Abstract: The present invention relates to an improved system and method for manufacturing flexible circuit boards (FSBs) using optical alignment and various bonding systems. The invention provides an improved process to connect together the layers of rigid-flex, flexible, and printed circuit boards while maintaining alignment of the layers prior to and possibly after a lamination step. An optical alignment system is provided, a preferred arrangement is enabled as an automated pinless bonding system (PBS), for securely gripping, aligning, transferring, and clamping, bonding and moving a bonded FSB employing a multi-axis orientation. An alternative manual optical alignment and bonding system is provided.

Abstract: The present invention relates to an improved system and method for manufacturing flexible circuit boards (FSBs) using optical alignment and various bonding systems. The invention provides an improved process to connect together the layers of rigid-flex, flexible, and printed circuit boards while maintaining alignment of the layers prior to and possibly after a lamination step. An optical alignment system is provided, a preferred arrangement is enabled as an automated pinless bonding system (PBS), for securely gripping, aligning, transferring, and clamping, bonding and moving a bonded FSB employing a multi-axis orientation. An alternative manual optical alignment and bonding system is provided.

Abstract: The present invention relates to an improved system and method for manufacturing flexible circuit boards (FSBs) using optical alignment and various bonding systems. The invention provides an improved process to connect together the layers of rigid-flex, flexible, and printed circuit boards while maintaining alignment of the layers prior to and possibly after a lamination step. An optical alignment system is provided, a preferred arrangement is enabled as an automated pinless bonding system (PBS), for securely gripping, aligning, transferring, and clamping, bonding and moving a bonded FSB employing a multi-axis orientation. An alternative manual optical alignment and bonding system is provided.

Abstract: An inductive thermal bonding system includes at least one inductive bonding or heating member containing a magnetic E-shaped inductive core and a coil bounding a central member of the E-shaped inductive core. A rigid cover plate allows high and predictable temperature rate-of-change during use and reduced thermal cycling time without risk of detriment. Adaptive solid copper pads on multiplayer bonding regions minimize bonding errors and improve reliability. A cooling system is provided for adaptively cooling both the bond head and the bonded stack. Single and paired inductive heating members may be employed, and may also be alternatively controlled and positioned to aid generation of multiplayer bonding subassemblies distant from an edge of a multiplayer sheet construct.

Abstract: Disclosed is an integrated bonding station for bonding laminate elements in a selected stack orientation, at least one of the laminate elements including a barcode on a surface thereof, the integrated boding station including a barcode reader assembly may include: a barcode reader; a direct lighting assembly being configured to direct light onto a surface of the at least one laminate element; a low angle lighting assembly being configured to direct light near the surface; and a back lighting assembly being configured to direct light onto an opposing side of the surface. Each of the direct lighting assembly, low angle lighting assembly, and back lighting assembly may be configured to provide light of a selected wavelength and of a selected intensity.

Abstract: The present invention relates to a pin-less registration and inductive heating system involving the use of a pre-alignment station for imaging an initial position of a laminate element, an imaging and computer operation control system for determining a required correction factor between an alignment of the laminate element at the pre-alignment station and a preferred stack orientation for the laminate element, and an alignment and transfer system for securely gripping, transferring, and repositioning a laminate element from a top position to the preferred stack orientation employing a preferred four-axis orientation.

Abstract: The present invention relates to an improved system and method for manufacturing flexible circuit boards (FSBs) using optical alignment and various bonding systems. The invention provides an improved process to connect together the layers of rigid-flex, flexible, and printed circuit boards while maintaining alignment of the layers prior to and possibly after a lamination step. An optical alignment system is provided, a preferred arrangement is enabled as an automated pinless bonding system (PBS), for securely gripping, aligning, transferring, and clamping, bonding and moving a bonded FSB employing a multi-axis orientation. An alternative manual optical alignment and bonding system is provided.

Abstract: The present invention relates to a pin-less registration and inductive heating system involving the use of a pre-alignment station for imaging an initial position of a laminate element, an imaging and computer operation control system for determining a required correction factor between an alignment of the laminate element at the pre-alignment station and a preferred stack orientation for the laminate element, and an alignment and transfer system for securely gripping, transferring, and repositioning a laminate element from a top position to the preferred stack orientation employing a preferred four-axis orientation.

Abstract: The present invention relates to a pin-less registration and inductive heating system involving the use of a pre-alignment station for imaging an initial position of a laminate element, an imaging and computer operation control system for determining a required correction factor between an alignment of the laminate element at the pre-alignment station and a preferred stack orientation for the laminate element, and an alignment and transfer system for securely gripping, transferring, and repositioning a laminate element from atop position to the preferred stack orientation employing a preferred four-axis orientation.

Abstract: The present invention relates to a pin-less registration and inductive heating system involving the use of a pre-alignment station for imaging an initial position of a laminate element, an imaging and computer operation control system for determining a required correction factor between an alignment of the laminate element at the pre-alignment station and a preferred stack orientation for the laminate element, and an alignment and transfer system for securely gripping, transferring, and repositioning a laminate element from atop position to the preferred stack orientation employing a preferred four-axis orientation.

Abstract: The present invention relates to a pin-less registration and inductive heating system involving the use of a pre-alignment station for imaging an initial position of a laminate element, an imaging and computer operation control system for determining a required correction factor between an alignment of the laminate element at the pre-alignment station and a preferred stack orientation for the laminate element, and an alignment and transfer system for securely gripping, transferring, and repositioning a laminate element from a top position to the preferred stack orientation employing a preferred four-axis orientation.

Abstract: The present invention relates to a pin-less registration method for a plurality of laminate elements in a selected stack orientation. The method involves the use of an optical step that images portions of each laminate and determines a required correction factor between an alignment of the laminate element at the pre-alignment station and a preferred stack orientation for the laminate element. A computer operation control system provides instructions for positioning laminate elements to a corrected stack orientation during an assembly of the stack. Following the assembly of the stack an induction welding step occurs at predetermined locations to secure the pinless alignment.