Patents Assigned to Dynea Chemicals Oy
-
Patent number: 9102040Abstract: The present invention provides process for the manufacture of an aqueous resin composition comprising a phenolic formaldehyde (PF) resin, which process comprises the steps of providing a formaldehyde and phenolic compound, reacting the compounds in a condensation reaction in the presence of a catalyst, after completion of the condensation reaction to react with free formaldehyde, determining the free formaldehyde content of the resin composition, adding a pre-calculated substantially stoichiometric amount of modifying compound containing a primary amine group to reduce the amount of free formaldehyde in the resin composition to less than 0.1 wt % (relative to the total weight of the aqueous resin composition), and optionally distillation of the reaction product.Type: GrantFiled: September 30, 2011Date of Patent: August 11, 2015Assignee: Dynea Chemicals OyInventor: Armin Tumler
-
Publication number: 20130232884Abstract: The present invention provides process for the manufacture of an aqueous resin composition comprising a phenolic formaldehyde (PF) resin, which process comprises the steps of: providing a formaldehyde and phenolic compound, reacting said compounds in a condensation reaction in the presence of a catalyst, after completion of the condensation reaction to react with free formaldehyde, determining the free formaldehyde content of the resin composition, adding a pre-calculated substantially stoichiometric amount of modifying compound containing a primary amine group to reduce the amount of free formaldehyde in the resin composition to less than 0.1 wt % (relative to the total weight of the aqueous resin composition), and optionally distillation of the reaction product.Type: ApplicationFiled: September 30, 2011Publication date: September 12, 2013Applicant: Dynea Chemicals OyInventor: Armin Tumler
-
Patent number: 7419519Abstract: An abrasive composition comprising composite non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The composite particles individually contain at least one nonpolymeric organic component and at least one other chemical component different from the at least one nonpolymeric organic component. The slurry composition can be vastly simplified if one or more of the components are incorporated into the abrasive particles. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.Type: GrantFiled: January 5, 2006Date of Patent: September 2, 2008Assignee: Dynea Chemicals OyInventors: Yuzhuo Li, Kwok Tang, Wu Li, Guomin Bian, Krishnayya Cheemalapati, Vivek Duvvuru, Deenesh Bundi, Henry Bian
-
Patent number: 7141193Abstract: Method for spectroscopically monitoring resin applied to a planar surface of veneer-wood sheets during travel in an assembly line. Spectroscopic instrumentation for monitoring applied resin is calibrated by measurements of predetermined resin applications to reference-test-samples, so as to provide a pre-determined relationship enabling monitoring of applied resin, during commercial production of a veneer-wood product using the visible light spectrum and near infrared extending to 2500 nm. Monitoring of selected radiation absorbance by the applied resin is carried out by spectroscopic measurement of non-absorbed electromagnetic radiation, as reflected back by the wood-veneer matrix; selected wavelengths are utilized for determining average resin-weight per designated surface area of a sheet.Type: GrantFiled: July 6, 2005Date of Patent: November 28, 2006Assignee: Dynea Chemicals OyInventors: Reginald A. Mbachu, Tyler G. Congleton
-
Publication number: 20060261306Abstract: An abrasive composition comprising composite non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The composite particles individually contain at least one nonpolymeric organic component and at least one other chemical component different from the at least one nonpolymeric organic component. The slurry composition can be vastly simplified if one or more of the components are incorporated into the abrasive particles. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.Type: ApplicationFiled: January 5, 2006Publication date: November 23, 2006Applicant: DYNEA CHEMICALS OYInventors: Yuzhuo Li, Kwok Tang, Wu Li, Guomin Bian, Krishnayya Cheemalapati, Vivek Duvvuru, Deenesh Bundi, Henry Bian
-
