Patents Assigned to DUPONT ELECTRONICS, INC.
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Patent number: 11834561Abstract: A polyamic acid solution includes a dianhydride and a diamine. The dianhydride includes pyromellitic dianhydride, the diamine includes a benzimidazole, the molar ratio of dianhydride monomer to diamine monomer is in a range of from 0.85:1 to 0.99:1, and the polyamic acid solution has a solids content in a range of from 10 to 25 weight percent and a viscosity in a range of from 300 to 3000 poise.Type: GrantFiled: March 30, 2023Date of Patent: December 5, 2023Assignee: DUPONT ELECTRONICS, INC.Inventor: Ming-Siao Hsiao
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Patent number: 11718728Abstract: In one aspect, a single layer polymer film includes 25 to 97.5 wt % of a polyimide having a refractive index of 1.74 or less, 0.5 to 20 wt % of a matting agent and 1 to 30 wt % of a black colorant. On an air side, the single layer polymer film has an L* color of 33 or less and a 60° gloss of 10 or less. In another aspect, a single layer polymer film includes 80 to 99 wt % of a polyimide having a refractive index of 1.74 or less and 1 to 30 wt % of a black colorant. A surface of the single layer polymer film has been textured and has a maximum roughness (Spv) of 7 ?m or more, an L* of 33 or less and a 60° gloss of 10 or less.Type: GrantFiled: November 3, 2020Date of Patent: August 8, 2023Assignee: DUPONT ELECTRONICS, INC.Inventors: Laila Maclaughlin, Husnu Alp Alidedeoglu, Christopher Robert Becks, Thomas Edward Carney, Scott John Herrmann, Joseph Casey Johnson
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Patent number: 11700687Abstract: In a first aspect, a polymer film includes a polyimide. The polyimide includes one or more dianhydrides and one or more diamines. Each of the dianhydrides and diamines is selected from the group consisting of crankshaft monomers, flexible monomers, rigid rotational monomers, rigid non-rotational monomers, and rotational inhibitor monomers. The polymer film has a Df of 0.005 or less, a water absorption of 2.0% or less and a water vapor transport rate of 50 (g×mil)/(m2×day) or less. In a second aspect, a metal-clad laminate includes the polymer film of first aspect and a first metal layer adhered to a first outer surface of the polymer film. In a third aspect, an electronic device includes the polymer film of the first aspect.Type: GrantFiled: June 11, 2020Date of Patent: July 11, 2023Assignee: DUPONT ELECTRONICS, INC.Inventors: Joseph Casey Johnson, Delanie J Losey, Peggy Scott, Christopher Dennis Simone
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Patent number: 11679531Abstract: The present invention concerns a chemical mechanical polishing pad having a polishing layer. The polishing layer contains an extruded sheet. The extruded sheet is prepared by extruding a compounded photopolymerizable composition followed by exposure to UV light.Type: GrantFiled: October 13, 2021Date of Patent: June 20, 2023Assignees: Rohm and Haas Electronic Materials CMP Holdings, Inc., DuPont Electronics, Inc.Inventors: Bainian Qian, Robert M. Blomquist, Lyla M. El-Sayed, Michael E. Mills, Kancharla-Arun Reddy, Bradley K. Taylor, Shijing Xia
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Patent number: 11643515Abstract: In a first aspect, a polyimide corn position has a glass transition temperature of less than 300° C. and includes a polyimide derived from a dianhydride, a fluorinated aromatic diamine and an aliphatic diamine. A polyimide film made from the polyimide composition has a b* of less than one for a film thickness of at least 30 microns.Type: GrantFiled: May 9, 2022Date of Patent: May 9, 2023Assignee: DUPONT ELECTRONICS, INC.Inventors: Joseph Casey Johnson, Kostantinos Kourtakis
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Patent number: 11643514Abstract: In a first aspect, a polyimide film includes a polyimide derived from a dianhydride and a diamine. The dianhydride includes pyromellitic dianhydride, the diamine includes a benzimidazole, the molar ratio of dianhydride to diamine that forms the polyimide is in a range of from 0.85:1 to 0.99:1, and the polyimide film has a Tg of 400° C. or higher, a tensile modulus of 6.0 GPa or more, and a coefficient of thermal expansion of 15 ppm/° C. or less over a temperature range of 50 to 500° C. In a second aspect, an electronic device includes the polyimide film of the first aspect.Type: GrantFiled: September 9, 2021Date of Patent: May 9, 2023Assignee: DUPONT ELECTRONICS, INC.Inventor: Ming-Siao Hsiao
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Patent number: 11603440Abstract: In a first aspect, a polyimide film includes a dianhydride and a diamine. The dianhydride, the diamine or both the dianhydride and the diamine include an alicyclic monomer, an aliphatic monomer or both an alicyclic monomer and an aliphatic monomer. The polyimide film has a b* of 1.25 or less and a yellowness index of 2.25 or less for a film thickness of 50 ?m. The polyimide film is formed by: (a) polymerizing the dianhydride and the diamine in the presence of a first solvent to obtain a polyamic acid solution; (b) imidizing the polyamic acid solution to form a substantially imidized solution; (c) casting the substantially imidized solution to form a film; and (d) drying the film.Type: GrantFiled: June 25, 2020Date of Patent: March 14, 2023Assignee: DUPONT ELECTRONICS, INC.Inventors: Kostantinos Kourtakis, Gene M Rossi, Joseph Casey Johnson, Michael Thomas Kwasny
