Abstract: An improved back-up tape for use in fusion welding metal sheets and structures is disclosed. The tape comprises a rolled refractory fiber fabric partially flattened against an adhesive coated surface of a wider, heat resistant, strip. In use, the tape is pressed against the back side of a joint or other weld line to be welded with the adhesive bonding the tape along strips parallel to but slightly spaced from the weld line and the roll pressed against the joint. Fusion welding is conducted without the addition of any filler wire. A flat weld underbead, with no molten metal drop-through is produced, with no melting or other significant change in the tape. The tape is then stripped off and the welded structure is ready for use.

Abstract: A pair of carton liner removal tongs for use in removing carton liners from cartons includes an elongated shaft portion with a knife blade like hook extending outward from one end and a looped handle at the other end extending on the opposite side of the shaft from the hook. The tongs are used in removing a liner from a carton by first inserting the hook end of the tong downward between the walls of the liner and carton on opposite sides of the liner. The handles of the respective tong members are then brought together above the carton liner and grasped by one hand for pulling the liner upward and out of the carton.

Abstract: An electrical connector having means for suppressing electromagnetic interference when the connector pins are separated from the pin sockets. To this end, each of the connector pins or each pin socket is contained in an electrically conductive housing. The housing forms an open space about and extending beyond each pin or socket. This open space forms a waveguide having a predetermined upper cutoff frequency. This cutoff frequency depends on the length of the waveguide measured from the tip of each pin or socket to the end of the waveguide and on the diameter or largest dimension of the waveguide, which may be a cylindrical waveguide. Each of the corresponding pin sockets has an outer insulation tube which fits into the open waveguide. Further, each pin socket is provided with a spring contact for making electrical connection to the respective connector pins. The cutoff frequency of the waveguide is selected to be substantially above the highest frequency of the expected electromagnetic interference.

Abstract: Solar energy collectors, devices and systems utilizing selective solar absorbers for more efficient collection of radiant energy from the sun and its conversion to useful form at relatively high heat transfer temperatures. Each collector unit is made up solely of a closed shell-like enclosure having a continuous, unpenetrated boundary wall evacuated and hermetically sealed to form a structurally strong radiation collecting chamber whose boundary wall surrounds a rarified atmosphere environment such as a vacuum, the wall having a window portion which transmits substantially all of the received solar spectrum to a selective solar radiation absorber in the chamber and energy derived therefrom is collected at any energy collecting and transferring portion of the wall from which heat is conducted to the exterior.

Abstract: Carriers forming strips for semiconductor integrated circuit chips. The carrier consists basically of a flexible tape, such as a polyimide. A conductive sheet, such as a copper sheet, is initially prepared to form a lead circuit on one surface and a bump circuit on the other. This metal sheet may be gold plated. Subsequently, a layer of polyimide is applied to the lead circuit side and both the polyimide sheet and the opposite bump circuit are covered with a metal sheet, such as copper. A photoresist layer is put over the copper and is suitably illuminated and developed to provide apertures through which the copper can be etched to expose the polyimide sheet. This takes place over the windows or openings adjacent the bumps for the application of a heat ram as well as for the sprocket holes used for precisely aligning the carrier with the to-be-associated semiconductor chips. Finally, openings may also be provided to separate adjacent carrier strips from each other.

Abstract: Inspection for hole quality in structures is enhanced by inserting a smooth, thin-wall hollow sleeve into a hole to be tested and moving an eddy current probe within the sleeve. Mechanization is improved by apparatus which inserts and holds the sleeve in the hole and has drive means operable so as independently to rotate the probe or move it linearly, or both, within the stationary sleeve.

Abstract: A process for manufacturing a carrier for semiconductor devices such as integrated chips. The carrier conventionally comprises, on one surface, a lead circuit providing leads to the conduction pads of the semiconductor devices. The other side may be called a bump circuit and includes bonding pads or bumps to contact corresponding elements of the semiconductor devices. Small size bumps are made by applying the etching solution only to the lead circuit which has previously been coated with photoresist as well as the bump circuit. Eventually, the etching solution will run over the bump circuit, thereby to create bumps or pads without reducing the thickness of the lead circuit to less than about 2 mils thickness. The resulting carrier may then be polished and covered with a layer of nickel and a layer of gold.

Abstract: This invention relates to a transport wheel assembly for a tillage type agricultural implement having at least two pairs of ground support wheels mounted on the frame section of the implement. Each wheel of the pair is journaled in a separate axle mounted on the end of a pivot arm with the pivot arms being mounted in spaced shafts journaled on the implement frame. The shafts are separated longitudinally of the implement frame or across the width of the same to space the wheels longitudinally apart, and they are also separated in a fore and aft direction of the implement frame. The shafts of each pair are tied together through a hydraulic actuator which acts as a linkage to transmit motion from one wheel to the other when the implement traverses uneven terrain. The actuator in one position pivots the wheels in close proximity in the fore and aft direction for stability in turns and raising the implement and hence the ground working tools above ground level for transport.

Abstract: An inertial guidance system including a true space stable platform is provided while retaining a simple two-degree-of-freedom gimbal system. An added third degree of freedom is provided by motions of the support itself which maintains desired platform orientation. The output of a third axis instrument is used to maneuver the frame itself about the axis of the frame which most nearly will null any rotation about the platform roll or longitudinal axis. A rotational rate gyroscope is positioned on the space stable platform, and actuates the movement of the frame about the longitudinal or roll axis directly from the reading of the rotational movement along the roll axis of the platform.