Patent number: 7128867Abstract: Process for calibration of spectroscopic instrumentation for non-invasive monitoring of resin-loading of furnish-type wood materials, such as particles or fibers for particleboard or medium density fiberboard, respectively. Selection of ranges of wavelengths within a 350 nm to 2500 nm region by providing selection of spectrometers and sensors for wavelength ranges of 350–1000 nm, 1000 to 1800 nm, 1000 to 2500 nm, and 400 to 2200 nm, for use by engineered-wood manufacturing installations. Resin-loaded wood material is exposed to selected VIS/NIR energy and monitored as it moves on-line in relation to calibrated spectroscopic instrumentation; a sensor collects non-absorbed radiation energy reflected by the wood materials. Measurements are processed, in relation to pre-established calibration data, to determine whether the resin-loading is within manufacturing objectives; monitoring and feedback are used to maintain desired specifications.Type: GrantFiled: December 10, 2004Date of Patent: October 31, 2006Assignee: Dynea Chemicals OyInventors: Reginald A. Mbachu, Tyler G. Congleton
-
Publication number: 20060138709Abstract: Process and apparatus for non-invasive measuring of binder mix loading of glass fibers for monitoring production of construction insulation product, such as roofing and wall insulation. The process utilizes visible (VIS) and near infrared (NIR) spectroscopy; and, is particularly advantageous when utilized in an on-line production processing following binder mix loading of glass fibers and prior to curing treatment of the binder mix loaded glass fibers. Such spectroscopic analyses can be carried out on a static or moving support substrate. The blend is then conveyed to and through curing treatment to form insulation product. The blend is exposed to VIS-NIR radiant energy, and a radiant energy sensor collects resulting data as to absorption following penetration of the VIS-NIR radiant energy. The spectroscopic instrumentation is calibrated to determine to facilitate accuracy; and, can be used to verify load following curing.Type: ApplicationFiled: February 17, 2006Publication date: June 29, 2006Applicant: Dynea Chemicals OYInventor: Reginald Mbachu
-
Patent number: 7037351Abstract: An abrasive composition comprising non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The inventive compositions preferably comprise soft water in combination with 0.001–20 w/w % of non-polymeric organic particles, 0.1–10 w/w % of an oxidizing agent, 0.05–10 w/w % of a chelating agent, 0.01–10 w/w % of a surfactant, and 0–10 w/w % of a passivation agent at a pH in the range of 2–12, wherein said percentages are w/w (weight/weight) percentages, based on the total weight of said compositions. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.Type: GrantFiled: December 15, 2003Date of Patent: May 2, 2006Assignee: Dynea Chemicals OyInventors: Yuzhuo Li, Atanu Roy Chowdhury, Kwok Tang, Guomin Bian, Krishnayya Cheemalapati
-
Patent number: 6962625Abstract: A device for application of a liquid gluing system comprising at least two components, such as a resin component and a hardener component, the device comprising at least two hollow members (11, 11?), each member being provided with a row of orifices designed to apply the respective components onto a substrate (6) below the hollow members (11, 11?), and at least two trays (2, 2?) one tray below each of the hollow members to receive surplus of the respective component not being applied onto the substrate, wherein the hollow members (11, 11?) are adapted to be placed in the respective tray (2, 2?) having the orifices below the level of the liquid in the tray. A method for avoiding plugging of the orifices in the hollow member during a stop in application is also described.Type: GrantFiled: December 3, 2003Date of Patent: November 8, 2005Assignee: Dynea Chemicals OyInventor: Ronny Bredesen
-
Publication number: 20050241743Abstract: Method for spectroscopically monitoring resin applied to a planar surface of veneer-wood sheets during travel in an assembly line. Spectroscopic instrumentation for monitoring applied resin is calibrated by measurements of predetermined resin applications to reference-test-samples, so as to provide a pre-determined relationship enabling monitoring of applied resin, during commercial production of a veneer-wood product using the visible light spectrum and near infrared extending to 2500 nm. Monitoring of selected radiation absorbance by the applied resin is carried out by spectroscopic measurement of non-absorbed electromagnetic radiation, as reflected back by the wood-veneer matrix; selected wavelengths are utilized for determining average resin-weight per designated surface area of a sheet.Type: ApplicationFiled: July 6, 2005Publication date: November 3, 2005Applicant: DYNEA Chemicals OYInventors: Reginald Mbachu, Tyler Congleton
