Abstract: A laser processing device for forming vias has a galvo mirror module, a first lens, a second lens, a focusing module, and a laser source. The laser source emits a laser beam through the first lens and the second lens to convert the laser beam into an incident ring beam. The galvo mirror module reflects the incident ring beam into a reflected ring beam into the focusing module to convert the reflected ring beam into a Bessel-like beam. The galvo mirror module has a scanning direction and shifts a reflection direction of the reflected ring beam to move an end of the reflected ring beam along the scanning direction. The focusing module has a third lens linearly slid along the scanning direction to reduce variations in shape and laser fluence of the Bessel-like beam focused at different positions.

Abstract: A load port adapted for wafer cassettes of different sizes detects storage states of wafers stored in the wafer cassettes. The load port includes a body, a positioning mechanism, a sensing mechanism, and a detecting mechanism. The body has a carrier base. The positioning mechanism is disposed on the body and has a positioning unit disposed on the carrier base, a hooking unit, and a limiting unit. The hooking unit is disposed in the body and has a driving assembly and a hooking element. The driving assembly is disposed in the body. The hooking element is mounted to the driving assembly. The sensing mechanism is disposed on the carrier base. The detecting mechanism is disposed on the body, detects the storage states of wafers stored in the wafer cassette, and has a first detecting assembly and a second detecting assembly spaced apart from each other.

Abstract: A transport mechanism for wafers of different sizes and types includes a carrier device and a manipulator device. The carrier device has a mounting rack, multiple supporting units, and multiple carrier units. The multiple supporting units are mounted on the mounting rack, and each supporting unit has two supporting bases. Each one of the multiple carrier units has two carrier plates. Each one of the two carrier plates has a connecting rod and two positioning rods. The two positioning rods are respectively located on two sides of the connecting rod. The manipulator device has a driving unit and a manipulator unit. The manipulator unit is mounted on the driving unit and has two arms. Each one of the two arms has a connecting socket and two positioning sockets. The two positioning sockets are respectively located beside the connecting socket. The locking element is movably mounted to the arm.

Abstract: A transport mechanism for wafers of different sizes and types includes a carrier device and a manipulator device. The carrier device has a mounting rack, multiple supporting units, and multiple carrier units. The multiple supporting units are mounted on the mounting rack, and each supporting unit has two supporting bases. Each one of the multiple carrier units has two carrier plates. Each one of the two carrier plates has a connecting rod and two positioning rods. The two positioning rods are respectively located on two sides of the connecting rod. The manipulator device has a driving unit and a manipulator unit. The manipulator unit is mounted on the driving unit and has two arms. Each one of the two arms has a connecting socket and two positioning sockets. The two positioning sockets are respectively located beside the connecting socket. The locking element is movably mounted to the arm.

Abstract: A load port adapted for wafer cassettes of different sizes detects storage states of wafers stored in the wafer cassettes. The load port includes a body, a positioning mechanism, a sensing mechanism, and a detecting mechanism. The body has a carrier base. The positioning mechanism is disposed on the body and has a positioning unit disposed on the carrier base, a hooking unit, and a limiting unit. The hooking unit is disposed in the body and has a driving assembly and a hooking element. The driving assembly is disposed in the body. The hooking element is mounted to the driving assembly. The sensing mechanism is disposed on the carrier base. The detecting mechanism is disposed on the body, detects the storage states of wafers stored in the wafer cassette, and has a first detecting assembly and a second detecting assembly spaced apart from each other.