Patents Assigned to Du Pont-Mitsui Polychemicals Co., Ltd.
  • Patent number: 5385987
    Abstract: Disclosed is a resin composition comprising 20 to 90 parts by weight of an ethylene/(meth)acrylic ester/carbon monoxide terpolymer having been graft modified with an unsaturated carboxylic acid or its anhydride and 80 to 10 parts by weight of a polyester elastomer having been graft modified with the above modifier, the total amount of said graft modified ethylene/(meth)acrylate/carbon monoxide terpolymer and polyester elastomer being 100 parts by weight. Also disclosed is an adhesive comprising the above-mentioned resin composition. The resin composition and the adhesive according to the invention are excellent in adhesion properties, heat resistant adhesive properties, hue and heat stability.
    Type: Grant
    Filed: March 8, 1994
    Date of Patent: January 31, 1995
    Assignee: Du Pont-Mitsui Polychemical, Co., Ltd.
    Inventors: Hirohide Hamazaki, Akira Fujiwara
  • Patent number: 5322908
    Abstract: Disclosed is a resin composition comprising 20 to 90 parts by weight of an ethylene/(meth)acrylic ester/carbon monoxide terpolymer having been graft modified with an unsaturated carboxylic acid or its anhydride and 80 to 10 parts by weight of a polyester elastomer having been graft modified with the above modifier, the total amount of said graft modified ethylene/(meth)acrylate/carbon monoxide terpolymer and polyester elastomer being 100 parts by weight. Also disclosed is an adhesive comprising the above-mentioned resin composition. The resin composition and the adhesive according to the invention are excellent in adhesion properties, heat resistant adhesive properties, hue and heat stability.
    Type: Grant
    Filed: March 2, 1993
    Date of Patent: June 21, 1994
    Assignee: Du Pont-Mitsui Polychemicals, Co., Ltd.
    Inventors: Hirohide Hamazaki, Akira Fujiwara
  • Patent number: 5319022
    Abstract: The first molded structure of the present invention is formed from ethylene copolymer compositions comprising (A) 50-80% by weight of an ethylene/unsaturated ester copolymer, and (B) 50-20% by weight of an ethylene/vinyl alcohol copolymer having an apparent melt viscosity, as measured at 220.degree. C. and a rate of shear of 100 sec.sup.-1, smaller by 300-1000 Pa.multidot.s than that of said ethylene/unsaturated ester copolymer (A), said molded structures having a stratiform structure wherein said ethylene/vinyl alcohol copolymer (B) has been dispersed into said molded structure in the form of thin layers.The first ethylene copolymer compositions according to the invention are the same as those mentioned above, except that parts of the above-mentioned component (A) have been replaced by a graft modified product (C) of an ethylene/.alpha.-olefin copolymer, and are excellent in heat stability, film forming properties and extrusion kneading properties.
    Type: Grant
    Filed: August 26, 1992
    Date of Patent: June 7, 1994
    Assignee: Du Pont-Mitsui Polychemicals Co., Ltd.
    Inventors: Toru Fukada, Hiroshi Ito
  • Patent number: 5310787
    Abstract: A polyester packaging material having a layer formed from a polyester composition as a content contacting layer, wherein the polyester composition comprises 70-95 parts by weight of a polyethylene terephthalate copolymer and 5-30 parts by weight of an ethylene copolymer ionomer. The polyethylene terephthalate copolymer is derived from terephthalic acid (and isophthalic acid, if desired), ethylene glycol and cyclohexanedimethanol (a molar ratio of the ethylene glycol to the cyclohexanedimethanol being within the range of 95/5 to 75/25), and the polyethylene terephthalate copolymer has an endothermic peak of 180.degree. to 240.degree. C. as measured by a differential scanning calorimeter after heated at 130.degree. C. for 5 hours in nitrogen and has an endotherm of 10 to 40 Joule/g at the endothermic peak.
    Type: Grant
    Filed: May 28, 1992
    Date of Patent: May 10, 1994
    Assignee: Du Pont-Mitsui Polychemicals Co., Ltd.
    Inventors: Yoshikazu Kutsuwa, Shigenori Ishii, Toru Fukada
  • Patent number: 5300548
    Abstract: Disclosed herein are a novel graft copolymer comprising a stock copolymer (A) of at least one monomer selected from esters of unsaturated carboxylic acids and vinyl esters (a), ethylene (b) and carbon monoxide (c), and a polyamide oligomer having a primary amino group at one end of its molecule (B) grafted on said stock copolymer, and a process for the preparation thereof. The proposed graft copolymer, when used as an adhesive, in particular for adhesion of polyvinyl chloride, exhibits excellent heat resistance and adhesion properties.
    Type: Grant
    Filed: October 27, 1992
    Date of Patent: April 5, 1994
    Assignee: Du Pont-Mitsui Polychemicals Co., Ltd.
    Inventors: Hideo Akimoto, Shiro Narasaki, Reiji Miyamoto
  • Patent number: 5049626
    Abstract: Disclosed herein are a novel graft copolymer comprising a stock copolymer (A) of at least one monomer selected from esters of unsaturated carboxylic acids and vinyl esters (a), ethylene (b) and carbon monoxide (c), and a polyamide oligomer having a primary amino group at one end of its molecule (B) grafted on said stock copolymer, and a process for the preparation thereof. The proposed graft copolymer, when used as an adhesive, in particular for adhesion of polyvinyl chloride, exhibits excellent heat resistance and adhesion properties.