-
Patent number: 6946502Abstract: The present invention concerns a paint composition which comprises a binder, a coalescent agent and optionally admixtures and auxiliary agents known per se. The film forming agent comprises a glycidyl ether or glycidyl ester or a mixture thereof, the hydrocarbyl residue of the alcohol or carboxylic acid, respectively, of the ether or ester comprising a linear or branched, saturated or unsaturated hydrocarbon having 3 to 20 carbon atoms. The invention further concerns a method of accelerating the hardening of paint compositions and a novel method of preparing glycidyl esters. The film forming agents used in the invention lower the film forming temperature better than conventional reactive film forming agents. Due to low volatility the compounds are suitable for no-VOC applications.Type: GrantFiled: January 18, 2000Date of Patent: September 20, 2005Assignee: Dynea Chemicals OyInventors: Maarit Lahtinen, Kari Rissanen, Salme Koskimies, Karri Airola, Robert Jansson
-
Patent number: 6942826Abstract: Method for spectroscopically monitoring resin applied to a planar surface of veneer-wood sheets during travel in an assembly line. Spectroscopic instrumentation for monitoring applied resin is calibrated by measurements of predetermined resin applications to reference-test-samples, so as to provide a pre-determined relationship enabling monitoring of applied resin, during commercial production of a veneer-wood product using the visible light spectrum and near infrared extending to 2500 nm. Monitoring of selected radiation absorbance by the applied resin is carried out by spectroscopic measurement of non-absorbed electromagnetic radiation, as reflected back by the wood-veneer matrix; selected wavelengths are utilized for determining average resin-weight per designated surface area of a sheet.Type: GrantFiled: March 11, 2004Date of Patent: September 13, 2005Assignee: DYNEA Chemicals OyInventors: Reginald A. Mbachu, Tyler G. Congleton
-
Publication number: 20050140037Abstract: Calibrating visual (VIS) and near infra red (NIR) spectroscopic instrumentation for quantitative measurement of resin-loading of prepared wood materials, as moving in an assembly-forming line, for subsequent pressing under heat and pressure for manufacture of engineered-composite wood product. Feedback of measured data of resin-loading, during in-line assembly operations, enables maintaining consistent resin-loading and optimizes resin usage. Calibration of VIS/NIR spectroscopic instrumentation can be carried out on equipment simulating in-line movement of pre-established reference-source test-samples; or, can be carried out during on-line movement of wood-material test samples. The developed calibration method removes absorptive effects at wavelengths for constituents other than resin, such as the moisture content of the wood-materials and of the resin, while maintaining accurate and prompt VIS/NIR spectroscopic measurements of resin-loading in a continuous assembly line.Type: ApplicationFiled: December 13, 2004Publication date: June 30, 2005Applicant: Dynea Chemicals OYInventors: Reginald Mbachu, Tyler Congleton
-
Publication number: 20050101024Abstract: Process for calibration of spectroscopic instrumentation for non-invasive monitoring of resin-loading of furnish-type wood materials, such as particles or fibers for particleboard or medium density fiberboard, respectively. Selection of ranges of wavelengths within a 350 nm to 2500 nm region by providing selection of spectrometers and sensors for wavelength ranges of 350-1000 nm, 1000 to 1800 nm, 1000 to 2500 nm, and 400 to 2200 nm, for use by engineered-wood manufacturing installations. Resin-loaded wood material is exposed to selected VIS/NIR energy and monitored as it moves on-line in relation to calibrated spectroscopic instrumentation; a sensor collects non-absorbed radiation energy reflected by the wood materials. Measurements are processed, in relation to pre-established calibration data, to determine whether the resin-loading is within manufacturing objectives; monitoring and feedback are used to maintain desired specifications.Type: ApplicationFiled: December 10, 2004Publication date: May 12, 2005Applicant: Dynea Chemicals OYInventors: Reginald Mbachu, Tyler Congleton
-
