Patents Assigned to Eamax Corporation
  • Patent number: 7943240
    Abstract: In order to obtain actuator elements capable of being displaced such as expansion and contract or bending for practical use even when used as actuator elements with larger size, stacked layers or bundles in which conductive polymer-containing layers or fiber-like tubes are provided with conductive polymer composite structures which include conductive substrates and conductive polymers, said conductive substrates have deformation property, and conductivity of said conductive substrates is not less than 1.0×103 S/cm are used.
    Type: Grant
    Filed: June 2, 2008
    Date of Patent: May 17, 2011
    Assignee: Eamax Corporation
    Inventors: Tetsuji Zama, Susumu Hara, Shingo Sewa
  • Publication number: 20060225994
    Abstract: The present invention provides an electrode forming method in which an electrode layer is formed on a solid electrolyte, capable of obtaining an electrode layer having a large electrode surface area, decreasing the number of steps required in formation of the electrode layer and reducing a human labor and time. The electrode forming method of the invention is an electrode forming method, in which a metal salt solution and a reducing agent solution are disposed on respective both sides of a solid electrolyte form and the metal salt solution is caused to pass through the solid electrolyte form by osmosis to thereby deposit a metal near the interface on the reducing agent solution side of the solid electrolyte form to thereby form the electrode on the solid electrolyte form.
    Type: Application
    Filed: August 25, 2003
    Publication date: October 12, 2006
    Applicant: Eamax Corporation
    Inventors: Kazuo Onishi, Shingo Sewa