Patents Assigned to E-tec AG
  • Patent number: 6390826
    Abstract: A detachable attachment base for a BGA (Ball Grid Array), CGA (Column Grid Array), LGA (Land Grid Array), or flip-chip type integrated circuit is presented. The base comprises an electrically insulating elastic mat in which a large quantity of fine electrically conductive wires, placed at a short distance from one another, are incorporated. The elastic mat is held between the first electric component and the second electric component. The base also includes means for selectively pressing the second electric component against the electrically insulating elastic mat so as to establish an electric contact between the electric components over the elastic mat.
    Type: Grant
    Filed: April 5, 2000
    Date of Patent: May 21, 2002
    Assignee: E-Tec AG
    Inventors: Hugo Affolter, Christoph Haffter
  • Patent number: 6249440
    Abstract: The contact arrangement is a connector block for detachably fastening an electrical component, particularly an integrated circuit having a plurality of terminal contacts disposed in a ball grid array (BGA), in a column grid array (CGA), in a land grid array (LGA) or of the flip-chip type to a printed circuit board. In a support part, a number of contact pins are disposed in a grid in bores. The contact pins project from the bore on the side facing the printed circuit board and are surface-mounted together with contact areas of the printed circuit board. A free end region of each bore is intended for guiding the substantially dome-shaped terminal contacts. Between the end of a contact pin and a terminal contact there is a space bridged for establishing an electrical connection with a contact element, for example an axially compressible coil spring. By means of several holding-down elements disposed peripherally to the integrated circuit, the integrated circuit is pressed down upon the support part.
    Type: Grant
    Filed: November 25, 1997
    Date of Patent: June 19, 2001
    Assignee: E-TEC AG
    Inventor: Hugo Affolter
  • Patent number: 6190181
    Abstract: Detachable attachment base for a BGA (Ball Grid Array), CGA (Column Grid Array), LGA (Land Grid Array), or flip-chip type integrated circuit and comprising a support (7) traversed by openings (13). A metal pin (3) is inserted in each of the openings (13). One end of each pin is intended to be placed in electrical contact with at least one path (8) of the printed circuit, while the other end is intended to be placed in electrical contact with a connection finger (6) of the electric component mounted (1) or of the other printed circuit. The pins are held longitudinally only loosely within the openings (13), between two springs (4 and 40) permitting the pins to move slightly. The pins may be composed of a rod (3) or of a spring (3′). The springs (4 and 40) may be replaced by a rubber mat containing parallel electric wires. A radiator (35) holds the integrated circuit on the base.
    Type: Grant
    Filed: November 10, 1998
    Date of Patent: February 20, 2001
    Assignee: E-tec AG
    Inventors: Hugo Affolter, Christoph Haffter