Patents Assigned to DUDOVICZ
  • POLISHING SILICON WAFERS
    Publication number: 20010034197
    Abstract: An endless belt for a belt type polishing machine comprises a support fabric and a polymer layer of relatively low hardness. The polymer layer is formed with drainage grooves. The support fabric may comprise a non woven or woven material, or a membrane with oriented reinforcing yarns. A further version comprises a spiral-link fabric supporting a woven or non woven layer carrying the polymer layer. The polymer layer may be a double layer, the upper of which is either harder or softer than the lower layer.
    Type: Application
    Filed: September 30, 1997
    Publication date: October 25, 2001
    Applicant: DUDOVICZ
    Inventor: WALTER DUDOVICZ