Patents Assigned to Dynea Chemicals Oy
  • Patent number: 9102040
    Abstract: The present invention provides process for the manufacture of an aqueous resin composition comprising a phenolic formaldehyde (PF) resin, which process comprises the steps of providing a formaldehyde and phenolic compound, reacting the compounds in a condensation reaction in the presence of a catalyst, after completion of the condensation reaction to react with free formaldehyde, determining the free formaldehyde content of the resin composition, adding a pre-calculated substantially stoichiometric amount of modifying compound containing a primary amine group to reduce the amount of free formaldehyde in the resin composition to less than 0.1 wt % (relative to the total weight of the aqueous resin composition), and optionally distillation of the reaction product.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: August 11, 2015
    Assignee: Dynea Chemicals Oy
    Inventor: Armin Tumler
  • Publication number: 20130232884
    Abstract: The present invention provides process for the manufacture of an aqueous resin composition comprising a phenolic formaldehyde (PF) resin, which process comprises the steps of: providing a formaldehyde and phenolic compound, reacting said compounds in a condensation reaction in the presence of a catalyst, after completion of the condensation reaction to react with free formaldehyde, determining the free formaldehyde content of the resin composition, adding a pre-calculated substantially stoichiometric amount of modifying compound containing a primary amine group to reduce the amount of free formaldehyde in the resin composition to less than 0.1 wt % (relative to the total weight of the aqueous resin composition), and optionally distillation of the reaction product.
    Type: Application
    Filed: September 30, 2011
    Publication date: September 12, 2013
    Applicant: Dynea Chemicals Oy
    Inventor: Armin Tumler
  • Patent number: 7419519
    Abstract: An abrasive composition comprising composite non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The composite particles individually contain at least one nonpolymeric organic component and at least one other chemical component different from the at least one nonpolymeric organic component. The slurry composition can be vastly simplified if one or more of the components are incorporated into the abrasive particles. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.
    Type: Grant
    Filed: January 5, 2006
    Date of Patent: September 2, 2008
    Assignee: Dynea Chemicals Oy
    Inventors: Yuzhuo Li, Kwok Tang, Wu Li, Guomin Bian, Krishnayya Cheemalapati, Vivek Duvvuru, Deenesh Bundi, Henry Bian
  • Patent number: 7141193
    Abstract: Method for spectroscopically monitoring resin applied to a planar surface of veneer-wood sheets during travel in an assembly line. Spectroscopic instrumentation for monitoring applied resin is calibrated by measurements of predetermined resin applications to reference-test-samples, so as to provide a pre-determined relationship enabling monitoring of applied resin, during commercial production of a veneer-wood product using the visible light spectrum and near infrared extending to 2500 nm. Monitoring of selected radiation absorbance by the applied resin is carried out by spectroscopic measurement of non-absorbed electromagnetic radiation, as reflected back by the wood-veneer matrix; selected wavelengths are utilized for determining average resin-weight per designated surface area of a sheet.
    Type: Grant
    Filed: July 6, 2005
    Date of Patent: November 28, 2006
    Assignee: Dynea Chemicals Oy
    Inventors: Reginald A. Mbachu, Tyler G. Congleton
  • Publication number: 20060261306
    Abstract: An abrasive composition comprising composite non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The composite particles individually contain at least one nonpolymeric organic component and at least one other chemical component different from the at least one nonpolymeric organic component. The slurry composition can be vastly simplified if one or more of the components are incorporated into the abrasive particles. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.
    Type: Application
    Filed: January 5, 2006
    Publication date: November 23, 2006
    Applicant: DYNEA CHEMICALS OY
    Inventors: Yuzhuo Li, Kwok Tang, Wu Li, Guomin Bian, Krishnayya Cheemalapati, Vivek Duvvuru, Deenesh Bundi, Henry Bian
  • Patent number: 7128867
    Abstract: Process for calibration of spectroscopic instrumentation for non-invasive monitoring of resin-loading of furnish-type wood materials, such as particles or fibers for particleboard or medium density fiberboard, respectively. Selection of ranges of wavelengths within a 350 nm to 2500 nm region by providing selection of spectrometers and sensors for wavelength ranges of 350–1000 nm, 1000 to 1800 nm, 1000 to 2500 nm, and 400 to 2200 nm, for use by engineered-wood manufacturing installations. Resin-loaded wood material is exposed to selected VIS/NIR energy and monitored as it moves on-line in relation to calibrated spectroscopic instrumentation; a sensor collects non-absorbed radiation energy reflected by the wood materials. Measurements are processed, in relation to pre-established calibration data, to determine whether the resin-loading is within manufacturing objectives; monitoring and feedback are used to maintain desired specifications.
