Abstract: A method of fabricating multi-layer circuit structure with embedded polymer resistors comprises forming a plurality of electrically conductive paths on a first substrate, forming polymer resistor paste between first and second of the electrically conductive paths on the first substrate, curing the polymer resistor paste by exposure to ultraviolet radiation to thereby solidify the shape of the polymer resistor paste, heating the polymer resistor paste to produce a first resistor, forming a plurality of electrically conductive paths on a second substrate, bonding the first and second substrates with an adhesive, wherein the first resistor is positioned between the first and second substrates.

Abstract: A method of fabricating a polymer resistor in an interconnection via in a printed circuit board includes forming a plurality of first conductive traces on a substrate, forming an interconnection via through one of the first conductive traces in the substrate and terminating at a second conductive trace, filling polymer resistor paste in the interconnection via so as to contact the second conductive trace, thermally treating the polymer resistor paste to produce a polymer resistor, and forming a conductive layer in contact with the resistor and the one first conductive trace.