Patents Assigned to Dow Silicones Corportation
  • Patent number: 11578172
    Abstract: A pressure sensitive adhesive composition includes (A) 0.1% to 5% an anchorage additive and (B) 95% to 99.9% of a silicone pressure sensitive adhesive composition. This pressure sensitive adhesive composition can be cured to form a pressure sensitive adhesive. When cured on a backing substrate, the resulting adhesive article is useful for protecting electronic devices during fabrication, shipping, and use.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: February 14, 2023
    Assignee: Dow Silicones Corportation
    Inventors: Jingui Jiang, Zhihua Liu, Jiayin Zhu, Wenjie Chen, Shenglan Zhang