Patents Assigned to DRI Technology Corp.
  • Making and testing an integrated circuit using high density probe points
    Patent number: 5225771
    Abstract: Individual transistor or logic unit testing is accomplished by a specially fabricated flexible tester surface made in one embodiment of several layers of flexible silicon dioxide, each layer containing vias and conductive traces leading to thousands of microscopic metal probe points on one side of the test surface. The probe points electrically contact the contacts on the wafer under test by fluid pressure.
    Type: Grant
    Filed: October 11, 1991
    Date of Patent: July 6, 1993
    Assignee: DRI Technology Corp.
    Inventor: Glenn J. Leedy