Abstract: Fiber optic modules having a pull-actuator to unlatch and withdraw (i.e. unplug) it from a cage assembly or a module receptacle. The pull-actuator includes a pull-tab, an arm or push rod, and a catch to couple to a pivot-arm actuator. The pivot-arm actuator pivotally latches to the pull-actuator and to the cage assembly or module receptacle. The pull-actuator makes it easy to de-latch and unplug a fiber optic module. A nose grip is further provided to pull the fiber optic module away from the cage or module receptacle. A belly-to-belly mounting configuration is introduced for the pull-release fiber optic modules.

Abstract: A tunable vertical cavity surface emitting laser (VCSEL) is formed by providing a gap in its laser cavity that can be adjusted to vary the gap distance therein to change the resonance of the cavity and the wavelength of photons that are generated. A pump laser provides a pump source of photons that are coupled into the laser cavity of the vertical cavity surface emitting laser. The vertical cavity surface emitting laser is coupled to a piezo-electric submount to form the gap in the laser cavity. The gap distance is adjusted to tune the vertical cavity surface emitting laser around its center wavelength by applying a voltage (i.e., an electric field) across the piezo-electric submount which causes mechanical stress therein. Alternate embodiments are disclosed including a joined unit of elements to form the tunable vertical cavity surface emitting laser as well as a system of elements to form the tunable vertical cavity surface emitting laser.

Abstract: Fiber optic modules including a bail-latch to disengage and withdraw the fiber optic module from a cage assembly or module receptacle. In one embodiment, the fiber optic modules further include a spring to bias the bail-latch into an engaged position and one or more electro-optic transducers to convert optical signals into electrical signals or electrical signals into optical signals. In another embodiment the fiber optic modules further include an engaging triangle to engage an opening in a latch of the cage assembly which is responsive to the bail-latch. In yet another embodiment, the fiber optic modules include a sliding actuator having a butt surface at one end and at least one ramp at an opposite end, instead of an engaging triangle. A belly-to-belly mounting configuration is introduced for the bail-latch release fiber optic modules.

Abstract: A fiber-optic module having a housing/shielding unit and a module chassis frame having optical, electrical and electro-optical components. The housing/shielding unit functions both as a protective outer housing and an electromagnetic shield. The housing/shielding unit includes forward fingers for a flush mounting in one embodiment and backward fingers for an extended mounting in another embodiment. The fingers can contact a bezel, face-plate or wall of host system to ground the housing/shielding unit to a chassis ground. The module chassis frame may be formed of a conductive material and grounded as well through a host system faceplate or otherwise to the chassis ground. A transmit ground for transmitter components and a receive ground for receiver components are isolated from the chassis ground.

Abstract: A method, apparatus, and system to couple photons between optoelectronic devices and small form factor fiber connectors. An optical block includes refraction surfaces to narrow the distance between two or more light transmission paths through the optical block thereby enabling a module to be coupled to closely spaced fiber optic connectors. In one embodiment, light from a first light path through the optical block is refracted in the direction of a second light path through the optical block. Prior to intersecting the second light path, the light from the first light path is refracted again to provide the first light path closer to, but independent of, the second light path.

Abstract: A W quantum well structure for active region of semiconductor lasers for long wavelength emission of photons. The energy band lineups in the disclosed heterostructures achieve emission at wavelengths of 1.3 &mgr;m or greater. The W quantum well structure and exemplary materials can be applied to any semiconductor laser including a vertical cavity surface emitting laser (VCSEL). The active region is comprised of one or more sets of triad layers of GaAs1−xNx/GaAs1−ySby/GaAs1−xNx to provide the W quantum well structure. The energy band of these materials provides a staggered band alignment which causes electrons and holes to be confined in adjacent layers to one another. Because the wavefunctions associated with these materials tunnel into adjacent layers, optical emission at a longer wavelength is achievable than otherwise available from the energy gaps of the constituent materials alone.

Abstract: Semiconductor lasers having a narrow bandwidth distributed Bragg reflector (DBR). The narrow bandwidth distributed Bragg reflector reflects photons over a narrow wavelength range for amplification within the laser cavity. Photons outside the narrow wavelength range are not reflected back into the laser cavity and are therefore not amplified. The narrow bandwidth distributed Bragg reflector can be formed of semiconductor materials or dielectric materials. The narrow bandwidth distributed Bragg reflector is included as part of folded cavity surface emitting lasers and edge emitting lasers. Photons within the narrow wavelength range of the narrow bandwidth distributed Bragg reflector reflects are of a relatively long wavelength to improve efficiency of communication over fiber optic cables.

