Patents Assigned to Du Pont Wirex Ltd
  • Epoxy resin adhesive for flexible printed circuits
    Patent number: 6265469
    Abstract: Epoxy resin adhesive formulations are disclosed which improve the bonding strength of laminates without loss of flexibility. These epoxy resin adhesive formulations comprise one or more epoxy resins, rubber compounds, curing compounds, a hindered piperidinyloxy compound, and optionally one or more fillers.
    Type: Grant
    Filed: September 2, 1999
    Date of Patent: July 24, 2001
    Assignee: Du Pont Wirex Ltd
    Inventors: Chien-Hwa Chiu, Der-Jen Sun, Ya-Fen Tsai, Chien-Yu Chen