Abstract: Embodiments relate to a test method for testing an unpopulated printed circuit board. The method can involve the steps of: exposing the unpopulated printed circuit board to temperatures of a reflow soldering process in a first step; and testing the electrical connections of the unpopulated printed circuit board. Embodiments also relate to a test device and a method for producing populated printed circuit boards.

Abstract: A medical implant includes a first component having a surface and a plurality of electrical contacts and a second component having a surface and a plurality of electrical contacts. Each contact of the first component contacts an assigned contact of the second component in an electrically conducting manner. A seal is disposed between the two surfaces for sealing the contacts. The seal and the two surfaces are formed of a thermoplastic material. The seal is fused to the two surfaces for sealing the contacts and the seal is meltable so as to separate the two components from one another. A method for producing a medical implant is also provided.

Abstract: A strain sensor for capacitive strain measurement has a flat and electrically conductive first conductor element and a flat and electrically conductive second conductor element. The two conductor elements oppose one another and are laterally displaceable relative to one another, so that the two conductor elements, proceeding from a first condition, may be displaced relative to one another into a second condition. An overlap between the two conductor elements is different in the first condition from the second condition. First and second springs attach the conductor elements to first and second attaching regions of the strain sensor. The first attaching region is disposed at a first reference point of a body to be measured, and/or the second attaching region is disposed at a second reference point of the body to be measured.

Abstract: A method for producing an electronic module includes providing a first substrate including at least one first electrical contacting surface, an electronic component including at least one second electrical contacting surface, and a first material layer made of a thermoplastic material including at least one recess extending through the material layer. The first substrate, the electronic component and the first material layer are arranged with the first material layer disposed between the first substrate and the electronic component, and the at least one first electrical contacting surface, the at least one second electrical contacting surface and the at least one recess aligned relative to one another. The first substrate, the electronic component and the material layer are thermocompression bonded. A joint formed between the at least one first electrical contacting surface and the at least one second electrical contacting surface is surrounded or enclosed by the first material layer.

Abstract: The present invention relates to a test method for an unpopulated printed circuit board, comprising the steps of: exposing the unpopulated printed circuit board to temperatures of a reflow soldering process in a first step; and testing the electrical connections of the unpopulated printed circuit board. The present invention further relates to a test device and a method for producing populated printed circuit boards.

Abstract: An electronic module on a flexible planar circuit substrate with a conductor configuration on a first substrate surface and a plurality of electronic components on the opposite, second substrate surface, wherein the components have component contacts, which are electrically connected selectively by way of vias in the circuit substrate and the conductor configuration, wherein the circuit substrate is a thermoplastic polymer and the component contacts are melted or thermally pressed into the second substrate surface in the region of the vias.

Abstract: Implantable sensor system including a sensor which is situated in a housing, the housing having a measurement region which is permeable for the parameters to be detected by the sensor, wherein the measurement region has an erodible protective coating which is permeable for the parameters to be detected by the sensor.

Abstract: A method for embedding at least one component into a dielectric layer. obtain a good result, it is provided that the method includes the following steps: a) Position and affix the at least one component on a carrier; b) Cast a liquid dielectric around the at least one component, thereby enclosing the at least one component completely; c) Harden the liquid dielectric to form a solid dielectric layer; and d) Apply, in particular by lamination thereon, another layer, in particular an electrically conductive layer. The use of a dielectric layer formed entirely of liquid dielectric, wherein the liquid dielectric is not converted into a solid state until the dielectric is processed.

Abstract: An implantable sensor device for capturing at least one physical, chemical, biological or physiological parameter in the body of a living being wearing the sensor device upon contact with the body fluid or tissue of the same, including a sensor housing, a sensor element that is accommodated in the sensor housing and has a capturing section, which has direct contact with the body fluid or the body tissue, or which internally adjoins a surface or opening section of the sensor housing that has contact with the body fluid or the body tissue, and a mechanically acting sensor cleaning device for cleaning the capturing section of the sensor element and/or the surface or opening section of the sensor housing adjoining the same.

Abstract: An electronic device, comprising a housing, a functional unit disposed in the housing, a terminal lead electrically connecting the functional unit to the outside of the housing, and a sealed feedthrough in the housing, the feedthrough surrounding the terminal lead and insulating it with respect to the housing, wherein the feedthrough is produced from a liquid crystal polymer.

