Abstract: A conduit level for use in bending electrical conduit includes a generally F-shape rigid frame having a base member and a pair of legs and a clamping screw protruding through one of the legs for connecting the frame to an open end of a conduit. A bubble level is housed within a bottom end portion of the base member so that, when the apparatus is connected to the conduit, the bubble level is laterally spaced apart from the open end of the conduit to bring it into view of an operator from an operator's position alongside the conduit for leveling the conduit. A housing is integrally formed in the bottom end portion to substantially surround the bubble level to protect it from impact. The housing includes windows on four sides to allow viewing the bubble level from the operator's position after a bend is formed in the conduit.