    Type: Grant
    Filed: December 10, 2004
    Date of Patent: October 31, 2006
    Assignee: Dynea Chemicals Oy
    Inventors: Reginald A. Mbachu, Tyler G. Congleton
  • Publication number: 20060138709
    Abstract: Process and apparatus for non-invasive measuring of binder mix loading of glass fibers for monitoring production of construction insulation product, such as roofing and wall insulation. The process utilizes visible (VIS) and near infrared (NIR) spectroscopy; and, is particularly advantageous when utilized in an on-line production processing following binder mix loading of glass fibers and prior to curing treatment of the binder mix loaded glass fibers. Such spectroscopic analyses can be carried out on a static or moving support substrate. The blend is then conveyed to and through curing treatment to form insulation product. The blend is exposed to VIS-NIR radiant energy, and a radiant energy sensor collects resulting data as to absorption following penetration of the VIS-NIR radiant energy. The spectroscopic instrumentation is calibrated to determine to facilitate accuracy; and, can be used to verify load following curing.
    Type: Application
    Filed: February 17, 2006
    Publication date: June 29, 2006
    Applicant: Dynea Chemicals OY
    Inventor: Reginald Mbachu
  • Patent number: 7037351
    Abstract: An abrasive composition comprising non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The inventive compositions preferably comprise soft water in combination with 0.001–20 w/w % of non-polymeric organic particles, 0.1–10 w/w % of an oxidizing agent, 0.05–10 w/w % of a chelating agent, 0.01–10 w/w % of a surfactant, and 0–10 w/w % of a passivation agent at a pH in the range of 2–12, wherein said percentages are w/w (weight/weight) percentages, based on the total weight of said compositions. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.
    Type: Grant
    Filed: December 15, 2003
    Date of Patent: May 2, 2006
    Assignee: Dynea Chemicals Oy
    Inventors: Yuzhuo Li, Atanu Roy Chowdhury, Kwok Tang, Guomin Bian, Krishnayya Cheemalapati
  • Patent number: 6962625
    Abstract: A device for application of a liquid gluing system comprising at least two components, such as a resin component and a hardener component, the device comprising at least two hollow members (11, 11?), each member being provided with a row of orifices designed to apply the respective components onto a substrate (6) below the hollow members (11, 11?), and at least two trays (2, 2?) one tray below each of the hollow members to receive surplus of the respective component not being applied onto the substrate, wherein the hollow members (11, 11?) are adapted to be placed in the respective tray (2, 2?) having the orifices below the level of the liquid in the tray. A method for avoiding plugging of the orifices in the hollow member during a stop in application is also described.
    Type: Grant
    Filed: December 3, 2003
    Date of Patent: November 8, 2005
    Assignee: Dynea Chemicals Oy
    Inventor: Ronny Bredesen
  • Publication number: 20050241743
    Abstract: Method for spectroscopically monitoring resin applied to a planar surface of veneer-wood sheets during travel in an assembly line. Spectroscopic instrumentation for monitoring applied resin is calibrated by measurements of predetermined resin applications to reference-test-samples, so as to provide a pre-determined relationship enabling monitoring of applied resin, during commercial production of a veneer-wood product using the visible light spectrum and near infrared extending to 2500 nm. Monitoring of selected radiation absorbance by the applied resin is carried out by spectroscopic measurement of non-absorbed electromagnetic radiation, as reflected back by the wood-veneer matrix; selected wavelengths are utilized for determining average resin-weight per designated surface area of a sheet.
    Type: Application
    Filed: July 6, 2005
    Publication date: November 3, 2005
    Applicant: DYNEA Chemicals OY
    Inventors: Reginald Mbachu, Tyler Congleton
  • Patent number: 6946502
    Abstract: The present invention concerns a paint composition which comprises a binder, a coalescent agent and optionally admixtures and auxiliary agents known per se. The film forming agent comprises a glycidyl ether or glycidyl ester or a mixture thereof, the hydrocarbyl residue of the alcohol or carboxylic acid, respectively, of the ether or ester comprising a linear or branched, saturated or unsaturated hydrocarbon having 3 to 20 carbon atoms. The invention further concerns a method of accelerating the hardening of paint compositions and a novel method of preparing glycidyl esters. The film forming agents used in the invention lower the film forming temperature better than conventional reactive film forming agents. Due to low volatility the compounds are suitable for no-VOC applications.
