Abstract: Three-dimensional (3D) devices that include at least two electrically isolated planes of electrically conductive traces and methods of making the same. The 3D device includes an upper level, a lower level electrically isolated from the upper level, and one or more pedestal portions joining the upper level and the lower level. The pedestal portions comprise an undercut. The undercut defines an upper level overhang that is configured to define a mask region to prevent conductive material from being deposited below the undercut.

Abstract: Methods for forming electrical circuitries on three-dimensional (3D) structures and devices made using the methods. A method includes forming selectively shaped 3D structures using additive manufacturing. The method includes forming undercuts on upper-level pedestals of the 3D structures that effectively act as overhanging deposition masks for selectively preventing deposition of a selected material on a corresponding portions of lower levels. The method includes simultaneously forming and electrically isolating materials directionally deposited on the 3D structure.