Abstract: A fiber-optic module having a housing/shielding unit and a module chassis frame having optical, electrical and electro-optical components. The housing/shielding unit functions both as a protective outer housing and an electromagnetic shield. The housing/shielding unit includes forward fingers and backward fingers. The forward fingers provide an EMI seal around an opening in a bezel, face-plate, backplate, wall, or panel of a host system and thereby can ground the housing/shielding unit to a chassis ground. The backward fingers can contact host tabs of the host system and can also thereby ground the housing/shielding unit to a chassis ground. The module chassis frame may be formed of a conductive material and can be grounded as well through a host system faceplate or otherwise to the chassis ground.

Abstract: Semiconductor lasers are formed by integrating an electrically pumped semiconductor laser, a beam steering element and a vertical cavity surface emitting laser (VCSEL) together. The electrically pumped semiconductor laser is modulated to modulate a pump beam of photons at a first wavelength. The beam steering element directs the pump beam to the VCSEL to provide optical pumping. The VCSEL receives the pump beam of photons at the first wavelength and is stimulated to emit photons of a laser beam at a second wavelength longer than the first. In embodiments, index guiding is provided in the VCSEL to improve the optical pumping and emission efficiencies when the pump beam is modulated at high frequencies. Embodiments of the beam steering element include a silicon bench, a polymer element, and a facet included in the edge emitting laser and an external mirror. Embodiments of index guiding include an air gap to form a mesa and an oxide confinement ring shaped layer.

Abstract: The invention is a method and apparatus for transmitting the light from one or more transmitting arrays of optical devices to one or more receiving arrays of optical devices where each optical device in a transmitting array transmits an initially diverging light beam to a single optical device in a receiving array. Each optical device in a receiving array receives a converging light beam from a single optical device in a transmitting array. The method consists of imaging the optical devices in one or more transmitting arrays on the optical devices in one or more receiving arrays. The light rays from each optical device in a transmitting array are superimposed on the light rays from the other optical devices in the transmitting array while traversing a common volume.

Abstract: An integrated optically pumped vertical cavity surface emitting laser (VCSEL) is formed by integrating an electrically pumped in-plane semiconductor laser and a vertical cavity surface emitting laser together with a beam steering element formed with the in-plane semiconductor laser. The in-plane semiconductor laser can be a number of different types of in-plane lasers including an edge emitting laser, an in-plane surface emitting laser, or a folded cavity surface emitting laser. The in-plane semiconductor laser optically pumps the VCSEL to cause it to lase. The in-plane semiconductor laser is designed to emit photons of relatively short wavelengths while the VCSEL is designed to emit photons of relatively long wavelengths. The in-plane semiconductor laser and the VCSEL can be coupled together in a number of ways including atomic bonding, wafer bonding, metal bonding, epoxy glue or other well know semiconductor bonding techniques. The beam steering element can be an optical grating or a mirrored surface.

Abstract: Modulated integrated optically pumped vertical cavity surface emitting lasers are formed by integrating an electrically pumped semiconductor laser and a vertical cavity surface emitting laser (VCSEL) together with a means of direct modulation of the electrically pumped semiconductor laser. In the preferred embodiments, the electrically pumped semiconductor laser is a type of folded cavity surface emitting laser (FCSEL). In a number of embodiments, the FCSEL is partitioned into two sections by a gap in material layers. In these embodiments, one section of the FCSEL is biased so as to maintain the generation of photons at a constant power level to pump the optically pumped VCSEL while the second section of the FCSEL is used for modulation and causes the optically pumped VCSEL to be modulated above the threshold. In another embodiment, an electric-absorption modulator is sandwiched between an electrically pumped FCSEL and an optically pumped VCSEL.

Abstract: Fiber optic transmitter and receiver electrical elements are implemented on separate vertical boards in fiber optic modules. A single optical block implements lenses and reflecting surfaces to minimize manufacturing costs. In one embodiment the receiver and transmitter are mounted to receive and transmit vertical boards respectively to nearly face each other but being offset to avoid optical cross talk. In a second embodiment, receiver and transmitter are mounted parallel with the printed circuit boards to save additional space. The vertical boards have ground planes to minimize electrical cross talk. A shielded housing provides further shielding for EMI. Manufacturing steps of the fiber optic transceiver are disclosed which provide reduced manufacturing costs.