Patents Assigned to E.B.G. Elektronische Bauelemente Gesellschaft m.b.H.
  • Electrical device having a bonded ceramic-copper heat transfer medium
    Patent number: 5355281
    Abstract: The present invention relates to an electrical device such as a resistor or silicon controlled rectifier that is provided with an improved heat transfer medium for transferring heat from the device to an adjacent structure such as a mounting panel. The improved heat transfer medium includes a bonded series of laminates including a layer of nickel-plated copper sandwiched between two layers of ceramic, such as aluminum oxide.
    Type: Grant
    Filed: June 29, 1993
    Date of Patent: October 11, 1994
    Assignee: E.B.G. Elektronische Bauelemente Gesellschaft m.b.H.
    Inventors: Harald E. Adelmann, Hans P. Peschl