Abstract: A method and circuit are described for detecting an overvoltage condition and using the detection of the overvoltage condition to protect a circuit or component from the overvoltage condition. In one embodiment, an overvoltage protection circuit is used to detect an overvoltage condition on pin driver electronics, the detection of which is powered by the overvoltage condition itself, thus eliminating the need to provide overvoltage protection circuitry that requires power supplies with voltages greater than the pin electronics the overvoltage protection circuit is meant to protect.

Abstract: An amplifier circuit and method are described for linearizing the gain of a voltage or current feedback amplifier that is non-linear.

Abstract: A test system 100 that can accept a plurality of plug-in electronic cards in Xi Slots 126 or PXI slots 134 is described. The test or source measure switching system 100 includes a sequencer or sequence engine 130 which is fully capable of executing opcode instructions having potentially indefinite completion times and monitoring multiple asynchronous inputs simultaneously without interrupts. The sequencer 130 is sequential and deterministic to approximately 10 microsecond resolution. The sequencer 130 includes a trigger router which can be a fully configurable trigger input and trigger output routing matrix. Every trigger input can be configured via several detection modes such as active high, active low, level high and level low. Also, trigger outputs can be configured to be triggered on single, multiple or auto triggers if set.

Abstract: A thermal interface device (100) includes a base member (102) and a pocket (104) which is filled with a thermally conductive material or medium such as diamond dust suspended in a solvent such as propylene glycol or a thermally conductive material such as thermally conductive rubber. The pocket (104) is hermitically sealed to the base member (102) in order to keep the thermally conductive material within the pocket. The filled pocket (104) forms a deformable “pillow” having a high thermal conductance. The deformable pocket (104) can contour to the shape of a device it is pressed against such as an electronic device undergoing testing.

Abstract: A switch matrix module (600) includes programmable stub breakers (508-512, 514-518) which can break off the bus and isolate unused portion of the switch matrix. Using three-way stub breakers (508-512, 514-518) at the matrix front-ends that can either completely isolate a middle matrix or cut off stubs left or right of the destination and source matrices, allows for the formation of very large matrices which have improved operational performance.

Abstract: An amplifier circuit and method are described for linearizing the gain of a voltage or current feedback amplifier that is non-linear.

Abstract: A test system 100 that can accept a plurality of plug-in electronic cards in Xi Slots 126 or PXI slots 134 is described. The test or source measure switching system 100 includes a sequencer or sequence engine 130 which is fully capable of executing opcode instructions having potentially indefinite completion times and monitoring multiple asynchronous inputs simultaneously without interrupts. The sequencer 130 is sequential and deterministic to approximately ten microsecond resolution.

Abstract: A thermal system (100) includes a main pump (104) which pumps refrigerant to a device under test evaporator cluster (124). A system condenser (130) converts the gaseous refrigerant into liquid and the condenser liquid return is provided to a vapor/liquid separation and storage column (142). The thermal system (100) further includes a sump vaporizer (118) which forms part of a sump discharge line loop.

Abstract: An electronic device burn-in thermal management system includes Burn-in-Boards (BIBs) with quick disconnect connectors to easily connect and disconnect the BIB (102) from liquid cooling lines (104, 106) in a rack that can hold one or more BIBs. The BIB (102) may include liquid cooled heat sinks (408) embedded in the BIB sockets (406) in order to cool the electronic devices undergoing burn-in test (DUT). This arrangement allows the DUT to make positive thermal contact with the heat sink when it is mounted in the BIB socket and allows the user to remove the BIB (102) quickly after completing a test to load the next batch of DUTs onto a separate BIB.

Abstract: An evaporator (102) provides a compact design in which thermal energy can be removed from a DUT (108) in an efficient manner. The evaporator (102) can include a cover (306) which includes both input and output apertures for providing refrigerant into and out of the evaporator (102). An orifice plate (304) is located between the cover (306) and a heat exchanger (302). The heat exchanger (302) includes a plurality of pillars which help increase the surface area of the heat exchanger (302). The orifice plate (304) includes an aperture (310) which forms a nozzle which sprays refrigerant onto the heat exchanger in order to remove the heat away from the heat exchanger (302).