Abstract: The invention relates to a method and apparatus for the regulation of cathode current density in electroplating baths, so that optimum deposition characteristics are obtained. The apparatus includes at least one controllable power supply unit, by means of which the plating current or voltage can be adjusted in accordance with the optimum current density J.sub.O, for the particular electroplating bath involved. The method includes the steps of measuring and adjusting the values of the plating current or voltage of the power supply unit in accordance with values determined from a graph F defined by the function U = F(I)J.sub.O, having the optimum current density J.sub.O as a parameter. The function defines the interdependence between the plating voltage and the current, with the J.sub.O as a parameter.The method facilitates the regulation of cathode current density to optimum deposition conditions, for electroplating articles having unknown and difficult to determine surface areas.