Abstract: A system of vibration-absorbing, height-adjustable, force-sensing components, adapted to be incorporated in support members of a unit of industrial equipment to enable precise alignment and balancing of such equipment, to minimize noise generated thereby and to achieve greater precision and efficiency by fine tuning the performance thereof. The system has cooperating load indicating means which provide for read-out of forces exerted on the respective support members. Additionally, the system may include means for indicating power consumption during operation. When the equipment is at rest, static load forces are indicated. Applicant's system permits preliminary adjustment for balancing load distribution when the equipment is at rest. Then, during operation, further adjustments may be made, based upon monitoring of read-outs of dynamic and enertia forces and power consumption, in order to obtain optimum stability, alignment, damping of vibration and shock, and noise control.

Abstract: A process for manufacturing printed circuit boards having plated through-holes. An epoxy glass substrate is laminated on opposite surfaces by a thin copper foil and subsequently apertures are drilled through the laminated substrate where the plated through-holes are desired. The exposed surfaces of the apertures are electroless copper plated. Then by means of a photoresist, the desired circuit images and the apertures are exposed and the initial electroless copper plating is removed again. The apertures and the desired circuit images are again plated by electroless copper plating to establish an initial copper thickness. The apertures in the desired circuit images are then electro-copper plated to the approximate thickness of the photoresist and preferably so that their thickness is less than the thickness of the photoresist. The copper plating is then electro-solder plated.

Abstract: There is disclosed an annunciator for verbalizing altitude-related messages during the descent of an aircraft. Announcements such as "nine hundred," "eight hundred," etc. are made as the aircraft descends through respective "hundreds" levels; such announcements are not made during an ascent. In addition, the word "terrain" is heard when the aircraft descends through the 2,000-foot and 1,000-foot levels, and the word "minimum" is heard when the aircraft drops below a "decision height" selected by the pilot. Lastly, the word "glideslope" is out-putted in response to the detection of a glideslope deviation, the frequency of this announcement as well as its volume being a function of the magnitude of the deviation.

Abstract: A rear door for a rocket launch tube provided to prevent rocket exhaust gas flow into an empty launch tube from an associated multiple-rocket plenum chamber. The door is maintained in a stored position while a missile is in the launch tube and is activated when the missile leaves the launcher. The door may be latched open and released by a sensor device at a selected position of the missile as it is leaving the launch tube. Preferably, gases from the launching missile power closure of the door, once the door is released from its open latched position. Once the door closes, a second latch locks it in place to seal off the launch tube from the plenum chamber.

Abstract: A method and circuit for reducing by electrical runout subtraction, the runout signal portion of a composite runout signal and vibration signal, which runout subtraction signal is provided by a pre-programmed digital memory circuit module, PROM, that is selectively inserted into the circuit for a given rotating shaft. The PROM is accessed by a phase lock loop, master dynamic clock, synchronized to the tachometer signal, which provides the subtract signal in digital form that is changed to an analog signal and then fed with the composite signal to a differential amplifier circuit that subtracts the PROM waveform from the composite signal. In one mode the subtract amplifier circuit is inhibited in operation when the tachometer signal falls below a given CPM, or when the tachometer signal is lost.

Abstract: Method and circuit for detecting the slow roll electrical runout signal of a rotating shaft, as synchronized with a tachometer signal, and impressing this signal waveform in digital form in a memory in an encoding section, and subsequently transferring the digital runout information to a programmed read only memory module, and then using the PROM module in a method and circuit for subtracting electrical runout signals from the composite electrical runout signal and vibration signal generated in a proximity probe circuit by the shaft rotating at operational speed, and monitoring and controlling the encode section to provide low frequency detection lock out circuits and to provide digital readout of the instantaneous mils peak of the composite signal outputs of the subtract runout signal, composite signal and corrected signal.

Abstract: A harmonic converting or generating material, particularly adapted for use as chaff in decoy rounds, and a method of fabricating the same. The material is formed from metallic foil to have the characteristics of a dipole and which by the addition to the midpoint thereof of semiconductor or other polarizable material has the capability of reradiating incident frequencies along with radiating harmonics thereof or undesirable noise. Thus, the passive material, when activated by an active source, such as a radar unit, serves to convert or generate spurious frequencies, harmonics and noise, in addition to reradiating the fundamental frequency of the active energy source, thus giving the illusion of a plurality of independent energy sources.

Abstract: A liquefied gas tank having thermal insulation in association with a fluidtight body. A liquid supply line terminates at a location within the upper half of said vessel and discharges into a vertical draft-tube which is in fluid communication with the ullage portion of the vessel. The liquefied gas which is supplied into the draft-tube is conditioned to the pressure and temperature within the vessel as it travels downward to the bottom before it can flow radially outward into the tank.

Abstract: A process for electroforming a bump circuit and a lead circuit on a tape to be used for making contact with integrated circuit chips and the like. By means of the process, an inverse bump pattern is produced. To this end, a first metal plate is coated with a photoresist on one surface and suitable apertures are made in the photoresist in a conventional manner. Now indentations are chemically etched, partly through the uncovered metal surface to form a bump circuit. Next the photoresist is completely removed and the metal plate is again covered with a layer of photoresist. After the photoresist is developed again to form a lead circuit, the metal is chemically etched partly through the uncovered metal to form a lead circuit while at the same time further etching the bump circuit indentations. These indentations are now covered with metal by various plating steps. For example, the indentations may be covered successively with layers of gold, nickel, copper, and an additional layer of gold.