiloxane with at least 90 mole % dimethyl D units and viscosity of one kPa*s or more dispersed as 0.5-20 micrometer particles; (b) a condensation product of: (i) a polysiloxane resin (Mw of 4,000-50,000) with composition: (R3SiO1/2)a(SiO4/2)b(ZO1/2)c where a is 0.30-0.60, b is 0.40-0.70, c is 0.05-0.20, a+b is one, R is selected from hydrogen, C1?30 alkyl groups and aryl groups, and Z is selected from H, and C18 alkyls; and (ii) a polyoxyalkylene polymer (Mn of 4,500-50,000) with composition: A—O—(C2H4O)e(C3H6O)p—A? where e/p is 1-9, A and A? are selected from hydrogen, alkyl, substituted alkyl, aryl, and substituted aryl groups and at least one of A and A? is H; (c) non-aqueous fluid carrier miscible with (a); and (d) monoterpene; the weight-ratio of (c) to (b) is 0.5-1; weight-ratio of (b) and (c) to (a) is 0.01-0.50; and the composition contains below one ppm aromatic solvent.
Type:
Grant
Filed:
October 11, 2021
Date of Patent:
September 12, 2023
Assignees:
DOW SILICONES CORPORATION, ROHM AND HAAS COMPANY
Inventors:
Patrick J. Fryfogle, Julie Cook, Tim Mitchell, Yihan Liu, Rebecca Beeson, Miroslav Janco, Mikayla T. Miller, Brad J. Phillips
Abstract: A process to form a crosslinked composition comprising thermally treating a composition at a temperature ? 25° C., in the presence of moisture, and wherein the composition comprises the following components: a) an olefin/silane interpolymer, b) a cure catalyst selected from the following: i) a metal alkoxide, ii) a metal carboxylate, iii) a metal sulfonate, iv) an aryl sulfonic acid, v) a tris-aryl borane, vi) any combination of two or more from i)-v). Also, a composition comprising the following components a and b, as described above. A process to form an olefin/alkoxysilane interpolymer, and the corresponding composition, said process comprising thermally treating a composition comprising the following components: a) an olefin/silane interpolymer, b) an alcohol, and c) a Lewis acid.
Type:
Application
Filed:
June 23, 2021
Publication date:
September 7, 2023
Applicants:
Dow Global Technologies LLC, Dow Silicones Corporation
Inventors:
Jordan C. Reddel, Mark F. Sonnenschein, David S. Laitar, Andrew B. Shah, Bethany M. Neilson, Colin LiPi Shan, David D. Devore, Jozef J. I. Van Dun, Philip D. Hustad, Zhanjie Li, Zachary S. Kean, Ken Kawamoto
Abstract: A composition contains the following components: (a) 15 to 49.8 volume-percent of a first polysiloxane that is has a viscosity in a range of 50 centiStokes to 550 Stokes as determined according to ASTM D4283-98; (b) 0.2 to 5 volume-percent of an organoclay; (c) 50-74 volume-percent roundish or crushed thermally conductive fillers including: (i) 5 to 15 volume-percent small thermally conductive fillers having a median particle size in a range of 0.1 to 1.0 micrometers; (ii) 10 to 25 volume-percent medium thermally conductive fillers having a median particle size in a range of 1.1 to 5.0 micrometers; (iii) 25 to 50 volume-percent large thermally conductive fillers having a median particle size in a range of 5.1 to 50 micrometers; and (d) 0 to 5 volume-percent of an alkoxy functional linear polysiloxane different from the first polysiloxane and/or an alkoxy functional linear silane; where volume-percent values are relative to composition volume.
Type:
Grant
Filed:
February 11, 2021
Date of Patent:
September 5, 2023
Assignees:
DOW GLOBAL TECHNOLOGIES LLC, DOW SILICONES CORPORATION, ROHM AND HAAS COMPANY
Inventors:
Erica A. Frankel, Andrés E. Becerra, Andrew J. Swartz, Darren Hansen
Abstract: An interpolymer, which comprises at least one siloxane group, and prepared by polymerizing a mixture comprising one or more “addition polymerizable monomers” and at least one siloxane monomer, in the presence of a catalyst system comprising a Group 3-10 metal complex, and the siloxane monomer is selected from the following Formula 1: Aa-Si(Bb)(Cc)(Hh0)—O—(Si(Dd)(Ee) (Hh1)—O)x—Si(Ff)(Gg)(Hh2), described herein. An ethylene/siloxane interpolymer comprising at least one chemical unit of Structure 1, or at least one chemical unit of Structure 2, each described herein. A process to form an interpolymer, which comprises, in polymerized form, at least one siloxane monomer, or at least one silane monomer without a siloxane linkage, said process comprising polymerizing a mixture comprising one or more “addition polymerizable monomers” and at least one monomer of Formula 4, described herein, in the presence of a catalyst system comprising a metal complex from Formula A or Formula B, each described herein.
Type:
Application
Filed:
June 23, 2021
Publication date:
August 24, 2023
Applicants:
Dow Global Technologies LLC, Dow Silicones Corporation, Rohm and Haas Company
Inventors:
Liam Spencer, Zachary S. Kean, David D. Devore, Jordan C. Reddel, Bethany M. Neilson, Matthew Olsen, Zhanjie Li, Phillip D. Hustad