Abstract: A method for the electrodeposition of an electrode including a metallic electrode material (40) on a dielectric substrate (10), including the following steps: depositing an electrically conductive polymer layer (20); masking the electrically conductive polymer layer (20) using a mask; electrodepositing the metallic electrode material (40) on the electrically conductive polymer layer (20); removing the mask; and removing or deactivating the excess conductive polymer layer (20).

Abstract: A covering device for covering an area of an organic substrate, with a connecting zone between a closure cap and the substrate. It is proposed that the connecting zone includes, at least in certain areas, a heating element for heating the connecting zone during the creation of a connection between the closure cap and the substrate. Also provided is an organic substrate with a covering device and a production method for producing a covering device.

Abstract: A method for embedding at least one component into a dielectric layer. obtain a good result, it is provided that the method includes the following steps: a) Position and affix the at least one component on a carrier; b) Cast a liquid dielectric around the at least one component, thereby enclosing the at least one component completely; c) Harden the liquid dielectric to form a solid dielectric layer; and d) Apply, in particular by lamination thereon, another layer, in particular an electrically conductive layer. The use of a dielectric layer formed entirely of liquid dielectric, wherein the liquid dielectric is not converted into a solid state until the dielectric is processed.

Abstract: Implantable sensor system including a sensor which is situated in a housing, the housing having a measurement region which is permeable for the parameters to be detected by the sensor, wherein the measurement region has an erodible protective coating which is permeable for the parameters to be detected by the sensor.

Abstract: An implantable sensor device for capturing at least one physical, chemical, biological or physiological parameter in the body of a living being wearing the sensor device upon contact with the body fluid or tissue of the same, including a sensor housing, a sensor element that is accommodated in the sensor housing and has a capturing section, which has direct contact with the body fluid or the body tissue, or which internally adjoins a surface or opening section of the sensor housing that has contact with the body fluid or the body tissue, and a mechanically acting sensor cleaning device for cleaning the capturing section of the sensor element and/or the surface or opening section of the sensor housing adjoining the same.

Abstract: An electronic device, comprising a housing, a functional unit disposed in the housing, a terminal lead electrically connecting the functional unit to the outside of the housing, and a sealed feedthrough in the housing, the feedthrough surrounding the terminal lead and insulating it with respect to the housing, wherein the feedthrough is produced from a liquid crystal polymer.

Abstract: A method of manufacturing an electrical connecting element with a predetermined breaking point is provided, the method comprising the steps of providing a core which comprises fiber reinforced material, of cutting the core at a cutting location where the predetermined breaking point is to be, and thereby creating a cut in the core, of adding at least one layer of material including a dielectric in a non-hardened state, the at least one layer at least partially covering the cut, and thereby at least partially filling the cut with dielectric material, of hardening the dielectric material, and of cutting through the layer of material at the cutting location.

Abstract: The method according to the invention is essentially characterised in that a resistance material (5)—for example nickel or a nickel alloy—is attached on a first structured conductor layer (2)—it may be of copper or a copper alloy. Subsequently, the first structured conductor layer (5) is removed again at least at those locations at which a resistor is to arise. This may be effected by way of firstly removing the insulating material (1) on which the first conductor layer adheres, firstly from the rear side at the desired locations for example by way of plasma etching. The conductor layer 2 my be subsequently removed at least in regions.

Abstract: A method of manufacturing an electrical connecting element with a predetermined breaking point is provided, the method comprising the steps of providing a core which comprises fiber reinforced material, of cutting the core at a cutting location where the predetermined breaking point is to be, and thereby creating a cut in the core, of adding at least one layer of material including a dielectric in a non-hardened state, the at least one layer at least partially covering the cut, and thereby at least partially filling the cut with dielectric material, of hardening the dielectric material, and of cutting through the layer of material at the cutting location.

Abstract: The method according to the invention is essentially characterised in that a resistance material (5)—for example nickel or a nickel alloy—is attached on a first structured conductor layer (2)—it may be of copper or a copper alloy. Subsequently, the first structured conductor layer (5) is removed again at least at those locations at which a resistor is to arise. This may be effected by way of firstly removing the insulating material (1) on which the first conductor layer adheres, firstly from the rear side at the desired locations for example by way of plasma etching. The conductor layer 2 my be subsequently removed at least in regions.