Abstract: Sensor devices and systems can include a silicon substrate comprising a sensor-side and a backside. The backside can include a backside electrode. The sensor-side can include a chemical sensor. The chemical sensor can include a chemical sensor electrode, the chemical sensor electrode can be electrically coupled to the backside electrode by a through-silicon via (TSV), the TSV being physically and electrically connected to the chemical sensor electrode and extending from the chemical sensor electrode through the silicon substrate towards the backside. The TSV can electrically connect the chemical sensor to the backside electrode. A printed circuit board can surround the sensor device and can include a metal contact pad. The metal contact pad can be electrically coupled to the backside electrode by a wire bond. The sensor-side can include a polymeric membrane covering the chemical sensor.

Abstract: Aspects of the embodiments are directed to a microfluidic chip that includes a plurality of openings to expose a microfluidic channel. The plurality of openings are within a recessed area of the microfluidics chip, the recess defining a surface onto which a sensor die can be clamped. The surface can include a clamping bump that contacts a membrane of a solid-state chemical sensor. The surface can also include a glue stop that, in some embodiments, can act as a spacer to prevent over-compression of the sensor die as it is clamped onto the microfluidic chip. The microfluidic chip can include a rigid structure, such as a printed circuit board, that is affixed to a top surface of the microfluidic chip. The rigid structure can include contact pads that are electrically connected to sensor electrodes on the sensor die by a wire.

Abstract: Aspects of the embodiments are directed to a microfluidic chip that includes a plurality of openings to expose a microfluidic channel. The plurality of openings are within a recessed area of the microfluidics chip, the recess defining a surface onto which a sensor die can be clamped. The surface can include a clamping bump that contacts a membrane of a solid-state chemical sensor. The surface can also include a glue stop that, in some embodiments, can act as a spacer to prevent over-compression of the sensor die as it is clamped onto the microfluidic chip. The microfluidic chip can include a rigid structure, such as a printed circuit board, that is affixed to a top surface of the microfluidic chip. The rigid structure can include contact pads that are electrically connected to sensor electrodes on the sensor die by a wire.

Abstract: Sensor devices and systems can include a silicon substrate comprising a sensor-side and a backside. The backside can include a backside electrode. The sensor-side can include a chemical sensor. The chemical sensor can include a chemical sensor electrode, the chemical sensor electrode can be electrically coupled to the backside electrode by a through-silicon via (TSV), the TSV being physically and electrically connected to the chemical sensor electrode and extending from the chemical sensor electrode through the silicon substrate towards the backside. The TSV can electrically connect the chemical sensor to the backside electrode. A printed circuit board can surround the sensor device and can include a metal contact pad. The metal contact pad can be electrically coupled to the backside electrode by a wire bond. The sensor-side can include a polymeric membrane covering the chemical sensor.

Abstract: Aspects of the embodiments are directed to a microfluidic chip that includes a plurality of openings to expose a microfluidic channel. The plurality of openings are within a recessed area of the microfluidics chip, the recess defining a surface onto which a sensor die can be clamped. The surface can include a clamping bump that contacts a membrane of a solid-state chemical sensor. The surface can also include a glue stop that, in some embodiments, can act as a spacer to prevent over-compression of the sensor die as it is clamped onto the microfluidic chip. The microfluidic chip can include a rigid structure, such as a printed circuit board, that is affixed to a top surface of the microfluidic chip. The rigid structure can include contact pads that are electrically connected to sensor electrodes on the sensor die by a wire.

Abstract: Embodiments are directed to a chemical sensor and a method of fabricating a chemical sensor that includes a membrane having full circumferential adhesion. The chemical sensor device includes a silicon substrate comprising a sensor-side and a backside. The sensor-side includes a sensor-side electrode; a first passivation layer disposed on the substrate; and a second passivation layer on the first passivation layer and adjacent to the sensor-side electrode, the passivation layer comprising an adhesion trench exposing a portion of the first passivation layer, and a polyimide ring disposed on the second passivation layer. The backside includes a backside electrode on the backside of the substrate. The substrate includes an electrically isolated doped region, such as a through silicon via, electrically connecting the sensor-side electrode and the backside electrode.