Abstract: A two dimensional radiation detector array includes a plurality of detector cards, each of the detector cards including: a plurality of radiation detectors arranged in a linear array; and a plurality of amplifiers, each of the amplifiers being electrically coupled to a respective one of the plurality of radiation detectors; and a separator between first and second detector cards of the plurality of detector cards.

Abstract: An imaging detector system includes a radiation detector having a plurality of pixels for generating a plurality of detection signals in response to radiation. Each of the pixels is used to generate a corresponding one of the detection signals. The imaging detector system includes a plurality of photon counting channels. Each photon counting channel is coupled to a corresponding one of the pixels to receive and process the corresponding one of the detection signals. Each photon integrating channel is coupled to a corresponding one of the pixels to receive and process the corresponding one of the detection signals. An image processor receives outputs from the photon counting channels and the photon integrating channels, wherein the image processor is adapted to generate an image using the received outputs.

Abstract: A method is provided for fabricating in a thermal evaporation system a polycrystalline film capable of directly detecting radiation. Source material is placed in a container, and the container is evacuated to create vacuum within the container. The source material is heated to evaporate the source material for depositing on a substrate. The polycrystalline film is used in as deposited form to detect the radiation.

Abstract: A radiation detector for detecting radiation such as x-rays. The radiation detector includes a detector having a plurality of pixels, wherein each of the pixels is used for detecting the radiation. The radiation detector also includes a ball grid array (BGA) package having a plurality of solder balls formed on a first side and a plurality of contacts formed on a second side. The BGA package also has a cavity, in which at least one integrated circuit (IC) chip is mounted. The IC chip has a plurality of readout channels, each of the readout channels being coupled to a corresponding one of the pixels via a corresponding one of the solder balls to receive an electrical signal corresponding to the radiation detected by the corresponding one of the pixels.