Abstract: A combination, composition and associated method for chemical mechanical planarization of a tungsten-containing substrate are described herein which afford tunability of tungsten/dielectric selectivity and low selectivity for tungsten removal in relation to dielectric material. Removal rates for both tungsten and dielectric are high and stability of the slurry (e.g., with respect to pH drift over time) is high.
Type:
Application
Filed:
December 3, 2009
Publication date:
June 24, 2010
Applicant:
DuPoint Air Products Nanomaterials LLC
Inventors:
Rachel Dianne McConnell, Ann Marie Meyers