Abstract: An oven includes a plurality of pairs of upper and lower spaced non-focused infrared heater panels. Product is conveyed between these panels to effect solder reflow. To increase heat transfer and to achieve temperature uniformity, air is forced through equally spaced holes drilled in the insulating block of one or more upper heating panels. To define an equal flow through these holes, a valve is placed below the air intake opening to define an annular opening between the panel casing and the valve. The valve has openings having an area which is matched to the annular area between the casing and the valve.

Abstract: A processing vessel has two adjacent tanks each holding different electronic liquids. When heated the first will generate saturated vapor having a temperature below the liquidus temperature of eutectic solder and the second, when heated, will generate saturated vapor having a temperature above the liquidus temperature of eutectic solder. Work product is sequentially passed through these vapors and is first preheated and then reflowed.

Abstract: A soldering system for applying molten solder to a work product. The system includes a solder applicator having a cylindrical barrel having an elongated orifice wall extending parallel to the axis of the barrel and a nozzle secured to the barrel. The nozzle which has an elongated orifice surface can be from a first position whereat the orifice surface and the orifice wall define an elongated orifice having a selected opening to a second position whereat the opening is substantially enlarged.

Abstract: A vapor processing system has a vessel for containing a processing vapor into which work product is conveyed for processing. A thermocouple probe generates a signal representative of the actual temperature at one of at least a plurality of spaced locations within the vessel. The probe has a shaft portion and a free end portion defining an angle with the shaft portion and is adapted to be rotatively displaced about the shaft portion to locate the tip of the probe at a selected location around its displacement circle.

Abstract: A vapor phase processing machine is disclosed. The machine has an open tank which is sealed by a lid assembly which is universally free to move within selected limits established between the lid assembly and the closure arm to which it is secured.

Abstract: A machine for soldering a work product. Work product is conveyed through the machine and an applicator directs an extended liquid stream against the conveyed work product. The applicator is rotatable about a horizontal axis and a rotatable manifold assembly delivers liquid to the applicator and the manifold assembly is rotatable about an axis parallel to the axis of the applicator means and is rotated by a bell crank which is supported for rotation about the axis of the manifold assembly and a link member which is pivotally connected between the bell crank and the applicator with the points of interconnection defining with the axes of rotation of the applicator and the manifold assembly a parallelogram so that rotation of the bell crank will rotate the applicator means.

Abstract: A machine for soldering a work product. A solder applicator is located within a zone of saturated vapor to direct an extended stream of molten solder against a work product conveyed through the machine. Molten solder can be drained from the applicator by pivoting the applicator about a horizontal axis to a drain orientation. The applicator includes an end plate having an axially extending hole communicating with the lowermost portion of the solder within the applicator when the applicator has the drain orientation and the applicator includes an end plate having a hole extending axially therethrough at a location in alignment with the applicator end plate hole when the applicator end plate has the drain orientation. The applicator end plate hole is sealed when the holes are not in alignment.

Abstract: A vessel contains a volume of solder and a volume of electronic liquid floats on the solder. A heater heats the electronic liquid to generate a zone of saturated vapor and to transfer heat to the solder across the interface therebetween. Hot saturated vapor is drawn downwardly through a manifold in the solder. To heat the solder, means for conveying work product to the saturated vapor zone, and molten solder is applied to work product which is conveyed through the saturated vapor zone.

Abstract: A continuous vapor phase processing machine of the type wherein work is selectively heated by a processing vapor in a processing vapor zone to a selected temperature for vapor phase processing. The machine has a tank containing a processing vapor, and a throat is in communication with the tank. The throat communicates with the air, and cooling coils extend along at least a portion of the throat. Openings are defined in the throat across the throat at a location substantially spaced from the outer end of the throat and a manifold communicates with these openings. Means are connected to the manifold for drawing air from the throat through the openings defined in the throat and for removing processing vapor therefrom, the flow of air being drawn into the throat through the throat exit aperture and being pulled through the opening comprising a barrier to the flow of processing vapor to the throat exit aperture.