Abstract: A radiation detector is provided that includes a photodiode having a radiation absorber with a graded multilayer structure. Each layer of the absorber is formed from a semiconductor material, such as HgCdTe. A first of the layers is formed to have a first predetermined wavelength cutoff. A second of the layers is disposed over the first layer and beneath the first surface of the absorber through which radiation is received. The second layer has a graded composition structure of the semiconductor material such that the wavelength cutoff of the second layer varies from a second predetermined wavelength cutoff to the first predetermined wavelength cutoff such that the second layer has a progressively smaller bandgap than the first bandgap of the first layer. The graded multilayer radiation absorber structure enables carriers to flow toward a conductor that is used for measuring the radiation being sensed by the radiation absorber.

Abstract: A method includes receiving thermal data of a scene. The thermal data includes a plurality of frames of thermal infrared data. The method also includes generating a temperature map based on at least the thermal data. The temperature map is generated prior to a contrast enhancement process of the thermal data. The method further includes transmitting the temperature map and the thermal data concurrently in a data channel as a data stream.

Abstract: A method of correcting an infrared image including a plurality of pixels arranged in an input image array, a first pixel in the plurality of pixels having a first pixel value and one or more neighbor pixel with one or more neighbor pixel values. The first pixel and the one or more neighbor pixels are associated with an object in the image. The method includes providing a correction array having a plurality of correction pixel values, generating a corrected image array by adding the first pixel value to a correction pixel value in the correction array, and detecting edges in the corrected image array. The method also includes masking the detected edges in the corrected image array, updating the correction array, for each correction pixel value in the correction array and providing an output image array based on the correction array and the input image array.

Abstract: A shock attenuation system configured to reduce shock experienced by an optical device coupled to a weapon includes an inner rail support configured to couple to the weapon and at least two outer rail supports substantially parallel to the inner rail support. The at least two outer rail supports are configured to couple to the optical device. The shock attenuation system also includes a first spring feature coupled to a first of the at least two outer rail supports and the inner rail support, and a second spring feature coupled to a second of the at least two outer rail supports and the inner rail support. The shock attenuation system further includes a viscoelastic material coupled to at least one of: the inner rail support, the first outer rail support, the second outer rail support, the first spring feature, or the second spring feature.

Abstract: A system and method of image processing is provided, including implementing adaptive pixel replacement techniques or reducing noise. The method includes obtaining a data map of an image frame, wherein the data map comprises good pixels and bad pixels at locations associated with the data map. The method also includes assigning different techniques to the bad pixels, wherein a first technique is assigned to a first bad pixel and a second technique is assigned to a second bad pixel. The method further includes adjusting information associated with the bad pixels for a chosen technique for each of the bad pixels.

Abstract: An imaging device includes a first semiconductor layer having a first surface and a second surface and a first photodetector having a first implanted region formed in the first semiconductor layer and a pad formed over the first implanted region. The imaging device also includes a readout circuit disposed over the first surface of the first semiconductor layer. The readout circuit has a plurality of contact plugs facing the first surface of the first semiconductor layer. The imaging device further includes a second semiconductor layer disposed below the second surface of the first semiconductor, a second photodetector having a second implanted region formed in the second semiconductor layer, and a metalized via extending through the first semiconductor layer and the second semiconductor layer and electrically connecting the second implanted region to a second of the contact plugs of the readout circuit.

Abstract: A system, according to an embodiment of the present invention, having an optical device and a shock attenuator is provided. The optical device is configured to operate with a weapon. The shock attenuator is disposed between the optical device and the weapon. The system includes the shock attenuator that is configured to reduce shock experienced by the optical device during operation of the weapon to less than 250 g's.

Abstract: Methods and structures of barrier detectors are described. The structure may include an absorber that is at least partially reticulated. The at least partially reticulated absorber may also include an integrated electricity conductivity structure. The structure may include at least two contact regions isolated from one another. The structure may further include a barrier layer disposed between the absorber and at least two contact regions.

Abstract: A thermal imaging system includes a mounting structure characterized by a first thermal conductivity and a focal plane array mounted to the mounting structure. The thermal imaging system also includes an optical system coupled to the mounting structure and a heating element coupled to the mounting structure. The thermal imaging system further includes a thermal isolator coupled to the mounting structure and characterized by a second thermal conductivity lower than the first thermal conductivity.

Abstract: An imaging device includes a first semiconductor layer having a first surface and a second surface and a first photodetector having a first implanted region formed in the first semiconductor layer and a pad formed over the first implanted region. The imaging device also includes a readout circuit disposed over the first surface of the first semiconductor layer. The readout circuit has a plurality of contact plugs facing the first surface of the first semiconductor layer. The imaging device further includes a second semiconductor layer disposed below the second surface of the first semiconductor, a second photodetector having a second implanted region formed in the second semiconductor layer, and a metalized via extending through the first semiconductor layer and the second semiconductor layer and electrically connecting the second implanted region to a second of the contact plugs of the readout circuit.

Abstract: A system and method of image processing is provided, including implementing adaptive pixel replacement techniques or reducing noise. The method includes obtaining a data map of an image frame, wherein the data map comprises good pixels and bad pixels at locations associated with the data map. The method also includes assigning different techniques to the bad pixels, wherein a first technique is assigned to a first bad pixel and a second technique is assigned to a second bad pixel. The method further includes adjusting information associated with the bad pixels for a chosen technique for each of the bad pixels.