    Type: Grant
    Filed: January 18, 2000
    Date of Patent: September 20, 2005
    Assignee: Dynea Chemicals Oy
    Inventors: Maarit Lahtinen, Kari Rissanen, Salme Koskimies, Karri Airola, Robert Jansson
  • Patent number: 6942826
    Abstract: Method for spectroscopically monitoring resin applied to a planar surface of veneer-wood sheets during travel in an assembly line. Spectroscopic instrumentation for monitoring applied resin is calibrated by measurements of predetermined resin applications to reference-test-samples, so as to provide a pre-determined relationship enabling monitoring of applied resin, during commercial production of a veneer-wood product using the visible light spectrum and near infrared extending to 2500 nm. Monitoring of selected radiation absorbance by the applied resin is carried out by spectroscopic measurement of non-absorbed electromagnetic radiation, as reflected back by the wood-veneer matrix; selected wavelengths are utilized for determining average resin-weight per designated surface area of a sheet.
    Type: Grant
    Filed: March 11, 2004
    Date of Patent: September 13, 2005
    Assignee: DYNEA Chemicals Oy
    Inventors: Reginald A. Mbachu, Tyler G. Congleton
  • Publication number: 20050140037
    Abstract: Calibrating visual (VIS) and near infra red (NIR) spectroscopic instrumentation for quantitative measurement of resin-loading of prepared wood materials, as moving in an assembly-forming line, for subsequent pressing under heat and pressure for manufacture of engineered-composite wood product. Feedback of measured data of resin-loading, during in-line assembly operations, enables maintaining consistent resin-loading and optimizes resin usage. Calibration of VIS/NIR spectroscopic instrumentation can be carried out on equipment simulating in-line movement of pre-established reference-source test-samples; or, can be carried out during on-line movement of wood-material test samples. The developed calibration method removes absorptive effects at wavelengths for constituents other than resin, such as the moisture content of the wood-materials and of the resin, while maintaining accurate and prompt VIS/NIR spectroscopic measurements of resin-loading in a continuous assembly line.
    Type: Application
    Filed: December 13, 2004
    Publication date: June 30, 2005
    Applicant: Dynea Chemicals OY
    Inventors: Reginald Mbachu, Tyler Congleton
  • Publication number: 20050101024
    Abstract: Process for calibration of spectroscopic instrumentation for non-invasive monitoring of resin-loading of furnish-type wood materials, such as particles or fibers for particleboard or medium density fiberboard, respectively. Selection of ranges of wavelengths within a 350 nm to 2500 nm region by providing selection of spectrometers and sensors for wavelength ranges of 350-1000 nm, 1000 to 1800 nm, 1000 to 2500 nm, and 400 to 2200 nm, for use by engineered-wood manufacturing installations. Resin-loaded wood material is exposed to selected VIS/NIR energy and monitored as it moves on-line in relation to calibrated spectroscopic instrumentation; a sensor collects non-absorbed radiation energy reflected by the wood materials. Measurements are processed, in relation to pre-established calibration data, to determine whether the resin-loading is within manufacturing objectives; monitoring and feedback are used to maintain desired specifications.
    Type: Application
    Filed: December 10, 2004
    Publication date: May 12, 2005
    Applicant: Dynea Chemicals OY
    Inventors: Reginald Mbachu, Tyler Congleton
  • Patent number: 6846447
    Abstract: Process for calibration of spectroscopic instrumentation for non-invasive monitoring of resin-loading of furnish-type wood materials, such as particles or fibers for particleboard or medium density fiberboard, respectively. Selection of ranges of wavelengths within a 350 nm to 2500 nm region by providing selection of spectrometers and sensors for wavelength ranges of 350-1000 nm, 1000 to 1800 nm, 1000 to 2500 nm, and 400 to 2200 nm, for use by engineered-wood manufacturing installations. Resin-loaded wood material is exposed to selected VIS/NIR energy and monitored as it moves on-line in relation to calibrated spectroscopic instrumentation; a sensor collects non-absorbed radiation energy reflected by the wood materials. Measurements are processed, in relation to pre-established calibration data, to determine whether the resin-loading is within manufacturing objectives; monitoring and feedback are used to maintain desired specifications.