Patent number: 6846447Abstract: Process for calibration of spectroscopic instrumentation for non-invasive monitoring of resin-loading of furnish-type wood materials, such as particles or fibers for particleboard or medium density fiberboard, respectively. Selection of ranges of wavelengths within a 350 nm to 2500 nm region by providing selection of spectrometers and sensors for wavelength ranges of 350-1000 nm, 1000 to 1800 nm, 1000 to 2500 nm, and 400 to 2200 nm, for use by engineered-wood manufacturing installations. Resin-loaded wood material is exposed to selected VIS/NIR energy and monitored as it moves on-line in relation to calibrated spectroscopic instrumentation; a sensor collects non-absorbed radiation energy reflected by the wood materials. Measurements are processed, in relation to pre-established calibration data, to determine whether the resin-loading is within manufacturing objectives; monitoring and feedback are used to maintain desired specifications.Type: GrantFiled: January 7, 2003Date of Patent: January 25, 2005Assignee: Dynea Chemicals OyInventors: Reginald A. Mbachu, Tyler G. Congleton
-
Patent number: 6846446Abstract: Calibrating near infra red (NIR) spectroscopic instrumentation for quantitative measurement of resin-loading of prepared wood materials, as moving in an assembly-forming line, for subsequent pressing under heat and pressure for manufacture of engineered-composite wood product. Feedback of measured data of resin-loading, during in-line assembly operations, enables maintaining consistent resin-loading and optimizes resin usage. Calibration of NIR spectroscopic instrumentation can be carried out on equipment simulating in-line movement of pre-established reference-source test-samples; or, can be carried out during on-line movement of wood-material test samples. The developed calibration method removes absorptive effects at wavelengths for constituents other than resin, such as the moisture content of the wood-materials and of the resin, while maintaining accurate and prompt NIR spectroscopic measurements of resin-loading in a continuous assembly line.Type: GrantFiled: November 14, 2002Date of Patent: January 25, 2005Assignee: Dynea Chemical OyInventors: Reginald A. Mbachu, Tyler G. Congleton
-
Patent number: 6593502Abstract: The invention relates to a process for the preparation of polyols having 3 or 4 hydroxyl groups, from an aldehyde and formaldehyde in the presence of water, followed by hydrogenation of the aldolisation product in the presence of a hydrogenation catalyst at an elevated temperature. The aledhyde is obtained by an aldolisation reaction of an aldehyde having at least two &agr;-hydrogen atoms and a formula according to R1CH2CHO, wherein R1 is selected from a group comprising hydrogen, alkyl groups having 1-7 carbon atoms which can have cycloalkyl substituents, cycloalkyl groups, aryl groups and aralkyl groups with 1-7 carbon atoms is the alkyl chain, with formaldehyde in the presence of water in an amount of 20-70 wt %, preferably 40-60 wt % and in the presence of an anion exchange resin. The hydrogenation is preferably carried out in the presence of water.Type: GrantFiled: January 2, 2002Date of Patent: July 15, 2003Assignee: Dynea Chemicals OyInventors: Tapio Salmi, Valentina Serra-Holm, Tiina-Kaisa Rantakylä, Päivi Mäki-Arvela, Lars-Peter Lindfors, Hannu Nousiainen
-
Patent number: 6489392Abstract: A foamed resin adhesive and its use for glueing wood based panels and boards such as plywood. The adhesive comprises 40-80% of an aqueous resin solution, 2-10% of an organic filler or fillers, 1-10% of a cationic acrylamide copolymer, and 0.05-1% of a surface active agent.Type: GrantFiled: September 8, 2000Date of Patent: December 3, 2002Assignee: Dynea Chemicals OyInventors: Esa Lappalainen, Niko Musakka
-
Publication number: 20020151754Abstract: The invention relates to a process for the preparation of polyols having 3 or 4 hydroxyl groups, from an aldehyde and formaldehyde in the presence of water, followed by hydrogenation of the aldolisation product in the presence of a hydrogenation catalyst at an elevated temperature. The aledhyde is obtained by an aldolisation reaction of an aldehyde having at least two &agr;-hydrogen atoms and a formula according to R1CH2CHO, wherein R1 is selected from a group comprising hydrogen, alkyl groups having 1-7 carbon atoms which can have cycloalkyl substituents, cycloalkyl groups, aryl groups and aralkyl groups with 1-7 carbon atoms is the alkyl chain, with formaldehyde in the presence of water in an amount of 20-70 wt %, preferably 40-60 wt % and in the presence of an anion exchange resin. The hydrogenation is preferably carried out in the presence of water.Type: ApplicationFiled: January 2, 2002Publication date: October 17, 2002Applicant: Dynea Chemicals OyInventors: Tapio Salmi, Valentina Serra-Holm, Tiina-Kaisa Rantakyla, Paivi Maki-Arvela, Lars-Peter Lindfors, Hannu Nousiainen