    Type: Grant
    Filed: September 6, 1989
    Date of Patent: September 17, 1991
    Assignee: Du Pont-Mitsui Polychemicals Co., Ltd.
    Inventors: Hideo Akimoto, Shiro Narasaki, Reiji Miyamoto
  • Patent number: 4968752
    Abstract: Proposed herein is an ionomer composition which comprises a reaction product of from 90 to 99.5% by weight of an ethylene copolymer-type ionomer (A) with from 0.5 to 10% by weight of an olefin copolymer (B) having epoxy groups in its side chains, and from 5 to 200 parts by weight, based on 100 parts by weight of said reaction product, of an olefin-type thermoplastic elastomer (C). The proposed ionomer composition is excellent in scratch resistance and flexibility and exhibits a reduced "luster reappearance".
    Type: Grant
    Filed: January 29, 1990
    Date of Patent: November 6, 1990
    Assignee: Du Pont-Mitsui Polychemicals Co., Ltd.
    Inventors: Manabu Kawamoto, Yasuhisa Hosoai, Eisaku Hirasawa
  • Patent number: 4965319
    Abstract: Provided herein a polymer composition which comprises from 50 to 85 parts by weight of an ethylene-type ionomer resin (A), from 10 to 39 parts by weight of a partially crosslinked olefin-type thermoplastic elastomer (B) and from 1 to 15 parts by weight of an ethylene-alpha-olefin copolymer rubber (C). The proposed composition is excellent in scratch resistance, adhesion to metals, resistance to heat deformation, flexibility, antibleeding property of mineral oil softener contained and low surface gloss.
    Type: Grant
    Filed: June 2, 1989
    Date of Patent: October 23, 1990
    Assignee: Du Pont-Mitsui Polychemicals Co., Ltd.
    Inventor: Manabu Kawamoto
  • Patent number: 4677163
    Abstract: A vinyl chloride resin composition comprising(A) 100 parts by weight of a vinyl chloride resin,(B) 30 to 200 parts by weight of an ethylene/vinyl acetate/carbon monoxide copolymer, and(C) 2 to 80 parts by weight of chlorinated polyethylene. The said vinyl chloride resin composition can be prepared by simultaneously melt-mixing 100 parts by weight of the vinyl chloride resin, 30 to 200 parts by weight of the ethylene/vinyl acetate/carbon monoxide copolymer and 2 to 80 parts by weight of chlorinated polyethylene.
    Type: Grant
    Filed: November 6, 1985
    Date of Patent: June 30, 1987
    Assignee: Du Pont-Mitsui Polychemicals Co., Ltd.
    Inventors: Seiichi Tada, Yasuhisa Hosoai
  • Patent number: 4532307
    Abstract: A polymer composition comprising an ethylene-vinyl acetate-carbon monoxide copolymer and a nitrogen-containing or an alicyclic epoxy compound, and a foamable polymer composition comprising an ethylene-vinyl acetate-carbon monoxide copolymer, a heat-decomposable organic blowing agent having a decomposition temperature of at least 90.degree. C., and a nitrogen-containing or an alicyclic epoxy compound.
    Type: Grant
    Filed: October 1, 1984
    Date of Patent: July 30, 1985
    Assignee: Du Pont-Mitsui Polychemicals Co., Ltd.
    Inventor: Seiichi Tada
  • Patent number: 4526707
    Abstract: A semiconducting composition comprising(A) a random copolymer of propylene and an alpha-olefin having at least 4 carbon atoms as main constituents, which contains 50 to 87 mole % of the propylene units,(B) fine particles of carbon black, and as an optional component,(C) at least one random copolymer selected from the group consisting of a random copolymer of ethylene and a vinyl ester having 4 to 5 carbon atoms as main constituents, which contains at least about 5.4 mole % of the vinyl ester units, and a random copolymer of ethylene and an unsaturated carboxylic acid ester having 4 to 8 carbon atoms as main constituents, which contains at least 3 mole % of the unsaturated carboxylic acid ester units.The semiconducting composition or its crosslinked product is useful as an outside semiconducting layer in a power cable composed at least of a central conductor, a crosslinked polyethylene insulating layer surrounding the conductor and an outside semiconducting layer surrounding the insulating layer.
    Type: Grant
    Filed: December 19, 1983
    Date of Patent: July 2, 1985
    Assignee: Du Pont-Mitsui Polychemicals Co., Ltd.
    Inventors: Yoshikazu Kutsuwa, Kouji Kitahara, Toshiyuki Ishii
  • Patent number: 4517317
    Abstract: A polymer composition comprising an ethylene-vinyl acetate-carbon monoxide copolymer and a nitrogen-containing or an alicyclic epoxy compound, and a foamable polymer composition comprising an ethylene-vinyl acetate-carbon monoxide copolymer, a heat-decomposable organic blowing agent having a decomposition temperature of at least 90.degree. C., and a nitrogen-containing or an alicyclic epoxy compound.
    Type: Grant
    Filed: July 17, 1984
    Date of Patent: May 14, 1985
    Assignee: Du Pont-Mitsui Polychemicals Co., Ltd.
    Inventor: Seiichi Tada