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Patent number: 11597850Abstract: The present disclosure provides an ink fluid set containing an aqueous pretreatment composition and an aqueous inkjet ink. This ink fluid set is particularly suitable for printing on offset coated media.Type: GrantFiled: December 17, 2018Date of Patent: March 7, 2023Assignee: DUPONT ELECTRONICS, INC.Inventors: Xiaoqing Li, Christian Jackson, C Chad Roberts
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Patent number: 11558979Abstract: The present invention discloses heat sinks comprising a base and a plurality of fins protruding from one surface of the base, wherein the base and the fins are independently composed of one or more anisotropic thermal conductive films. Said anisotropic thermal conductive film is electric insulative with low Dk and Df values. Also disclosed are methods for manufacturing the heat sinks and methods for dissipating heat of electronic devices having at least one heat generating component.Type: GrantFiled: June 15, 2021Date of Patent: January 17, 2023Assignee: DUPONT ELECTRONICS, INC.Inventors: Tao Yang, Ping Wang, Chong Yang Wang, Da Liang Ju, Zheyue Yang
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Patent number: 11504944Abstract: A cover window for a display includes a multilayer polymer film. The multilayer polymer film includes a first transparent, colorless polymer layer having a first elastic modulus and a second transparent, colorless polymer layer having a second elastic modulus. Each of the first and second transparent, colorless polymer layers include a polyimide, a polyamide imide, or a block copolymer of a polyimide. The polymers of both the first and second transparent, colorless polymer layers are cross-linked. The first elastic modulus is different from the second elastic modulus. The first and second transparent, colorless polymer layers are bonded by consolidation and cross-linking. The first transparent, colorless layer of the multilayer polymer film is the layer farthest from the display.Type: GrantFiled: November 5, 2021Date of Patent: November 22, 2022Assignee: DUPONT ELECTRONICS, INC.Inventors: Kostantinos Kourtakis, Gene M Rossi, Leopoldo Alejandro Carbajal, Mark Allan Lamontia, Mobin Yahyazadehfar
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Patent number: 11499065Abstract: The present disclosure pertains to an aqueous inkjet ink containing a pigment as colorant, a polymeric dispersant, a polymeric binder, and a water-insoluble additive. The inks show improved properties for printing on paper and textile.Type: GrantFiled: June 23, 2017Date of Patent: November 15, 2022Assignee: DUPONT ELECTRONICS, INC.Inventors: Xiaoqing Li, Michael Stephen Wolfe
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Patent number: 11465402Abstract: A photosensitive element, particularly a photopolymerizable printing form precursor; a method of preparing the photosensitive element to form a printing form for use in relief printing; and a process of making the photosensitive element are disclosed. The printing form precursor includes a layer of a photosensitive composition, a digital layer that is adjacent to a side of the photosensitive layer, and a cell pattern layer that is disposed between the photosensitive layer and the digital layer. The cell pattern layer includes a plurality of features, and is composed of an ink that is opaque to actinic radiation and transparent to infrared radiation. Since the cell pattern layer is integral with the printing form precursor, digital imaging can occur rapidly with relatively low resolution optics to form a mask without needing to also form a microcell pattern of the digital layer.Type: GrantFiled: April 24, 2020Date of Patent: October 11, 2022Assignee: DUPONT ELECTRONICS, INC.Inventors: Robert M Blomquist, Bradley K Taylor, John Stephen Locke, Mark A Hackler
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Patent number: 11394429Abstract: A construction panel having integrated antennas for enhancing the range of telecommunication signal transmissions inside buildings includes multiple layers, including a first layer and a second layer. The construction panel further includes a first antenna on the first layer. The first antenna transfers a telecommunication signal that is incident on the first layer. The construction panel further includes a second antenna on the second layer. The first antenna transmits the telecommunication signal to the second antenna through the first layer using near field coupling. A wavelength of the telecommunication signal is more than a distance between the first antenna and the second antenna. The second antenna causes the telecommunication signal to radiate on the opposite side of the first layer. One or more methods to manufacture the construction panel are also described.Type: GrantFiled: December 2, 2020Date of Patent: July 19, 2022Assignee: DUPONT ELECTRONICS, INC.Inventor: Wei Wu
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Patent number: 11260622Abstract: In a first aspect, a multilayer polymer film includes a first transparent, colorless polymer layer comprising a polyimide, a polyamide imide, or a block copolymer of a polyimide and a second transparent, colorless polymer layer comprising a polyimide, a polyamide imide, or a block copolymer of a polyimide. An elastic modulus of the first transparent, colorless polymer layer is different than an elastic modulus of the second transparent, colorless polymer layer. The first and second transparent, colorless polymer layers are bonded by consolidation. In a second aspect, a cover window for a display includes the multilayer polymer film of the first aspect. The first transparent, colorless layer of the multilayer polymer film is the layer farthest from the display.Type: GrantFiled: November 12, 2019Date of Patent: March 1, 2022Assignee: DUPONT ELECTRONICS, INC.Inventors: Kostantinos Kourtakis, Gene M Rossi, Leopoldo Alejandro Carbajal, Mark Allan Lamontia, Mobin Yahyazadehfar
