Patents Assigned to Dynamem, Inc.
  • Foldable electronic assembly module
    Patent number: 5754409
    Abstract: A foldable electronic assembly is provided with extending ears for protecting folded substrates in flexible areas and with elements between adjacent face-to-face boards to maintain selected spacing between the boards while mechanically holding adjacent boards together. Elements may also be provided in the area of the ears which are adapted to coact with a suitable tool to facilitate removal of the assembly from a mating connector.
    Type: Grant
    Filed: November 6, 1996
    Date of Patent: May 19, 1998
    Assignee: Dynamem, Inc.
    Inventor: Gary W. Smith