Abstract: The invention concerns methods for the production of micro-holes in semi-finished components (300) for printed circuit boards (200), consisting of several layers of electrically conductive materials (21,22) and dielectric materials (20), wherein micro-holes are embossed into dielectric materials and/or electrically conductive materials and that the embossed micro-holes are subsequently cleaned by means of plasma or by means of wet-chemical processes

Abstract: A method for the manufacture of screened or shielded interconnecting conductors (1) begins with semifinished foil products (H1, H2, H3), a first semifinished foil product (H1) having at least one layer of conductors (10, 10′, 12, 12′, 13, 13′) including signal conductors (10, 10′) and shielding conductors (12, 12′, 13, 13′). Another semifinished foil product (H2, H3) has shielding material (23, 33), which is joined by a dielectric (15, 25, 35) to at least one layer of conductors (10, 10′, 12, 12′, 13, 13′), in which the shielding material (23, 33) is provided by photochemical structuring near the shielding conductors (12, 12′, 13, 13′) with openings (22, 22′, 32, 32′) extending to the dielectric (15, 25, 35).

Abstract: The method for the manufacture of multilayer connecting substrates with multiple functions comprises the design of the connecting substrate taking place in functionally separated manner, in that signal conducting substrate parts (19), power supplying substrate parts (2), mechanical substrate parts (7), as well as the arrangement of components (4) or component-carrying substrate parts is separately planned and optimized as independent functions or modules and finally associated with spatially separated functional areas (inner/outer) of the overall circuit, the design taking place by the connection of the modules to an overall circuit embodying the connecting substrate. The resulting multilayer circuit with conductor network (19, 2), components (4) and mechanical stiffening elements (7) has the following structure.

Abstract: A method for the manufacture of printed circuit boards, foil circuit boards and semifinished products for printed and foil circuit boards formed from preliminary products with electrically conductive coatings (7, 8) structurable to conductor patterns and structurable substrates (4), for the formation of connectors (V), contours (K) and conductor patterns (L), the connectors (V), contours (K) and conductor patterns (L) being structured simultaneously or in the same method steps from the preliminary products, and the connectors (V) and contours (K) are part of the structured preliminary product substrate, the connectors (V) being brought for electrical or mechanical connection into a position in which they are connectable and the finished conductor patterns (L) can be separated at contours (K).

Abstract: The multilayer foil circuit board according to the invention has rigid (s) and flexible (f) areas and in the rigid areas has more foil layers than in the flexible areas. The foil circuit board according to the invention is produced so that in the intended flexible areas (f) at least on one side at least the outermost foil layer (1.2) is removed by etching. By a corresponding etching mask design, it is possible to allow the flexible areas (f) to pass continuously into the rigid areas (s) in that the removal of the layers in the marginal areas (u) is less than in the center (z) of the flexible area (f), so that there are no marginal areas which have a tendency to break. The etching of the flexible areas can be performed in the same method stage as the etching of the plated through holes through the corresponding foil layer (1.2) or in a separate etching stage.

Abstract: A process for structuring polymer films, such as printed circuit boards and film boards, uses a plasma, which is formed in a container by the excitation of gas mixtures by microwaves, in which there is a control of the surface temperature of the polymer films during structuring by the plasma. By adjusting the parameters it is possible to operate just below a material-damaging temperature limit for polymer films, so that structures or microshapes are carefully plasma-eroded in polymer films. At high surface temperatures and with a dense plasma, structures or microshapes are rapidly eroded by the plasma, in which the structures or microshapes are homogeneously plasma-eroded with a uniform distribution of the surface temperature and gas flow.

Abstract: A multilayer laminated body has a determinate system of hollow passages and is formed by an assembly of flat layers of polymeric materials having major dimensions in orthogonal X and Y directions and a thickness dimension in a Z direction perpendicular to the X and Y directions. Selected ones of the layers have openings extending through in the Z direction, and other layers have canals formed in an X-Y plane. The openings and canals form parts of hollow passages so that assembly of multiple layers joins openings and canals forms complete and continuous passages through the assembled layers. Layers joined in pre-laminate assemblies are assembled together in precise relative positions for desired alignment of the canals and openings. The passages can be filled with optically conductive material or electrically conductive material and electrodes can be appropriately positioned for acting on fluids passing through the body.