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Patent number: 11254094Abstract: In a first aspect, a multilayer polymer film includes a first polymer layer having a first elastic modulus and a second polymer layer having a second elastic modulus. The first polymer layer includes a polyimide, a polyamide imide, a block copolymer of a polyimide or a polyamide imide or a mixture thereof. The second polymer layer includes a polyimide, a polyamide imide, a block copolymer of a polyimide or a polyamide imide or a mixture thereof. The first elastic modulus is different from the second elastic modulus. The first and second polymer layers are bonded by consolidation. In a second aspect, a cover window for a display includes a hard coat layer and the multilayer polymer film of the first aspect. The first polymer layer of the multilayer polymer film is the layer farthest from the display and is adhered to the hard coat layer.Type: GrantFiled: October 26, 2020Date of Patent: February 22, 2022Assignee: DUPONT ELECTRONICS, INC.Inventors: Kostantinos Kourtakis, Gene M Rossi, Leopoldo Alejandro Carbajal, Mark Allan Lamontia, Mobin Yahyazadehfar, Ross S Johnson, Weiying Gao, Aref Samadidooki
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Patent number: 11259368Abstract: A thin-film heating device includes a base layer, a bus bar layer and an electrode layer. The base layer includes a polymeric resistive layer, including conductive filler, in contact with a polymeric dielectric layer. The polymeric resistive layer has a sheet resistance in a range of from about 0.5 ohm/square to about 2 Megaohm/square. The bus bar layer is adhered to the polymeric dielectric layer of the base layer. The bus bar layer includes a first patterned conductive material. The electrode layer includes a second patterned conductive material and is electrically connected to the bus bar layer.Type: GrantFiled: July 21, 2017Date of Patent: February 22, 2022Assignee: DUPONT ELECTRONICS, INC.Inventors: Kurt Douglas Roberts, Jonathan A. Weldon
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Patent number: 11256001Abstract: In a first aspect, a low haze polymer film includes a polymer and a refractive index-matching nanoparticle aggregate. The polymer includes a polyimide, a polyamide imide or a polyester imide, and the refractive index-matching nanoparticle aggregate includes a first nanoparticle having a refractive index that is less than the refractive index of the polymer and a second nanoparticle having a refractive index that is greater than the refractive index of the polymer. A difference in the refractive indices of the polymer and the refractive index-matching nanoparticle aggregate is less than 0.1, and the low haze polymer film has a thickness in a range of from 1 to 150 ?m and a haze of less than 4%. In a second aspect, an electronic device includes the low haze polymer film of the first aspect.Type: GrantFiled: October 16, 2019Date of Patent: February 22, 2022Assignee: DUPONT ELECTRONICS, INC.Inventors: Kostantinos Kourtakis, Gene M Rossi
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Patent number: 11248143Abstract: In a first aspect, a coated film includes a polyimide film, a curable resin coating composition and an adhesion-promoter. The curable resin coating composition includes a curable oligomer and first nanoparticles. The adhesion-promoter includes a polyamic acid composition and is on a surface of the polyimide film that is in contact with the curable resin coating composition. In a second aspect, an electronic device includes the coated film of first aspect.Type: GrantFiled: May 21, 2020Date of Patent: February 15, 2022Assignee: DUPONT ELECTRONICS, INC.Inventors: Kostantinos Kourtakis, Tao Huang
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Patent number: 11228080Abstract: The invention relates to a method of manufacturing a dielectric filter. The method comprises the steps of: (a) preparing a ceramic substrate; (b) applying a conductive paste on the ceramic substrate, wherein the conductive paste comprises, (i) 100 parts by weight of a conductive powder, (ii) 0.1 to 10.0 parts by weight of a glass frit comprising silicon oxide, boron oxide, aluminum oxide and an alkaline metal oxide, and (iii) an organic vehicle; and (c) firing the applied conductive paste.Type: GrantFiled: November 5, 2019Date of Patent: January 18, 2022Assignee: DUPONT ELECTRONICS, INC.Inventor: Yusuke Tachibana
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Patent number: 11220587Abstract: A polymer thick film carbon black composition comprising 6-13 wt % conductive carbon black powder; and 87-94 wt % organic medium comprising thermoplastic polyurethane resin dissolved in an organic solvent may be used to form the resistive element of heaters in applications where significant stretching is required, particularly on substrates that can be highly elongated and, in particular, that can be used in wearable garment applications.Type: GrantFiled: May 11, 2020Date of Patent: January 11, 2022Assignee: DUPONT ELECTRONICS, INC.Inventors: H David Rosenfeld, Ivan Chen, William George Kampert, Ping Tzeng, Fred E Nagle, Michael Stephen Wolfe