Patents Assigned to DYM Solution Co., Ltd.
  • Patent number: 11017918
    Abstract: Provided is a semi-conductive composition for a power cable, more particularly, a semi-conductive composition for a power cable having excellent mechanical properties and electrical properties, and more specifically, a semi-conductive composition for a power cable capable of having improved scorch stability, improved surface smoothness, improved space charge accumulation suppression characteristic to thereby be applicable to an ultra-high voltage direct current power cable.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: May 25, 2021
    Assignee: DYM SOLUTION CO., LTD.
    Inventors: Jong Seok Yang, Ki Joung Lee, Geun Bae Jeon, Dong Ha Park
  • Patent number: 10732613
    Abstract: Provided is a smart factory for production and quality management of a thermoplastic and thermosetting compound capable of predicting and controlling quality and production schedule in the future as well as monitoring a current state of factory by acquiring various types of data generated during a manufacturing process such as a manufacturing schedule, a quality condition, or the like of a manufacturing process.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: August 4, 2020
    Assignee: DYM Solution Co., Ltd.
    Inventor: Dong Ha Park
  • Patent number: 10626260
    Abstract: Provided is a semiconductive resin composition which may be used for both an internal semiconductive layer and an external semiconductive layer of a power cable, and in particular has excellent peelability to be used for the external semiconductive layer. In addition, a novel semiconductive resin composition having improved thermal resistance and mechanical physical properties, and an improved deterioration property is provided. The semiconductive resin composition for a power cable includes: 20 to 70 parts by weight of any one or two or more conductive particles selected from the group consisting of carbon black, graphite and graphene, based on 100 parts by weight of a composite resin including a polypropylene homopolymer having a melting point of 150 to 170° C. and an ethylene-(meth)acrylate-based resin.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: April 21, 2020
    Assignee: DYM SOLUTION CO., LTD.
    Inventors: Jong Seok Yang, Ki Joung Lee, Geun Bae Jeon, Dong Ha Park
  • Patent number: 10442923
    Abstract: Provided is a semiconductive resin composition which may be used for both an internal semiconductive layer and an internal semiconductive layer of a power cable, and in particular has excellent peelability to be used for the external semiconductive layer. In addition, a novel semiconductive resin composition having improved thermal resistance and mechanical physical properties, and an improved deterioration property is provided. The semiconductive resin composition for a cable includes: 1 to 15 parts by weight of a multiwalled carbon nanotube as a conductive particle, and 1 to 10 parts by weight of an enhancer, based on 100 parts by weight of a composite resin including 10 to 250 parts by weight of an ethylene-(meth)acrylate-based resin and 1 to 100 parts by weight of an olefinic elastomer, based on 100 parts by weight of a polypropylene-based resin.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: October 15, 2019
    Assignee: DYM Solution Co., Ltd.
    Inventors: Jong Seok Yang, Jae Gyu Han, Geun Bae Jeon, Dong Ha Park
  • Patent number: 10174187
    Abstract: Provided are a room temperature crosslinked type halogen-free flame retardant resin composition and a method of preparing the same. Specifically, a room temperature crosslinked type halogen-free flame retardant resin composition according to the present invention including a polyethylene resin, a olefin-based elastomer, a metal hydroxy compound, a radical initiator, a crosslinked type alkoxysilane-based compound, a condensation catalyst of the crosslinked type alkoxysilane-based compound, and one or more crosslinking aids selected from the group consisting of an aliphatic acid and an aliphatic acid metal salt, and a method of preparing the same are provided. Further, a compound material and a masterbatch which are compositions for preparing the room temperature crosslinked type halogen-free flame retardant composition, and methods of preparing the same are provided.
    Type: Grant
    Filed: August 23, 2016
    Date of Patent: January 8, 2019
    Assignee: DYM SOLUTION CO., LTD.
    Inventors: Jong Seok Yang, Eun Ho Choi, Chan Ryoo, Baeg Yong Seong, Dong Ha Park
  • Publication number: 20180314241
    Abstract: Provided is a smart factory for production and quality management of a thermoplastic and thermosetting compound capable of predicting and controlling quality and production schedule in the future as well as monitoring a current state of factory by acquiring various types of data generated during a manufacturing process such as a manufacturing schedule, a quality condition, or the like of a manufacturing process.
    Type: Application
    Filed: April 25, 2018
    Publication date: November 1, 2018
    Applicant: DYM Solution Co., Ltd.
    Inventor: Dong Ha Park