Patents Assigned to Duk San Tekopia Co., Ltd.
  • SOLDER INK AND ELECTRONIC DEVICE PACKAGE USING SAME
    Publication number: 20120309866
    Abstract: The present invention relates to a solder ink and an electronic device package using the same. The solder ink includes: a solder powder including an alloy including tin (Sn); a binder including a first resin comprising rosin resin or rosin modified resin; an active agent; and a solvent.
    Type: Application
    Filed: March 10, 2010
    Publication date: December 6, 2012
    Applicant: DUK SAN TEKOPIA CO., LTD.
    Inventors: Yong Un Jang, Sung Chul Kim, Yong Cheol Chu, Seung Jun Jang, Yoon Sang Son
  • CONDUCTIVE ADHESIVE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE INCLUDING THE SAME
    Publication number: 20120228560
    Abstract: The present invention relates to a conductive adhesive, a method for manufacturing the same, and an electronic device including the same. The conductive adhesive includes: a conductive particle; a low-melting alloy powder including an alloy including Sn and at least one material selected from the group consisting of Ag, Cu, Bi, Zn, In, and Pb; a nano powder; a first binder including a thermosetting resin; and a second binder including a rosin compound.
    Type: Application
    Filed: May 7, 2012
    Publication date: September 13, 2012
    Applicant: Duk San Tekopia Co., Ltd.
    Inventors: Yong Un Jang, Sung Chul Kim, Yong Cheol Chu, Seung Jun Jang, Yoon Sang Son, Soon Ho Joeng