    Type: Grant
    Filed: January 7, 2003
    Date of Patent: January 25, 2005
    Assignee: Dynea Chemicals Oy
    Inventors: Reginald A. Mbachu, Tyler G. Congleton
  • Patent number: 6846446
    Abstract: Calibrating near infra red (NIR) spectroscopic instrumentation for quantitative measurement of resin-loading of prepared wood materials, as moving in an assembly-forming line, for subsequent pressing under heat and pressure for manufacture of engineered-composite wood product. Feedback of measured data of resin-loading, during in-line assembly operations, enables maintaining consistent resin-loading and optimizes resin usage. Calibration of NIR spectroscopic instrumentation can be carried out on equipment simulating in-line movement of pre-established reference-source test-samples; or, can be carried out during on-line movement of wood-material test samples. The developed calibration method removes absorptive effects at wavelengths for constituents other than resin, such as the moisture content of the wood-materials and of the resin, while maintaining accurate and prompt NIR spectroscopic measurements of resin-loading in a continuous assembly line.
    Type: Grant
    Filed: November 14, 2002
    Date of Patent: January 25, 2005
    Assignee: Dynea Chemical Oy
    Inventors: Reginald A. Mbachu, Tyler G. Congleton
  • Patent number: 6593502
    Abstract: The invention relates to a process for the preparation of polyols having 3 or 4 hydroxyl groups, from an aldehyde and formaldehyde in the presence of water, followed by hydrogenation of the aldolisation product in the presence of a hydrogenation catalyst at an elevated temperature. The aledhyde is obtained by an aldolisation reaction of an aldehyde having at least two &agr;-hydrogen atoms and a formula according to R1CH2CHO, wherein R1 is selected from a group comprising hydrogen, alkyl groups having 1-7 carbon atoms which can have cycloalkyl substituents, cycloalkyl groups, aryl groups and aralkyl groups with 1-7 carbon atoms is the alkyl chain, with formaldehyde in the presence of water in an amount of 20-70 wt %, preferably 40-60 wt % and in the presence of an anion exchange resin. The hydrogenation is preferably carried out in the presence of water.
    Type: Grant
    Filed: January 2, 2002
    Date of Patent: July 15, 2003
    Assignee: Dynea Chemicals Oy
    Inventors: Tapio Salmi, Valentina Serra-Holm, Tiina-Kaisa Rantakylä, Päivi Mäki-Arvela, Lars-Peter Lindfors, Hannu Nousiainen
  • Patent number: 6489392
    Abstract: A foamed resin adhesive and its use for glueing wood based panels and boards such as plywood. The adhesive comprises 40-80% of an aqueous resin solution, 2-10% of an organic filler or fillers, 1-10% of a cationic acrylamide copolymer, and 0.05-1% of a surface active agent.
    Type: Grant
    Filed: September 8, 2000
    Date of Patent: December 3, 2002
    Assignee: Dynea Chemicals Oy
    Inventors: Esa Lappalainen, Niko Musakka
  • Publication number: 20020151754
    Abstract: The invention relates to a process for the preparation of polyols having 3 or 4 hydroxyl groups, from an aldehyde and formaldehyde in the presence of water, followed by hydrogenation of the aldolisation product in the presence of a hydrogenation catalyst at an elevated temperature. The aledhyde is obtained by an aldolisation reaction of an aldehyde having at least two &agr;-hydrogen atoms and a formula according to R1CH2CHO, wherein R1 is selected from a group comprising hydrogen, alkyl groups having 1-7 carbon atoms which can have cycloalkyl substituents, cycloalkyl groups, aryl groups and aralkyl groups with 1-7 carbon atoms is the alkyl chain, with formaldehyde in the presence of water in an amount of 20-70 wt %, preferably 40-60 wt % and in the presence of an anion exchange resin. The hydrogenation is preferably carried out in the presence of water.
    Type: Application
    Filed: January 2, 2002
    Publication date: October 17, 2002
    Applicant: Dynea Chemicals Oy
    Inventors: Tapio Salmi, Valentina Serra-Holm, Tiina-Kaisa Rantakyla, Paivi Maki-Arvela, Lars-Peter Lindfors, Hannu Nousiainen