Abstract: An apparatus and method for breaking a semiconductor wafer along scribe lines to separate individual die. A scribe line of the wafer is aligned with a straight, elongated pyramid-shaped edge of a precision bending bar, and a compressive force is applied to the surface of the wafer by a compressive member to bend the wafer over the edge and break the wafer along the scribe line.

Abstract: Apparatus for automatic scribing and breaking of semiconductor wafers wherein scribing is performed at a scribing station and the scribed wafer transported in the X direction to a breaking station on an X-Y table. Scribing and breaking of parallel lines is accomplished by transporting the wafer step-wise in the Y direction by the Y table. Rotation of the wafer for scribing and breaking along sets of lines perpendicular to one another is accomplished by a theta table carried on the Y table. An impulse bar is carried by the X table for applying force to the bottom surface of the wafer during both scribing and breaking. In one embodiment, upward movement of the wafer during breaking is resisted by an anvil positioned above the wafer. In a second embodiment, such upward movement is resisted by a vacuum chuck beneath the wafer, to avoid contact with the upper wafer surface.

Abstract: In a plating process for constructing a nickel/embedded abrading particle saw blade on a saw blade substrate, the step of plating abrading particles onto and within the supporting copper substrate is disclosed. The beveled edge of a circular aluminum saw blade blank is first coated with a thin zinc layer. Thereafter, copper and abrading particles are plated followed by conventional abrading particle and nickel plating. Conventional material removal thereafter follows at the saw blade side adjacent the circular saw blade blank, saw blade edge, and copper layer. With removal of the copper layer, abrading particles originally partially embedded in the copper layer are exposed for cutting. The need for electro-polishing and garnating is eliminated in so far as exposure of abrading particles is concerned. The final saw blade product produced has uniform cutting edges on both sides with less likelihood of producing edge fractures, chips, or cracks in silicon wafers during separation.

Abstract: In a plating process for constructing a nickel embedded abrading particle saw blade on a saw blade substrate, the step of plating abrading particles onto and within the supporting copper substrate is disclosed. The beveled edge of a circular aluminum saw blade blank is first coated with a thin zinc layer. Thereafter, copper and abrading particles are plated followed by conventional abrading particle and nickel plating. Conventional material removal thereafter follows at the saw blade side adjacent the circular saw blade blank, saw blade edge, and copper layer. With removal of the copper layer, abrading particles originally partially embedded in the copper layer are exposed for cutting. The need for electro-polishing and garnating is eliminated in so far as exposure of abrading particles is concerned. The final saw blade product produced has uniform cutting edges on both sides with less likelihood of producing edge fractures, chips, or cracks in silicon wafers during separation.