Abstract: A fingerprint module of fingerprint identification chip is provided. The fingerprint module includes a substrate, a fingerprint identification chip, a molding layer, a color layer, and a protecting layer. The substrate includes a pair of surfaces and a plurality of pads. The surfaces are on the opposite sides of the substrate. The pads are exposed on one of the surfaces. The fingerprint identification chip electrically connects with the substrate according to at least a wire. The molding layer disposes on the substrate and covers the fingerprint identification chip and the wire. The color layer disposes on the molding layer. The protecting layer disposes on the color layer.

Abstract: A fingerprint module of fingerprint identification chip is provided. The fingerprint module includes a substrate, a fingerprint identification chip, a molding layer, a color layer, and a protecting layer. The substrate includes a pair of surfaces and a plurality of pads. The surfaces are on the opposite sides of the substrate. The pads are exposed on one of the surfaces. The fingerprint identification chip electrically connects with the substrate according to at least a wire. The molding layer disposes on the substrate and covers the fingerprint identification chip and the wire. The color layer disposes on the molding layer. The protecting layer disposes on the color layer.

Abstract: An IC chip comprises a carrier, a memory unit and a contact unit. The carrier has two opposite ends. The memory unit is mounted on one end of the carrier and has multiple parallel memory terminals. The contact unit is mounted on the other end of the carrier and has multiple contact terminals The contact terminal connects to a contact IC smart card.

Abstract: A subscriber identity module (SIM) card in accordance with the present invention expands memory, communicates wirelessly, is inserted and removed easily, adds a second cell phone number and comprises a carrier, a SIM, an expansion module. The carrier is a plastic card and comprises an expansion module recess. The plastic card has a top surface, two side edges, a front end, a rear end and two notches. The expansion module recess is formed in the top surface of the plastic card between the side edges near the front end. The SIM is mounted on the top surface of the plastic card near the rear end between the notches. The expansion module is mounted in the expansion module recess, is connected to the SIM and has a top surface, a bottom surface and four edges.