Patents Assigned to E-Pak Technology, Inc.
  • Patent number: 6644068
    Abstract: A refrigeration system comprises a compressor for increasing a temperature and a pressure of a refrigerant vapor, a condenser fluidly coupled to the compressor for condensing the refrigerant vapor, an expansion device for decreasing the temperature and pressure of a refrigerant liquid, and an evaporator fluidly coupled to the expansion device for evaporating the refrigerant liquid by transferring thermal energy between the refrigerant liquid and a second fluid. The refrigeration system also comprises a heat exchanger having a first flow path fluidly coupled to the compressor and the evaporator and a second flow path fluidly coupled to the condenser and the expansion valve. The heat exchanger is adapted to superheat the refrigerant vapor in the first flow path and subcool the refrigerant liquid in the second flow path by transferring thermal energy between the refrigerant in the first and second flow paths.
    Type: Grant
    Filed: August 27, 2002
    Date of Patent: November 11, 2003
    Assignee: E-Pak Technology, Inc.
    Inventor: Brian E. Guckin
  • Patent number: 6539732
    Abstract: A refrigeration system comprises a compressor for increasing a temperature and a pressure of a refrigerant vapor, a condenser fluidly coupled to the compressor for condensing the refrigerant vapor, an expansion device for decreasing the temperature and pressure of a refrigerant liquid, and an evaporator fluidly coupled to the expansion device for evaporating the refrigerant liquid by transferring thermal energy between the refrigerant liquid and a second fluid. The refrigeration system also comprises a heat exchanger having a first flow path fluidly coupled to the compressor and the evaporator and a second flow path fluidly coupled to the condenser and the expansion valve. The heat exchanger is adapted to superheat the refrigerant vapor in the first flow path and subcool the refrigerant liquid in the second flow path by transferring thermal energy between the refrigerant in the first and second flow paths.
    Type: Grant
    Filed: February 22, 2001
    Date of Patent: April 1, 2003
    Assignee: E-Pak Technology, Inc.
    Inventor: Brian E. Guckin
  • Publication number: 20010025503
    Abstract: A refrigeration system comprises a compressor for increasing a temperature and a pressure of a refrigerant vapor, a condenser fluidly coupled to the compressor for condensing the refrigerant vapor, an expansion device for decreasing the temperature and pressure of a refrigerant liquid, and an evaporator fluidly coupled to the expansion device for evaporating the refrigerant liquid by transferring thermal energy between the refrigerant liquid and a second fluid. The refrigeration system also comprises a heat exchanger having a first flow path fluidly coupled to the compressor and the evaporator and a second flow path fluidly coupled to the condenser and the expansion valve. The heat exchanger is adapted to superheat the refrigerant vapor in the first flow path and subcool the refrigerant liquid in the second flow path by transferring thermal energy between the refrigerant in the first and second flow paths.
    Type: Application
    Filed: February 22, 2001
    Publication date: October 4, 2001
    Applicant: E-Pak Technologies, Inc.
    Inventor: Brian E. Guckin