Abstract: The chip LED includes a plurality of semiconductor chips at least one of which is a light-emitting element; a recess formed on the packaging substrate having a rear-side metallic layer on the rear-side thereof, and a metallic layer formed on the bottom surface and inner wall surface of the recess; the light-emitting element being die-bonded to the metallic layer formed on the bottom surface of the recess and being wire-bonded to a wiring pattern deposited on the surface of the packaging substrate; and the metallic layer formed on the bottom surface of the recess being electrically conducted to the rear-side metallic layer formed on the rear side of the packaging substrate.

Abstract: The invention relates to a light emitter, such as an LED sealed with a resin, in particular, an LED wherein irregularities in a surface of a sealing resin can be formed through a simpler process in order to improve the light output efficiency of the LED. The LED is an LED wherein a liquid sealing resin is mixed with a solid transparent resin different from the sealing resin in specific gravity and subsequently the mixture is injected into a package into which an LED chip is integrated and then cured, thereby sealing the chip, characterized in that the solid transparent resin is fixed to the sealing resin to be partially naked to the sealing-resin-side surface of the LED through which light from the LED chip is emitted to the outside, and be partially embedded in the sealing resin, thereby being projected into the form of convexes. This LED is used for an LED displayer, an LCD backlight source, a lighting device or the like.