Abstract: In the method according to the invention for the production of multilayer foil printed circuit board from preliminary products (A), with current paths (B) structured in electrical conductive layers (1,3) and with electrically conductive metal platings (C,D) from conductive layer (1) to conductive layer (3) through an insulating layer (2), or for producing semifinished products for such foil circuit boards, in first method steps a structuring means (7,7',13) is applied in controlled, local manner to the preliminary product (A) and resist layers (8,9) are coated with the preliminary product (A), the structuring means (7,7',13) being applied either to the resist layers (8,9) and the resist layer (8,9) is locally removed, or the resist layers (8,9) are applied to the structuring means (7,7',13) and in a further method step the applied structuring means (7,7',13) are removed, so that openings (10,10') are formed in the resist layers (8,9) and extend down to the insulating layer (2) and in a further method step thr

Abstract: A process for the production of printed circuit boards and film circuit boards includes providing a starting product with a layer of insulating material between layers of metal. Openings are formed at desired locations through the metal and, at selected ones of those openings, openings are formed through the insulating material by plasma etching or chemical etching. The result of this is back-etching leaving projecting webs of metal extending partly across the openings. The projecting edges are removed by subjecting all of the metal surfaces to etching or electrodeplating which also thins the metal layers. The resulting structure is then plated, adding reinforcing thickness to the thinned metal layers and coating the openings through the insulating material with metal, providing interracial connections between the metal layers. The resulting intermediate can then be formed into a circuit board by forming circuit patterns in the metal layers.

Abstract: Electrical connections in multilayer printed circuit boards made from conductor foils are preworked by producing preworked electrical connections on the conductor foils to be subsequently processed and for this purpose photoresist is laminated onto said conductor foils, in such a way that in a photochemical process a freely selectable pattern of recesses in the photoresist is exposed and developed, that in a galvanic plating process metal is plated in said recesses and the photoresist is subsequently removed, that at least two conductor foils are pressed, in such a way that the conductor foils are separated by at least one intermediate adhesive film or foil and that each adhesive foil is laminated onto at least one conductor foil, each of said intermediate adhesive foils engaging on at least one conductor foil with preworked electrical connections in such a way that on pressing at least two conductor foils the electrical connections preworked on at least one of the conductor foils penetrates the intermediate

Abstract: The inventive core for electrical connecting substrates, particularly for printed circuit boards and foil circuit boards, has an inner layer (I) with a columnar structure and on either side, metallic cover layers (A,A'), the columnar structure of the inner layer (I) comprising columns (9.1,9.2), which are regularly arranged, spaced from one another and from the cover layers (A,A'), being directed transversely to the service extension of the core and made from an electrically conductive material in a matrix (6) of an electrically insulating material. The cover layers (A,A') e.g. have electrical terminals (16,16', 17,17') in the form of through-plated blind holes (13,14) on selected columns (9) of the inner layer (I) and are structured in such a way that they have a regular pattern of terminals (16,16') on the facing cover layer and terminals (17,17') on the through-connections insulated from the cover layers, this grid pattern can have a size of approximately 0.5 mm.

Abstract: In a metal-clad laminate the requirements concerning the mechanical strength are functionally separated from the circuit connection requirement, so as to be able to bring the circuit connection, particularly for signals, "closer" to the electrotechnical characteristics of the chips. For this purpose and without taking account of the mechanical strength of the substrate, the layout miniaturization is optimized. In place of a circuit board (MCM), a laminate which can be built up to a circuit board is produced. The inventive laminate comprises an extremely thin foil with a plurality of extremely small holes simultaneously etched in an etching process. The hole diameter can be reduced by almost an order of magnitude (up to 20 .mu.m), which permits a sub-100 .mu.m technology. Such a laminate is not used as a mechanical support and is only provided for signal guidance. The effect of the miniaturization can be seen in the diameter for the plated-through holes.

Abstract: A method for producing aligned passages through substrate materials, in which the projection of the inlet and outlet openings does not coincide, uses displaced application of etching windows on opposite sides and corresponding pronounced under-etching of these windows. By applying displaced etching windows on both sides of the substrate and through-etching the substrate through these windows, `oblique` passages are obtained through the substrate. By a suitable location of the windows it is also possible to produce branched passages with more than one outlet opening.