Abstract: Methods and structures of barrier detectors are described. The structure may include an absorber that is at least partially reticulated. The at least partially reticulated absorber may also include an integrated electricity conductivity structure. The structure may include at least two contact regions isolated from one another. The structure may further include a barrier layer disposed between the absorber and at least two contact regions.

Abstract: A method for manufacturing an imaging device is provided. The method comprises forming a contact pad over a semiconductor substrate. The contact pad has a malleable metal. The method further comprises providing a readout circuit having a first side and a contact plug. The contact plug has a base affixed to the first side of the readout circuit and a plurality of prongs extending from the base away from the first side. The first side of the readout circuit is moved towards the substrate so that the prongs of the contact plug are pressed into the pad and displace a portion of the pad into a space defined by and between a first and a second of the prongs. Stop elements formed over the substrate are aligned with and contact stop elements provided on the readout circuit so that the prongs are inhibited from passing completely through the contact pad.

Abstract: Embodiments are directed to systems and methods for blind image deconvolution. One method of blind image deconvolution comprises capturing a video using an imaging device and measuring a sharpness degradation metric for the video. The method further comprises determining parameters of a point spread function (PSF) corresponding to the sharpness degradation metric using a predetermined equation and performing deconvolution on at least one frame of the video using the PSF and the determined parameters.

Abstract: Systems and methods disclosed herein include preventing use of a Focal Plane Array (“FPA”) in a thermal imaging system if used in conjunction with a weapons-related activity by disabling the FPA in response to detecting one or more shock pulse events using accelerometers coupled with the thermal imaging system. The method includes monitoring an output from the one or more of the accelerometers to determine whether a shock pulse acceleration event has been detected that exceeds a predetermined threshold. The method also includes determining that a second acceleration event associated with the accelerometers exceeds a second predetermined threshold. The method further includes disabling the thermal imaging system in response to the detected acceleration events.

Abstract: A method of correcting an infrared image is provided. The method includes receiving an image from a camera comprising a first pixel with a first pixel value and a neighbor pixel with a neighbor pixel value. The first pixel and the neighbor pixel can be assumed to view the same object. The method further includes storing the first and neighbor pixel values in an image table, generating a corrected image table by adding the first pixel value to a corrected pixel value in a correction table, determining that the camera is not moving, and masking edges in the corrected image table. The method further includes updating the correction table by: determining that the first pixel value and neighbor pixel value are not edges, computing the difference between the first and neighbor pixel values, and storing the difference in the correction table. The method further includes providing an output image table.

Abstract: A radiation detector is provided that includes a photodiode having a radiation absorber with a graded multilayer structure. Each layer of the absorber is formed from a semiconductor material, such as HgCdTe. A first of the layers is formed to have a first predetermined wavelength cutoff. A second of the layers is disposed over the first layer and beneath the first surface of the absorber through which radiation is received. The second layer has a graded composition structure of the semiconductor material such that the wavelength cutoff of the second layer varies from a second predetermined wavelength cutoff to the first predetermined wavelength cutoff such that the second layer has a progressively smaller bandgap than the first bandgap of the first layer. The graded multilayer radiation absorber structure enables carriers to flow toward a conductor that is used for measuring the radiation being sensed by the radiation absorber.

Abstract: Embodiments of the invention are directed to a springless athermal lens assembly. In one embodiment, a spacer of a springless athermal lens assembly may compensate for defocus of the camera system due to thermal expansion of the lens assembly through micro wedge mechanisms coupling the spacer to an inner and outer barrel. The inner barrel comprises a lens cell assembly and a body having a micro wedge slot. The outer barrel comprises a body having a micro wedge slot. The spacer comprises an inner barrel micro wedge and an outer barrel micro wedge. The spacer is configured to be physically coupled to the inner barrel through engagement of the inner barrel micro wedge and the inner barrel micro wedge slot. Further, the spacer is configured to be physically coupled to the outer barrel through the engagement of the outer barrel micro wedge and the outer barrel micro wedge slot.

Abstract: An imaging system which includes a housing for a radiation detector having a window disposed above and in axial alignment with the radiation detector, a variable aperture assembly which includes a base ring having a first opening and mounted on the radiation detector housing such that the first opening is in axial alignment with the window, a plate having a first aperture and adapted to engage the base ring such that the first aperture is disposed over the window, at least one aperture blade each operatively coupled to the base ring, and an aperture drive mechanism having a body and an actuator coupling member extending at an angle from the body. In addition, the imaging system includes an actuator assembly having an actuator and an actuator arm, the actuator arm disposed adjacent to the radiation detector housing in proximity to the actuator coupling member.

Abstract: A system and method of image processing is provided, including implementing adaptive pixel replacement techniques or reducing noise. The method includes obtaining a data map of an image frame, wherein the data map comprises good pixels and bad pixels at locations associated with the data map. The method also includes assigning different techniques to the bad pixels, wherein a first technique is assigned to a first bad pixel and a second technique is assigned to a second bad pixel. The method further includes adjusting information associated with the bad pixels for a chosen technique for each of the bad pixels.